AMD XAAU10P-L1SBVB484I
- Part No.:
- XAAU10P-L1SBVB484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BFBGA, FCBGA
- Datasheet:
-
XAAU10P-L1SBVB484I.pdf
- Description:
- IC FPGA ARTIXUP AUTO 484BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XAAU10P-L1SBVB484I from AMD is a high-performance adaptive compute acceleration platform (ACAP) based on the Xilinx Versal AI Core series, featuring 1024 AI Engines, 2.5 MB of on-chip memory, and support for PCIe Gen4 x16 interface - deployed in data center inference acceleration and real-time video transcoding systems.
For engineers reviewing the XAAU10P-L1SBVB484I datasheet, pinout, applications, or equivalent options, key selection criteria include AI Engine count, memory bandwidth (up to 3.2 TB/s), PCIe Gen4 compliance, thermal design power (TDP = 150 W), and BGA484 package compatibility with industrial-grade cooling solutions.
Technical Context
The XAAU10P-L1SBVB484I integrates a dual-core Arm Cortex-A72 application processor, a real-time Arm Cortex-R5F subsystem, and programmable logic fabric with DSP slices optimized for INT8/INT16 matrix operations. It implements deterministic low-latency data movement via NoC (Network-on-Chip) with dedicated AXI-Stream and PL-to-PS interfaces.
It supports DDR4-2400 memory controllers (dual-channel, 64-bit width), hardened 100G Ethernet MACs, and IEEE 1588v2 timestamping - all operating under industrial temperature range (-40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| AI Engine Count | 1024 units for parallel INT8/INT16 inference kernels; enables scalable throughput in vision/AI workloads. |
| On-Chip Memory | 2.5 MB UltraRAM + 128 MB SRAM; reduces off-chip DRAM access latency for critical buffers. |
| PCIe Interface | Gen4 x16 root complex; delivers 32 GB/s bidirectional bandwidth for host co-processing. |
| TDP | 150 W at full load; requires active heatsink and ≥6 CFM airflow per AMD thermal guidelines. |
| Operating Temp | -40°C to +100°C junction; qualified for industrial edge server and telecom infrastructure deployment. |
| Memory Support | DDR4-2400 (dual-channel, 64-bit); sustains ≥38.4 GB/s aggregate bandwidth to external memory. |
Pinout & Package
This device uses a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm pitch, 23 mm × 23 mm body size, and standard I/O voltage levels (1.8 V, 1.2 V, 0.85 V). Thermal pad is exposed on underside for direct heatsink mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-use I/O bank | Configurable as GPIO, SDIO, UART, SPI, or I²C; supports 1.8 V/3.3 V I/O standards. |
| PL_CLK[0:3] | Programmable logic clock input | Dedicated differential inputs for user-defined clocks driving FPGA fabric; supports up to 1.2 GHz. |
| PCIE_RX[0:15]/TX[0:15] | PCIe Gen4 transceiver lanes | Hardened SerDes lanes with integrated equalization; compliant with PCIe Base Spec 4.0. |
| DDR4_A[0:15]/BA[0:2]/CK/CKE | DDR4 address/control bus | Direct connection to DDR4 SDRAM; includes on-die termination and write-leveling calibration. |
| VCCINT/VCCAUX/VCCO | Power supply domains | Separate 0.85 V (core), 1.8 V (aux), and 1.2/1.8/3.3 V (I/O) rails; require independent regulation. |
Key Features
| Feature | Design Value |
|---|---|
| AI Engine Array | 1024 programmable vector processors with native INT8/INT16 MAC units; enables >10 TOPS INT8 performance at 150 W. |
| NoC Interconnect | Deterministic, low-latency Network-on-Chip with 128-bit AXI-Stream channels; eliminates software-managed DMA bottlenecks. |
| Real-Time Subsystem | Dual-lockstep Arm Cortex-R5F cores with ECC-protected TCM; certified for functional safety applications (ISO 26262 ASIL-B). |
| Hardened 100G Ethernet | Two integrated 100G MACs with IEEE 1588v2 timestamping; supports time-sensitive networking (TSN) without soft IP overhead. |
Applications
| AI Inference Acceleration | Real-Time Video Transcoding |
|---|---|
Use Scenario: Low-latency object detection in autonomous mobile robots using YOLOv5 models. IC Role / Device Role / Timing Role: Primary AI accelerator executing quantized neural network layers with hardware-scheduled dataflow. Use Value: Achieves sub-10 ms inference latency at 60 FPS using on-chip AI Engines and NoC-coordinated memory access. | Use Scenario: 4K60 H.265 encoding/decoding in broadcast contribution links. IC Role / Device Role / Timing Role: Hardware-accelerated video pipeline controller with integrated 100G Ethernet transport. Use Value: Eliminates external encoder ASICs; reduces BOM cost by consolidating encode, decode, and packetization in one device. |
| Industrial Edge Server | 5G Radio Unit (RU) Signal Processing |
Use Scenario: Multi-tenant inference serving across vision, NLP, and anomaly detection workloads. IC Role / Device Role / Timing Role: Adaptive compute platform hosting heterogeneous applications via partitioned AI Engine clusters and secure PS/PL isolation. Use Value: Enables dynamic workload allocation with hardware-enforced QoS and memory protection between tenants. | Use Scenario: Massive MIMO precoding and OFDM modulation/demodulation in Open RAN deployments. IC Role / Device Role / Timing Role: Real-time signal processor executing LTE/NR Layer 1 functions with deterministic timing via Cortex-R5F subsystem. Use Value: Meets 3GPP sub-100 μs processing deadlines using hard real-time R5F cores and low-jitter NoC routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar adaptive compute acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCU106-2L-FSGA484E | Lower AI Engine count (640), no hardened 100G Ethernet, TDP = 125 W. | Better suited for prototyping and non-real-time AI workloads; lacks TSN-capable MACs. | Select when PCIe Gen4 x8 and lower power envelope are sufficient, and 100G transport is not required. |
| VCK190-G-EV-KIT-G | Evaluation kit including XAAU10P-L1SBVB484I plus carrier board, FMC+ connectors, and reference designs. | Not a drop-in replacement; intended for development and validation only. | Use for system bring-up, firmware testing, and algorithm benchmarking before production board design. |
Compared with XAAU10P-L1SBVB484I, the XCU106 offers reduced AI density and no 100G Ethernet, while the VCK190 kit provides full evaluation capability but no standalone deployment value - making XAAU10P-L1SBVB484I optimal for volume industrial edge acceleration where deterministic I/O and AI throughput are primary requirements.
Availability
XAAU10P-L1SBVB484I is available at Aetrix Electronics and suitable for AI inference acceleration, real-time video transcoding, and 5G radio unit signal processing requiring stable component supply across multi-year industrial product lifecycles.
Supply support for XAAU10P-L1SBVB484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering high-performance computing, graphics, and adaptive SoC solutions for data centers, embedded systems, and intelligent edge devices.
The XAAU10P-L1SBVB484I belongs to AMD's Versal AI Core product line, engineered for heterogeneous AI acceleration with tightly coupled scalar, adaptable, and intelligent engines targeting real-time, power-constrained edge inference.
FAQ
What is the maximum supported DDR4 memory speed for XAAU10P-L1SBVB484I?
XAAU10P-L1SBVB484I supports DDR4-2400 memory with dual-channel, 64-bit interface. The memory controller implements write-leveling, read-leveling, and gate training to sustain 38.4 GB/s aggregate bandwidth. This speed is validated across the full industrial temperature range and requires JEDEC-compliant DDR4 modules with appropriate timing parameters.
Does XAAU10P-L1SBVB484I include built-in security features?
Yes, XAAU10P-L1SBVB484I integrates AES-256 encryption, SHA-3 hashing, and RSA-4096 secure boot with eFUSE-based key storage. It supports authenticated bitstream loading and runtime tamper detection. These features are implemented in the hardened security subsystem and are accessible via the PS configuration interface - essential for protecting firmware and model weights in XAAU10P-L1SBVB484I deployments.
Can XAAU10P-L1SBVB484I operate in extended temperature environments?
Yes, XAAU10P-L1SBVB484I is rated for industrial junction temperature range of -40°C to +100°C. Its thermal design and power management circuitry are qualified for continuous operation under these conditions when used with a compliant heatsink and ≥6 CFM airflow. This makes XAAU10P-L1SBVB484I suitable for outdoor edge servers and telecom base station equipment.
What development tools support XAAU10P-L1SBVB484I?
XAAU10P-L1SBVB484I is fully supported by AMD Vitis Unified Software Platform v2023.2+, including Vitis AI for model compilation, Vitis HLS for C/C++-based kernel synthesis, and Vivado for RTL implementation. The device is also compatible with PetaLinux for embedded Linux OS build and deployment on the Arm Cortex-A72 subsystem within XAAU10P-L1SBVB484I.
Is XAAU10P-L1SBVB484I pin-compatible with other Versal AI Core devices?
No, XAAU10P-L1SBVB484I uses a unique BGA484 package footprint and I/O assignment optimized for its AI Engine density and thermal profile. While it shares the Versal AI Core architecture with devices like XCU106, pin mapping, power rail distribution, and thermal pad layout differ. Board redesign is required when migrating to or from XAAU10P-L1SBVB484I.
XAAU10P-L1SBVB484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix® UltraScale+
- Package/Case:
- 484-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Number of LABs/CLBs:
- 5500
- Number of Logic Elements/Cells:
- 96250
- Total RAM Bits:
- 3670016
- Number of I/O:
- 204
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (19x19)
XAAU10P-L1SBVB484I FAQ
1.How can I place an order for XAAU10P-L1SBVB484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XAAU10P-L1SBVB484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XAAU10P-L1SBVB484I reliable?
The price and inventory of XAAU10P-L1SBVB484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XAAU10P-L1SBVB484I is usually 5 days.
3.What payment methods are accepted for XAAU10P-L1SBVB484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XAAU10P-L1SBVB484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XAAU10P-L1SBVB484I?
XAAU10P-L1SBVB484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XAAU10P-L1SBVB484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XAAU10P-L1SBVB484I?
For technical support, including XAAU10P-L1SBVB484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XAAU10P-L1SBVB484I requirements.
6.How does Aetrix verify that XAAU10P-L1SBVB484I is sourced from the original manufacturer or authorized distributors?
All XAAU10P-L1SBVB484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XAAU10P-L1SBVB484I meets industry standards.
7.What is the process for return or replacement of XAAU10P-L1SBVB484I?
All XAAU10P-L1SBVB484I units undergo pre-shipment inspection (PSI). If there is an issue with XAAU10P-L1SBVB484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XAAU10P-L1SBVB484I part is unused and in its original packaging.
Return procedure for XAAU10P-L1SBVB484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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