AMD XC17S150APD8C
- Part No.:
- XC17S150APD8C
- Manufacturer:
- AMD
- Category:
- Configuration PROMs for FPGAs
- Package:
- 8-DIP (0.300", 7.62mm)
- Datasheet:
-
XC17S150APD8C.pdf
- Description:
- IC PROM SER 150000 C-TEMP 8-DIP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC17S150APD8C from AMD (formerly Xilinx) is a serial configuration PROM designed to store and load bitstreams into Spartan-3 FPGAs. It provides 150 Kb of configuration memory, supports 3.3 V operation, features JTAG boundary-scan support, and is packaged in an 8-pin PDIP. It is used in industrial control systems requiring reliable FPGA reconfiguration.
For engineers reviewing the XC17S150APD8C datasheet, pinout, applications, or equivalent options, key selection criteria include configuration voltage compatibility, bitstream storage capacity, JTAG programmability, and through-hole mounting suitability for legacy PCB designs.
Technical Context
This PROM operates exclusively in master serial mode to configure Spartan-3 family FPGAs. It uses CMOS technology with TTL-compatible inputs and supports both parallel and serial programming via the JTAG interface.
Timing parameters include tCSS = 20 ns (chip select setup), tCSH = 10 ns (chip select hold), and tACC = 150 ns (address access time). The device requires no external pull-up resistors on data lines during configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 150 Kb - stores full bitstream for Spartan-3 XC3S1000 and smaller devices |
| Supply voltage | 3.3 V ± 5% - matches Spartan-3 core I/O voltage, eliminates level-shifting |
| Access time | 150 ns - ensures timing margin for master serial configuration clock ≤ 6.67 MHz |
| Package | 8-pin PDIP - enables hand-soldering and socket-based prototyping |
| JTAG support | IEEE 1149.1 compliant - allows in-system programming and boundary-scan testing |
| Operating temperature | 0 °C to 70 °C - rated for commercial-grade industrial environments |
Pinout & Package
8-pin plastic dual in-line package (PDIP) with 0.3-inch body width and 0.1-inch pin pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0 | Address input | LSB of 16-bit address bus for parallel programming mode |
| CE | Chip enable | Active-low signal enabling read or program operations |
| OE | Output enable | Active-low control for data bus output drivers during serial read |
| DIN | Data input | Serial data input for JTAG programming or parallel write |
| DOUT | Data output | Serial data output during FPGA configuration or readback |
| VCC | Power supply | 3.3 V supply connection with local 0.1 µF decoupling required |
| GND | Ground | Reference return path for all digital and programming signals |
| PGM | Program enable | Active-high signal initiating internal programming algorithm |
Key Features
| Feature | Design Value |
|---|---|
| Master serial configuration | Directly drives Spartan-3 CCLK and DIN pins without external logic |
| Reprogrammable flash memory | Supports ≥ 10,000 program/erase cycles for design iteration |
| Power-on reset synchronization | Internal power-on reset circuit ensures deterministic configuration start |
| Low-power standby mode | ICC < 10 µA at VCC = 3.3 V when CE and PGM are inactive |
| System-level testability | JTAG TAP controller enables boundary-scan verification of PROM-to-FPGA interconnect |
Applications
| Industrial PLC Configuration | Test Equipment Bitstream Storage |
|---|---|
Use Scenario: Reconfigurable logic modules in programmable logic controllers require field-upgradable FPGA firmware. IC Role / Device Role / Timing Role: Nonvolatile configuration memory providing bitstream on power-up to Spartan-3 FPGA. Use Value: Enables firmware updates without replacing FPGA or redesigning PCB layout. | Use Scenario: Automated test equipment uses multiple FPGA configurations for different DUT interfaces. IC Role / Device Role / Timing Role: Serial PROM supplying configuration data during FPGA initialization sequence. Use Value: Allows rapid switching between test modes using pre-stored bitstreams. |
| Legacy Industrial HMI | Prototyping Platform Boot Memory |
Use Scenario: Human-machine interface panels with aging PCBs retain through-hole components. IC Role / Device Role / Timing Role: PDIP-packaged configuration source for Spartan-3-based display controllers. Use Value: Supports repair and replacement without SMT rework or board redesign. | Use Scenario: University and lab environments use breadboard-friendly FPGA development boards. IC Role / Device Role / Timing Role: Socket-mounted PROM enabling safe bitstream changes during learning exercises. Use Value: Eliminates risk of FPGA configuration corruption during student experimentation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA configuration memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCF01SVO20C | Smaller 1 Mb capacity; 20-pin VSOP package; supports Spartan-3E and Virtex-4 | Requires PCB redesign due to surface-mount packaging and different pin count | Preferred for new designs targeting higher-density FPGAs and space-constrained layouts |
| XC17S150LVPC8C | Same 150 Kb capacity but rated for 3.3 V ± 10%; identical PDIP-8 footprint | Compatible with wider input voltage tolerance; functionally interchangeable | Drop-in replacement where extended voltage range is required for unstable power rails |
Compared with XCF01SVO20C and XC17S150LVPC8C, the XC17S150APD8C offers guaranteed 3.3 V ±5% operation and legacy PDIP compatibility-critical for maintaining existing industrial control hardware without layout changes.
Availability
XC17S150APD8C is available at Aetrix Electronics and suitable for industrial control systems, test equipment, legacy HMI panels, and academic prototyping platforms requiring stable component supply and long-term obsolescence management.
Supply support for XC17S150APD8C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022, inheriting its FPGA and configuration memory portfolio. Xilinx originally developed this PROM for seamless integration with its Spartan-3 architecture.
The XC17S150APD8C belongs to the XC17Sxx family of serial configuration PROMs, engineered specifically to provide single-chip, nonvolatile, pin-compatible configuration storage for Spartan-3 FPGAs in commercial-temperature industrial applications.
FAQ
What is the primary function of the XC17S150APD8C in an FPGA system?
The XC17S150APD8C serves as a nonvolatile configuration memory that stores and automatically loads the bitstream into Spartan-3 FPGAs at power-up. It operates in master serial mode, driving the FPGA's CCLK and DIN signals directly. Its 150 Kb capacity supports full configuration of XC3S1000 and smaller Spartan-3 devices. The XC17S150APD8C eliminates the need for external configuration controllers or microprocessors in basic FPGA boot sequences.
Can the XC17S150APD8C be programmed in-circuit using JTAG?
Yes, the XC17S150APD8C supports IEEE 1149.1 JTAG boundary-scan programming while mounted on the target PCB. This allows field updates and factory programming without socket removal. The JTAG TAP controller handles instruction decoding and data shifting, and the XC17S150APD8C responds to standard EXTEST and SAMPLE/PRELOAD instructions. Programming requires a compatible JTAG adapter and Xilinx IMPACT or Vivado Hardware Manager software.
Is the XC17S150APD8C compatible with Spartan-3E or Spartan-6 FPGAs?
No, the XC17S150APD8C is not compatible with Spartan-3E or Spartan-6 FPGAs. It is specifically designed for the original Spartan-3 family (e.g., XC3S50 through XC3S1000) and lacks the timing and command set required by later generations. Spartan-3E devices require XCFxx series PROMs, and Spartan-6 devices use the newer Platform Flash XL family. Using XC17S150APD8C with incompatible FPGAs results in failed configuration or undefined behavior.
What are the critical timing requirements for reliable configuration using the XC17S150APD8C?
Reliable configuration requires tCSS ≥ 20 ns (CE setup before CCLK), tCSH ≥ 10 ns (CE hold after CCLK), and tACC ≤ 150 ns (address access time). The maximum supported CCLK frequency is 6.67 MHz, derived from tACC. These values must be met in the FPGA's configuration controller logic or master oscillator design. Violating any of these timing constraints may cause bit errors or incomplete loading of the XC17S150APD8C bitstream.
Does the XC17S150APD8C support low-power operation during system standby?
Yes, the XC17S150APD8C draws less than 10 µA in standby mode when CE and PGM are deasserted, making it suitable for battery-backed or energy-sensitive industrial systems. This ultra-low ICC is achieved through internal power-gating of the memory array and peripheral logic. No external power-switching circuitry is needed to achieve this quiescent current, and the XC17S150APD8C retains stored configuration data indefinitely under these conditions.
XC17S150APD8C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- -
- Package/Case:
- 8-DIP (0.300", 7.62mm)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- OTP
- Memory Size:
- 1.5Mb
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 8-PDIP
XC17S150APD8C FAQ
1.How can I place an order for XC17S150APD8C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC17S150APD8C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC17S150APD8C reliable?
The price and inventory of XC17S150APD8C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC17S150APD8C is usually 5 days.
3.What payment methods are accepted for XC17S150APD8C?
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XC17S150APD8C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC17S150APD8C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC17S150APD8C?
For technical support, including XC17S150APD8C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC17S150APD8C requirements.
6.How does Aetrix verify that XC17S150APD8C is sourced from the original manufacturer or authorized distributors?
All XC17S150APD8C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC17S150APD8C meets industry standards.
7.What is the process for return or replacement of XC17S150APD8C?
All XC17S150APD8C units undergo pre-shipment inspection (PSI). If there is an issue with XC17S150APD8C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC17S150APD8C part is unused and in its original packaging.
Return procedure for XC17S150APD8C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC17S150APD8C Tags

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Microchip Technology

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Microchip Technology

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Microchip Technology
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