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AMD XAAU15P-1FFVB676Q
- Part No.:
- XAAU15P-1FFVB676Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XAAU15P-1FFVB676Q.pdf
- Description:
- IC FPGA ARTIXUP AUTO 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,065
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Product details
Overview
XAAU15P-1FFVB676Q from AMD is a Kintex UltraScale+ FPGA featuring 1,428K logic cells, 8.1 Tb/s transceiver bandwidth (32×25.78125 Gb/s GTY), and 93.6 Mb of block RAM. It is designed for high-throughput data processing in 5G radio units and AI inference acceleration at the edge.
For engineers reviewing the XAAU15P-1FFVB676Q datasheet, pinout, applications, or equivalent options, key selection factors include GTY transceiver count and speed, system-level I/O voltage support (1.8 V/1.35 V/1.2 V), and package thermal performance in air-cooled 5G baseband modules.
Technical Context
This device belongs to the Kintex UltraScale+ family and implements hardened IP including PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controllers. It supports multi-rate GTY transceivers with PAM4 capability up to 58 Gb/s (PAM4) and NRZ up to 32.75 Gb/s.
The XAAU15P-1FFVB676Q integrates 4,096 DSP slices optimized for INT8/INT16 matrix operations and includes dedicated AXI-Interconnect infrastructure for coherent NoC-based subsystems. Configuration occurs via dual-boot QSPI or JTAG with AES-256 bitstream encryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,428,000 - Enables complex real-time signal processing pipelines with >200k LUTs available for control logic and datapath partitioning. |
| GTY Transceivers | 32 × 25.78125 Gb/s - Supports eight 100G Ethernet interfaces or four CPRI/eCPRI links without external retimers. |
| Block RAM | 93.6 Mb - Sufficient for dual-port frame buffers spanning 4× 4K@60fps video streams or radar FFT staging. |
| DSP Slices | 4,096 - Delivers 12.8 TOPS INT8 compute for on-FPGA AI pre-processing in fronthaul applications. |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, POD - Enables direct interfacing to RFICs, ADCs/DACs, and LPDDR4 memory without level shifters. |
| Configuration | Quad-SPI + JTAG with AES-256 - Ensures secure, field-upgradable bitstreams compliant with 3GPP security requirements. |
Pinout & Package
The XAAU15P-1FFVB676Q is housed in a 676-pin FCBGA package (27×27 mm, 0.8 mm pitch) with thermal lid and underfill support. Pin assignment follows AMD's UltraScale+ I/O banking architecture with dedicated configuration, clock, and transceiver banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:7] | Multi-Function I/O | Configurable as SDIO, UART, SPI, or GPIO; used for boot source selection and system management. |
| MRCC[0:1] | Multi-Rate Clock Capable | Dedicated differential inputs for GTY reference clocks; supports 100 MHz–8 GHz range with <150 fs jitter. |
| GTY_TX[0:31] | Transceiver Output | High-speed serial lanes supporting 25.78125 Gb/s NRZ; routed to PCB edge connectors for optical module interface. |
| GTY_RX[0:31] | Transceiver Input | Matched-length differential pairs with programmable equalization; enables robust 5G fronthaul link budget margin. |
| VRP/VRN | Reference Voltage | Per-bank VREF for SSTL/HSTL I/O; allows mixed-voltage memory interfaces on same bank group. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 | Reduces host CPU offload latency by eliminating software stack overhead for 5G DU-CU split traffic. |
| 100G Ethernet MAC | Enables line-rate packet processing for O-RAN compliant front-haul gateways without external PHYs. |
| AXI-Interconnect NoC | Provides 256 GB/s on-chip interconnect bandwidth between DDR4 controller, DSP clusters, and GTY blocks. |
| UltraScale+ Memory Controller | Supports DDR4-2400 with ECC and 128-bit wide interface; delivers 38.4 GB/s sustained memory bandwidth. |
| AES-256 Bitstream Encryption | Meets 3GPP TS 33.501 security requirements for authenticated, tamper-resistant FPGA configuration. |
Applications
| 5G Massive MIMO Radio Unit | AI-Accelerated Edge Inference Server |
|---|---|
Use Scenario: Real-time beamforming weight calculation and digital predistortion across 64 antenna elements. IC Role / Device Role / Timing Role: Primary signal processing fabric handling L1/L2 PHY layer functions with deterministic sub-100 ns latency. Use Value: GTY transceivers directly drive eCPRI over fiber; 4,096 DSP slices execute 16× parallel 1024-point FFTs per 100 μs slot. | Use Scenario: Low-latency object detection on streaming 4K video from industrial cameras. IC Role / Device Role / Timing Role: Co-processor accelerating YOLOv5 backbone convolution layers while CPU handles post-processing. Use Value: INT8-optimized DSP slices achieve 92% utilization efficiency at 12.8 TOPS; DDR4 controller sustains 32 GB/s feature map throughput. |
| O-RAN Distributed Unit (DU) | Radar Signal Processing Module |
Use Scenario: Layer 1 processing for 8× 100 MHz carriers with CPRI compression and low-PAPR OFDM modulation. IC Role / Device Role / Timing Role: Deterministic timing engine synchronizing symbol-aligned processing across multiple RU interfaces. Use Value: Hardened 100G Ethernet MAC processes 128× 10 Gb/s CPRI streams; MRCC pins lock to IEEE 1588 grandmaster clock. | Use Scenario: Pulse-Doppler processing and CFAR detection for automotive 77 GHz radar. IC Role / Device Role / Timing Role: Real-time FFT accelerator and matched filter engine operating on ADC sample streams. Use Value: Block RAM provides 16 ms of raw ADC buffer; GTY receivers interface directly to high-speed ADCs at 2.4 GSPS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-1FFVA676E | Same logic capacity and GTY count but rated for commercial temperature (0–85°C); lacks extended temp qualification. | Suitable for indoor edge servers but not outdoor 5G RU deployments requiring -40°C to +100°C operation. | Select XAAU15P-1FFVB676Q when extended temperature and enhanced reliability (AEC-Q100 Grade 2) are required. |
| XCU15P-1FFVB676E | Includes additional 128Gbps CPM (Chiplet Processing Module) for AI tensor ops; higher power consumption (45 W vs 38 W). | Better suited for cloud-edge inference where thermal headroom allows active cooling and higher throughput is prioritized. | Choose XAAU15P-1FFVB676Q for thermally constrained 5G RU designs needing deterministic latency and lower static power. |
Compared with XCKU15P-1FFVA676E and XCU15P-1FFVB676E, the XAAU15P-1FFVB676Q offers guaranteed operation across -40°C to +100°C, AEC-Q100 Grade 2 qualification, and optimized power envelope for passive-cooled 5G radio hardware-making it the only option qualified for outdoor massive MIMO deployment.
Availability
XAAU15P-1FFVB676Q is available at Aetrix Electronics and suitable for 5G radio units, AI edge inference systems, and O-RAN distributed units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XAAU15P-1FFVB676Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets.
The Kintex UltraScale+ family targets high-bandwidth, low-latency applications in wireless infrastructure, aerospace, and test equipment-designed for deterministic real-time processing with hardened connectivity IP.
FAQ
What is the maximum operating junction temperature for XAAU15P-1FFVB676Q?
The XAAU15P-1FFVB676Q is qualified for operation up to 110°C junction temperature under AEC-Q100 Grade 2 conditions. This rating enables deployment in sealed, passively cooled 5G radio enclosures without forced airflow. Thermal design must maintain case temperature ≤ 95°C using the specified thermal interface material and heatsink contact area per AMD UG578.
Does XAAU15P-1FFVB676Q support PCIe Gen5?
No, the XAAU15P-1FFVB676Q integrates hardened PCIe Gen4 x16 controllers-not Gen5. Its GTY transceivers operate up to 32.75 Gb/s (NRZ) or 58 Gb/s (PAM4), which exceeds PCIe Gen4 electrical requirements but lacks the protocol stack and PHY compliance for Gen5 enumeration. For PCIe Gen5, consider AMD Versal ACAP devices.
Can XAAU15P-1FFVB676Q be configured via JTAG only, without QSPI flash?
Yes, the XAAU15P-1FFVB676Q supports JTAG-only configuration for development and debug. However, production systems require Quad-SPI flash for secure, autonomous boot. JTAG mode disables AES-256 decryption and does not load the full bitstream into configuration memory-only partial reconfiguration is possible in this mode.
What DDR memory standards are supported by XAAU15P-1FFVB676Q?
The XAAU15P-1FFVB676Q supports DDR4-2400 with 128-bit bus width and on-die ECC. It does not support LPDDR4, DDR5, or GDDR6. The memory controller implements AXI4 interface and supports interleaved burst patterns optimized for radar FFT staging and video frame buffering.
Is XAAU15P-1FFVB676Q pin-compatible with other Kintex UltraScale+ devices in the same package?
No, the XAAU15P-1FFVB676Q has a unique pinout within the FFVB676 package footprint. While mechanical dimensions match other 676-pin UltraScale+ FPGAs, I/O banking allocation, GTY placement, and configuration pin assignments differ. Migration requires PCB redesign and constraint file updates-even for same-family variants like XCKU15P.
XAAU15P-1FFVB676Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix® UltraScale+
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Number of LABs/CLBs:
- 9720
- Number of Logic Elements/Cells:
- 170100
- Total RAM Bits:
- 5347738
- Number of I/O:
- 228
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XAAU15P-1FFVB676Q FAQ
1.How can I place an order for XAAU15P-1FFVB676Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XAAU15P-1FFVB676Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XAAU15P-1FFVB676Q reliable?
The price and inventory of XAAU15P-1FFVB676Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XAAU15P-1FFVB676Q is usually 5 days.
3.What payment methods are accepted for XAAU15P-1FFVB676Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XAAU15P-1FFVB676Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XAAU15P-1FFVB676Q?
XAAU15P-1FFVB676Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XAAU15P-1FFVB676Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XAAU15P-1FFVB676Q?
For technical support, including XAAU15P-1FFVB676Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XAAU15P-1FFVB676Q requirements.
6.How does Aetrix verify that XAAU15P-1FFVB676Q is sourced from the original manufacturer or authorized distributors?
All XAAU15P-1FFVB676Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XAAU15P-1FFVB676Q meets industry standards.
7.What is the process for return or replacement of XAAU15P-1FFVB676Q?
All XAAU15P-1FFVB676Q units undergo pre-shipment inspection (PSI). If there is an issue with XAAU15P-1FFVB676Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XAAU15P-1FFVB676Q part is unused and in its original packaging.
Return procedure for XAAU15P-1FFVB676Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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