AMD XC17S100APD8C

Overview

XC17S100APD8C from AMD (formerly Xilinx) is a serial PROM configuration memory for Spartan-3 FPGAs, providing 100 kbit storage capacity in a PDIP-8 package with 5 V supply voltage and 15 ns access time. It supports master serial FPGA configuration mode and is used in industrial control logic and legacy reconfigurable systems.

For engineers reviewing the XC17S100APD8C datasheet, pinout, applications, or equivalent options, key selection factors include voltage compatibility with Spartan-3 I/O banks, read timing margin for configuration clock rates up to 33 MHz, and through-hole mounting suitability for prototyping and repair scenarios.

Technical Context

This device implements a one-time programmable (OTP) serial EEPROM architecture optimized for bitstream loading into Spartan-3 family FPGAs. It uses CMOS technology with NMOS-compatible output drivers and supports both power-up auto-configuration and manual initiation via PROG_B assertion.

Configuration data is stored in nonvolatile memory and accessed sequentially via SI/SO pins under CCLK control. The device lacks internal address latches - addressing is fully synchronous to CCLK edges, requiring precise timing coordination with the target FPGA's configuration controller.

Key Specifications

Pinout & Package

XC17S100APD8C is housed in an 8-pin plastic dual in-line package (PDIP) with 0.3-inch body width and 0.1-inch pin pitch. Pin numbering follows standard DIP convention with pin 1 marked by notch or dot.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA configuration memory applications.

Compared with XCF01SVO20C, XC17S100APD8C offers drop-in replacement capability in legacy through-hole systems but lacks support for newer FPGA families; compared with XC17S100AIPD8C, it trades temperature margin for lower cost in commercial-grade applications.

Availability

XC17S100APD8C is available at Aetrix Electronics and suitable for industrial PLC upgrades, academic FPGA labs, and military avionics retrofit programs requiring stable component supply and long-term obsolescence management.

Supply support for XC17S100APD8C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022, inheriting its FPGA and configuration memory product lines. Xilinx originally developed this device for Spartan-3 system integration.

The XC17SxxA series was designed specifically to provide cost-effective, pin-compatible configuration memory for Spartan-3 FPGAs in commercial and industrial applications.

FAQ

What is the maximum supported CCLK frequency for XC17S100APD8C?

The XC17S100APD8C supports configuration clock frequencies up to 33 MHz, validated by its 15 ns access time specification. This timing ensures reliable data sampling at the FPGA's DIN pin under worst-case voltage and temperature conditions. The XC17S100APD8C does not include internal clock division or buffering - CCLK must be generated externally and meet setup/hold timing relative to SO transitions.

Is XC17S100APD8C compatible with Spartan-3E FPGAs?

No, XC17S100APD8C is not compatible with Spartan-3E FPGAs. It is specifically designed for the original Spartan-3 family (e.g., XC3S50 through XC3S4000). Spartan-3E devices require different configuration bitstream formats and timing parameters, and Xilinx documents XC17SxxA PROMs as unsupported for Spartan-3E. Use XCFxxP series PROMs instead for Spartan-3E compatibility.

Can XC17S100APD8C be reprogrammed after initial programming?

No, XC17S100APD8C is a one-time programmable (OTP) device. Its memory cells use fusible-link technology that permanently alters conduction paths during programming. Once programmed, the bitstream cannot be erased or rewritten. This ensures configuration integrity but requires careful verification before final programming. The XC17S100APD8C is not a flash-based or UV-erasable PROM.

Does XC17S100APD8C require external pull-up resistors on its SO pin?

Yes, XC17S100APD8C requires an external 4.7 kΩ pull-up resistor on the SO pin to ensure valid high-level output during idle and tri-state periods. The device's SO driver is open-drain compatible and relies on external biasing to maintain logic-high states when not actively driving. This requirement is explicitly stated in Xilinx UG071 and applies to all XC17SxxA devices, including the XC17S100APD8C.

What is the difference between XC17S100APD8C and XC17S100AIPD8C?

The XC17S100APD8C is rated for commercial temperature range (0°C to +70°C), while XC17S100AIPD8C is rated for industrial temperature range (−40°C to +85°C). Both share identical electrical specifications, pinout, package, and programming behavior. The XC17S100APD8C is intended for cost-sensitive applications in controlled environments, whereas the 'I' version supports extended thermal operation without design changes.