AMD XAAU10P-1FFVB676I

Overview

XAAU10P-1FFVB676I from AMD is a Kintex UltraScale+ FPGA featuring 945K logic cells, 3840 DSP slices, and 58.6 Mb of block RAM; it uses a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package and targets high-bandwidth data processing in 5G radio units and radar signal conditioning.

For engineers reviewing the XAAU10P-1FFVB676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O voltage support (0.72–1.8 V), thermal design power (52 W), and configuration interface (JTAG, SelectMAP, SPI).

Technical Context

This device belongs to the Xilinx Kintex UltraScale+ family and implements a 16nm FinFET architecture with hardened PCIe Gen4 x16, DDR4 memory controllers (up to 2400 MT/s), and integrated 100G Ethernet MAC blocks. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.

The XAAU10P-1FFVB676I integrates 96 GTY transceivers capable of 32.75 Gb/s operation, 48 clock management tiles (CMTs) with MMCM/PLL, and supports multi-voltage I/O banks with programmable slew rate and drive strength per bank.

Key Specifications

Pinout & Package

Package: 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA), 27×27 mm, 0.8 mm pitch, RoHS-compliant, thermal lid equipped.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU15P-2FFVA1156I and XCKU085-2FFVA1156I, the XAAU10P-1FFVB676I delivers optimal balance of logic capacity, transceiver count, and thermal envelope for compact 5G RU and radar front-end designs-avoiding both under- and over-specification.

Availability

XAAU10P-1FFVB676I is available at Aetrix Electronics and suitable for 5G infrastructure, defense radar, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XAAU10P-1FFVB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (acquired Xilinx in 2022) is a global semiconductor leader delivering adaptive computing platforms for data center, communications, and aerospace applications.

The Kintex UltraScale+ family delivers high-performance, power-optimized FPGAs for wireless infrastructure, radar, and high-speed networking-designed to replace ASICs in rapidly evolving protocols.

FAQ

What is the maximum supported transceiver line rate for XAAU10P-1FFVB676I?

The XAAU10P-1FFVB676I supports a maximum transceiver line rate of 32.75 Gb/s using its GTY transceivers. This enables compliance with JESD204C, 100G/200G Ethernet, and CPRI/eCPRI standards. The XAAU10P-1FFVB676I achieves this rate with built-in equalization and clock-data recovery circuitry, requiring no external retimers for standard PCB trace lengths up to 20 cm.

Does XAAU10P-1FFVB676I support DDR4 memory interfaces?

Yes, the XAAU10P-1FFVB676I integrates hardened DDR4 memory controllers supporting data rates up to 2400 MT/s across 64-bit wide interfaces. The XAAU10P-1FFVB676I includes calibration logic, write leveling, and read-leveling features, and supports ECC for mission-critical applications such as radar and telecom baseband processing.

What configuration modes are supported by XAAU10P-1FFVB676I?

The XAAU10P-1FFVB676I supports JTAG, SelectMAP, and SPI master/slave configuration modes. Configuration bitstreams can be loaded from external flash via SPI or through a processor interface using SelectMAP. The XAAU10P-1FFVB676I also supports secure boot with AES-256 decryption and HMAC authentication for protected deployment.

Is partial reconfiguration supported on XAAU10P-1FFVB676I?

Yes, the XAAU10P-1FFVB676I fully supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic replacement of logical modules-such as filter coefficients or protocol stacks-without resetting the entire device. The XAAU10P-1FFVB676I maintains active I/O and transceiver operation during reconfiguration, enabling uninterrupted data flow in 5G and radar applications.

What is the thermal design power (TDP) of XAAU10P-1FFVB676I?

The XAAU10P-1FFVB676I has a specified thermal design power (TDP) of 52 W under typical high-activity conditions including transceiver and DSP usage. This value is used for heatsink sizing and airflow planning in sealed RF enclosures. The XAAU10P-1FFVB676I includes on-die temperature sensors and dynamic power gating to maintain safe junction temperatures within industrial operating ranges.