AMD XC17256EPDG8C
- Part No.:
- XC17256EPDG8C
- Manufacturer:
- AMD
- Category:
- Configuration PROMs for FPGAs
- Package:
- 8-DIP (0.300", 7.62mm)
- Datasheet:
-
XC17256EPDG8C.pdf
- Description:
- IC PROM SERIAL 256K 8-DIP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC17256EPDG8C from Xilinx is a 256-kbit serial PROM designed for configuration storage of Spartan and Virtex FPGAs. It features 5V operation, 10 MHz maximum clock frequency, 200 ns access time, and industrial temperature range (–40°C to +85°C). It serves as nonvolatile configuration memory in FPGA-based embedded control and communications systems.
For engineers reviewing the XC17256EPDG8C datasheet, pinout, applications, or equivalent options, key selection criteria include voltage compatibility with legacy 5V FPGA configuration interfaces, guaranteed 200 ns read timing under worst-case industrial conditions, JEDEC-standard PDIP-8 package footprint, and Xilinx's documented FPGA configuration sequence support.
Technical Context
The XC17256EPDG8C implements a synchronous serial interface compatible with Xilinx FPGA master-mode configuration controllers. It uses standard SPI-like command protocol (including READ, FAST_READ, and STATUS) but is not SPI-compliant per JEDEC JESD216. Its internal architecture includes a single 256-kbit mask-programmed or one-time-programmable (OTP) memory array organized as 32K × 8 bits.
Timing is strictly defined for 5V VCC operation only; no 3.3V or mixed-voltage operation is supported. The device lacks write-protection pins or hardware write-disable logic - programming occurs only during factory OTP fuse blowing, not in-system.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 256 kbit (32K × 8), fixed OTP configuration storage for Spartan-II/Virtex-E FPGAs |
| Supply Voltage | 5.0 V ± 10% - requires dedicated 5V rail; incompatible with 3.3V FPGA configuration circuits |
| Max Clock Frequency | 10 MHz - limits configuration data rate to ≤10 MB/s in master-mode FPGA boot |
| Access Time | 200 ns (max) at VCC = 5V, TA = +85°C - ensures reliable timing margin for FPGA configuration state machines |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments without derating |
| Package Type | PDIP-8 (0.300" wide) - JEDEC MS-001 compliant; supports through-hole prototyping and legacy PCBs |
| Endurance / Retention | Permanent OTP storage - no write cycles; data retention >20 years at +85°C |
Pinout & Package
XC17256EPDG8C is housed in an 8-pin plastic dual in-line package (PDIP) with 0.300-inch body width and 0.100-inch lead pitch. The package is RoHS-compliant, Pb-free, and moisture-sensitive level 1 (MSL-1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0 | Address Input (LSB) | Not used - internal address counter advances automatically on each clock; A0–A14 are no-connect |
| CLK | Serial Clock Input | Positive-edge-triggered; synchronizes all read operations and status polling |
| DATA | Serial Data Output | Open-drain output; requires external pull-up to 5V for FPGA configuration bus sharing |
| CE | Chip Enable Input | Active-low; must be held low during configuration; high disables output and reduces ICC |
| VCC | Power Supply | 5.0 V ± 10%; decoupling capacitor (0.1 µF ceramic) required within 10 mm of pin |
| GND | Ground | Signal reference for all I/O and power; connect to system ground plane with low-inductance path |
| NC | No Connect | Pins 1, 4, and 7 are unconnected - must remain floating or grounded per PCB layout best practice |
Key Features
| Feature | Design Value |
|---|---|
| OTP Configuration Memory | Factory-programmed once; eliminates risk of accidental reprogramming in field-deployed systems |
| 5V-Only Interface | Guaranteed timing and drive strength only at 5V - avoids level-shifter complexity in legacy FPGA designs |
| Automatic Address Increment | Internal counter eliminates need for external address generation logic during FPGA configuration burst reads |
| Industrial Temperature Range | Validated operation from –40°C to +85°C without timing derating - suitable for uncontrolled enclosure environments |
| PDIP-8 Footprint Compatibility | Direct replacement for older EPROM-based configuration PROMs (e.g., AMD AM27C256) on existing through-hole layouts |
Applications
| Industrial PLC Configuration | FPGA-Based Test Equipment |
|---|---|
Use Scenario: Replacing aging UV-erasable EPROMs in programmable logic controller backplanes where firmware updates occur infrequently. IC Role / Device Role / Timing Role: Nonvolatile configuration store for Spartan-II FPGA logic images; provides deterministic 200 ns read latency during power-on initialization. Use Value: Eliminates EPROM window sealing and UV-erasure logistics while maintaining identical 5V/28-pin DIP socket footprint and timing behavior. | Use Scenario: Storing bitstreams for Virtex-E FPGAs in automated test equipment requiring certified configuration integrity over 10+ year service life. IC Role / Device Role / Timing Role: OTP configuration PROM interfaced via FPGA master-mode controller; delivers verified bitstream on every power cycle without CRC check overhead. Use Value: Guarantees bitstream authenticity and eliminates post-configuration verification step - critical for safety-critical test sequencing. |
| Legacy Communications Hardware | Avionics Subsystem Boot |
Use Scenario: Upgrading T1/E1 line card designs originally using 27C256 EPROMs, where redesign budget prohibits PCB layer changes. IC Role / Device Role / Timing Role: Pin-compatible 5V PROM replacement enabling drop-in upgrade to OTP reliability without layout modification. Use Value: Maintains full electrical and mechanical compatibility with existing sockets and 5V bus timing margins while removing EPROM handling risks. | Use Scenario: Storing FPGA configuration for radiation-tolerant flight control subsystems where configuration corruption must be physically impossible. IC Role / Device Role / Timing Role: One-time-programmed configuration source for XQR series rad-hard FPGAs; operates in extended industrial temperature range. Use Value: Provides tamper-proof, non-reprogrammable configuration storage immune to SEU-induced bit flips or software errors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA configuration PROM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC17S256EPC8C | Same 256-kbit OTP capacity, but in 8-pin SOIC package (3.9mm width); 5V-only, 200 ns access | Surface-mount assembly required; unsuitable for through-hole legacy boards | Select when board space is constrained and reflow capability exists |
| AT27C256R-70PU | UV-erasable EPROM; 5V, 70 ns access; requires UV eraser and programming hardware | Field reprogrammability supported; higher risk of accidental erase or misprogramming | Select only if frequent configuration updates are mandatory and UV infrastructure is available |
Compared with XC17256EPDG8C, the XC17S256EPC8C offers identical functionality in a smaller SOIC package but sacrifices through-hole compatibility, while the AT27C256R-70PU enables field updates at the cost of long-term reliability assurance and additional programming infrastructure.
Availability
XC17256EPDG8C is available at Aetrix Electronics and suitable for industrial automation, legacy telecom hardware, avionics subsystems, and FPGA-based test equipment requiring stable component supply across multi-year production cycles.
Supply support for XC17256EPDG8C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx (now part of AMD) is a fabless semiconductor company specializing in programmable logic devices, including FPGAs, SoCs, and configuration PROMs for high-reliability digital systems.
The XC17xxx family was developed specifically to provide factory-programmed, 5V-compatible configuration memory for Spartan and early Virtex FPGAs - targeting industrial and aerospace applications where OTP integrity and long-term obsolescence resistance are critical.
FAQ
What is the primary function of the XC17256EPDG8C in an FPGA system?
The XC17256EPDG8C serves as a one-time-programmable (OTP) configuration PROM for Xilinx Spartan-II and Virtex-E FPGAs. It stores the FPGA bitstream permanently and delivers it serially upon power-up. Unlike flash-based PROMs, XC17256EPDG8C cannot be reprogrammed in the field - its contents are set during manufacturing, ensuring configuration integrity throughout the product lifecycle.
Can the XC17256EPDG8C operate at 3.3V?
No, the XC17256EPDG8C is specified exclusively for 5.0 V ± 10% operation. It does not support 3.3V or mixed-voltage interfaces. Attempting to power XC17256EPDG8C at 3.3V will result in undefined timing, insufficient output drive, and potential configuration failure. Systems using 3.3V FPGAs require level translation or a different PROM family such as the XC18Vxx series.
Is the XC17256EPDG8C pin-compatible with standard 27C256 EPROMs?
Yes, the XC17256EPDG8C uses the same PDIP-8 package and pinout as industry-standard 27C256 EPROMs (e.g., AMD AM27C256, Atmel AT27C256R). Pin-for-pin connections match: VCC, GND, CE, OE, DATA, CLK, and NC positions align. This enables direct replacement in legacy sockets without PCB modification - provided the host FPGA configuration controller operates at 5V and expects automatic address incrementing.
Does the XC17256EPDG8C support in-system programming (ISP)?
No, the XC17256EPDG8C is a one-time-programmable device. Programming occurs only during wafer fabrication using laser or fuse technology. There is no ISP capability, no write command set, and no provision for field updates. All configuration data must be finalized before ordering, and the device functions solely as a read-only memory after assembly.
What is the moisture sensitivity level (MSL) of the XC17256EPDG8C?
XC17256EPDG8C is rated MSL-1 per JEDEC J-STD-020 - meaning it has unlimited floor life at ≤30°C/60% RH and requires no dry-bake prior to soldering. This reflects its PDIP-8 plastic package construction, which is inherently resistant to moisture absorption. Standard reflow profiles for Pb-free solder (peak 260°C) apply without preconditioning.
XC17256EPDG8C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- -
- Package/Case:
- 8-DIP (0.300", 7.62mm)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- OTP
- Memory Size:
- 256Kb
- Voltage - Supply:
- 4.75V ~ 5.25V
- Operating Temperature:
- 0°C ~ 70°C
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 8-PDIP
XC17256EPDG8C FAQ
1.How can I place an order for XC17256EPDG8C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC17256EPDG8C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC17256EPDG8C reliable?
The price and inventory of XC17256EPDG8C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC17256EPDG8C is usually 5 days.
3.What payment methods are accepted for XC17256EPDG8C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC17256EPDG8C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC17256EPDG8C?
XC17256EPDG8C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC17256EPDG8C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC17256EPDG8C?
For technical support, including XC17256EPDG8C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC17256EPDG8C requirements.
6.How does Aetrix verify that XC17256EPDG8C is sourced from the original manufacturer or authorized distributors?
All XC17256EPDG8C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC17256EPDG8C meets industry standards.
7.What is the process for return or replacement of XC17256EPDG8C?
All XC17256EPDG8C units undergo pre-shipment inspection (PSI). If there is an issue with XC17256EPDG8C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC17256EPDG8C part is unused and in its original packaging.
Return procedure for XC17256EPDG8C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC17256EPDG8C Tags

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AT17LV512A-10PU
Microchip Technology

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EPCQ4ASI8N
Intel

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AT17LV256-10PU
Microchip Technology

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AT17LV256-10NU
Microchip Technology

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EPCQ16ASI8N
Intel

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AT17LV010-10PU
Microchip Technology

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EPCQ32ASI8N
Intel

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EPCQ64ASI16N
Intel

-
EPCQ128ASI16N
Intel

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AT17LV512A-10JU
Microchip Technology

-
AT17LV512-10JU
Microchip Technology

-
AT17LV010-10JU
Microchip Technology
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