AMD XC1765EPDG8C

Overview

XC1765EPDG8C from AMD is a 65-pin, 3.3V CMOS PROM configured for Xilinx FPGA configuration memory, supporting serial mode with 64 Kbit capacity and industrial temperature range (–40°C to +85°C); used in embedded FPGA-based control systems requiring nonvolatile bitstream storage.

For engineers reviewing the XC1765EPDG8C datasheet, pinout, applications, or equivalent options, key selection criteria include serial interface compatibility, 3.3V VCC tolerance, industrial-grade temperature operation, and PDIP-65 package footprint constraints.

Technical Context

This device implements a one-time-programmable (OTP) parallel/serial PROM architecture optimized for Xilinx 4000-series FPGA configuration. It features a dedicated CE# (chip enable), OE# (output enable), and WE# (write enable) control logic with active-low timing, and supports both master serial and slave serial configuration modes.

The XC1765EPDG8C uses standard CMOS process technology, delivers 10 µA standby current at 3.3V, and guarantees 10-year data retention under industrial temperature conditions without battery backup or refresh circuitry.

Key Specifications

Pinout & Package

XC1765EPDG8C is housed in a 65-pin plastic dual in-line package (PDIP-65) with 0.8-inch width and 0.1-inch pin pitch, designed for through-hole mounting and legacy PCB compatibility.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA configuration memory applications.

Compared with XCF04SVO20C and XC17S100EPC8C, the XC1765EPDG8C offers guaranteed OTP security and fixed 25 ns timing at lower cost, but lacks reprogrammability and requires strict adherence to its 64 Kbit capacity limit in existing layouts.

Availability

XC1765EPDG8C is available at Aetrix Electronics and suitable for industrial PLCs, FPGA-based motor drives, and telecom line cards requiring stable component supply over extended production lifecycles.

Supply support for XC1765EPDG8C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (Advanced Micro Devices) is a U.S.-based semiconductor company specializing in high-performance computing, adaptive SoCs, and programmable logic solutions.

The XC17xxx series was developed by AMD specifically for reliable, low-cost, nonvolatile FPGA configuration in industrial and telecom infrastructure applications prior to Xilinx acquisition.

FAQ

What is the programming method supported by XC1765EPDG8C?

The XC1765EPDG8C uses one-time programmable (OTP) technology and requires a standard parallel PROM programmer with 3.3V VPP programming voltage. Once programmed, the device cannot be erased or rewritten-this ensures configuration integrity and protects FPGA bitstream IP. Programming occurs before soldering, and the XC1765EPDG8C does not support in-system programming or field updates.

Does XC1765EPDG8C support both serial and parallel configuration modes?

Yes, the XC1765EPDG8C supports both serial and parallel configuration modes. In serial mode, it interfaces directly with Xilinx FPGA CCLK and DIN pins using only D0 as data output. In parallel mode, it uses full A0–A12 and D0–D7 buses for faster read access. Mode selection is determined by FPGA configuration controller setup-not by hardware strapping on the XC1765EPDG8C itself.

What is the maximum access time specification for XC1765EPDG8C?

The maximum access time for XC1765EPDG8C is 25 ns at 3.3V and +85°C, measured from CE# and OE# assertion to valid data on D0–D7. This timing meets the tCONFIG requirement of Xilinx XC4000E and XC4000XL FPGAs, enabling deterministic boot-up without additional wait-state insertion in the configuration controller logic.

Is XC1765EPDG8C compatible with modern 3.3V FPGA I/O standards?

Yes, XC1765EPDG8C operates exclusively at 3.3V with TTL-compatible output levels and meets VIH/VIL thresholds for Xilinx 4000-series FPGA configuration inputs. Its 3.3V-only supply eliminates level-shifter components and simplifies power sequencing-no 5V or mixed-voltage support is provided or required for XC1765EPDG8C operation.

What package type is used for XC1765EPDG8C?

XC1765EPDG8C uses a 65-pin plastic dual in-line package (PDIP-65) with 0.8-inch body width and 0.1-inch pin pitch. This through-hole package supports legacy board assembly and provides mechanical robustness for industrial vibration environments. Pin 1 is marked with a notch, and the package conforms to JEDEC MS-026AC dimensions.