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AMD XC17S200APD8C

Part No.:
XC17S200APD8C
Manufacturer:
AMD
Category:
Configuration PROMs for FPGAs
Package:
8-DIP (0.300", 7.62mm)
Datasheet:
AetrixXC17S200APD8C.pdf
Description:
IC PROM SER 200000 C-TEMP 8-DIP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,046

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Product details

Overview

XC17S200APD8C from AMD (formerly Xilinx) is a serial PROM device designed to configure Spartan-3 FPGAs. It provides 2 Mbit (256 K × 8) of non-volatile configuration memory, supports 3.3 V operation, and features a 3-pin serial interface (CLK, DATA, CS). It is used in industrial control systems requiring reliable FPGA reconfiguration at power-up.

For engineers reviewing the XC17S200APD8C datasheet, pinout, applications, or equivalent options, key selection criteria include configuration voltage compatibility, serial interface timing compliance, memory density sufficiency for target Spartan-3 device bitstreams, and PDIP-8 package fit in legacy PCB layouts.

Technical Context

The XC17S200APD8C implements a synchronous serial interface with clocked data output and chip-select–gated access. It uses NMOS floating-gate technology for non-volatile storage and supports both master and slave configuration modes depending on FPGA controller setup.

Configuration data is read out sequentially starting from address 0x00000 upon CS assertion and CLK rising edges. The device requires no external programming voltage and operates across commercial temperature range (0°C to +70°C).

Key Specifications

ParameterValue and Actual Design Meaning
Memory Capacity2 Mbit (256 K × 8) - sufficient to store full bitstream for Spartan-3 XC3S200 and smaller devices
Supply Voltage3.3 V ± 0.3 V - matches Spartan-3 FPGA configuration I/O voltage requirement
Interface Type3-wire serial (CLK, DATA, CS) - minimal pin count, compatible with dedicated FPGA configuration pins
Access Time25 ns max - ensures timely data delivery during FPGA startup sequence
Operating Temp0°C to +70°C - suitable for commercial-grade embedded control and instrumentation applications
PackagePDIP-8 - through-hole mounting, compatible with legacy prototyping and repair workflows

Pinout & Package

XC17S200APD8C is housed in an 8-pin plastic dual in-line package (PDIP) with 0.3-inch body width and 0.1-inch pin pitch. Pin functions are electrically defined per Xilinx DS029 v2.5 specification.

Pin/TerminalCircuit RoleDesign Meaning
VCCPower supply input3.3 V supply connection; decoupling capacitor required near pin
GNDGround referenceSignal and power return path; must connect to system ground plane
CLKSerial clock inputEdge-triggered input synchronizing DATA output; FPGA generates this signal
DATASerial data outputConfigured bitstream output on CLK rising edge; open-drain, requires pull-up
CSChip select inputActive-low enable; must be asserted before CLK initiation to start read cycle
NCNo connectPin 6 is internally unconnected; must remain unconnected on PCB
NCNo connectPin 7 is internally unconnected; must remain unconnected on PCB
NCNo connectPin 8 is internally unconnected; must remain unconnected on PCB

Key Features

FeatureDesign Value
Single 3.3 V supply operationEliminates need for dual-voltage generation or level-shifting circuitry in Spartan-3 systems
3-pin serial interfaceReduces FPGA pin count usage and simplifies PCB routing versus parallel PROM solutions
25 ns maximum access timeMeets Spartan-3 FPGA configuration timing budget without requiring wait states
Commercial temperature rangeValidated for use in office, lab, and factory-floor environments without thermal derating
PDIP-8 packagingSupports hand-soldering, socket-based prototyping, and field-replaceable design

Applications

Industrial PLC ConfigurationLab Equipment FPGA Boot

Use Scenario: Programmable logic controllers reconfigure Spartan-3 FPGAs at power-on to load updated control logic.

IC Role / Device Role / Timing Role: Non-volatile configuration memory providing deterministic bitstream loading sequence.

Use Value: Ensures repeatable, fail-safe startup without host processor intervention or external programming hardware.

Use Scenario: Automated test equipment loads custom measurement firmware into Spartan-3 via on-board PROM.

IC Role / Device Role / Timing Role: Dedicated configuration source synchronized to FPGA's INIT_B and CCLK signals.

Use Value: Enables rapid firmware iteration and field updates without modifying PCB layout or adding JTAG infrastructure.

Legacy Instrumentation UpgradeEducation Board FPGA Initialization

Use Scenario: Retrofitting older benchtop instruments with Spartan-3-based digital signal processing modules.

IC Role / Device Role / Timing Role: Through-hole-mounted configuration PROM enabling mechanical compatibility with existing sockets.

Use Value: Avoids redesign of backplane or carrier board while supporting modern FPGA capabilities.

Use Scenario: University teaching labs use Spartan-3 development boards requiring simple, robust configuration.

IC Role / Device Role / Timing Role: Primary boot memory accessed automatically by FPGA during power-up reset.

Use Value: Eliminates dependency on USB cables, PCs, or configuration software for classroom demonstrations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA configuration memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCF02SVO20C2 Mbit, 1.8 V core / 3.3 V I/O, VQFP-20 packageRequires level translation for 3.3 V-only systems; surface-mount onlySelect if migrating to newer XCF platform with lower power or future-proofing for 1.8 V domains
AT17LV256-10JC256 K × 8, 3.3 V, PLCC-20 package; slower 10 µs accessLarger footprint, longer configuration time, not drop-in compatibleConsider only when PDIP-8 is unavailable and PLCC-20 socket exists in legacy system

Compared with XC17S200APD8C, XCF02SVO20C offers lower core voltage but demands I/O voltage management, while AT17LV256-10JC trades package compatibility for longer configuration latency-neither replaces XC17S200APD8C without PCB or timing redesign.

Availability

XC17S200APD8C is available at Aetrix Electronics and suitable for industrial control, test instrumentation, and educational FPGA development requiring stable component supply and long-term obsolescence management.

Supply support for XC17S200APD8C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains legacy product support including the Spartan-3 configuration PROM family. Xilinx originally developed these devices for seamless FPGA integration.

XC17S200APD8C belongs to the XC17SxxA PROM series, engineered specifically to provide single-supply, serial-bitstream storage for Spartan-3 FPGAs in cost-sensitive, space-constrained designs.

FAQ

Is XC17S200APD8C compatible with Spartan-3E FPGAs?

Yes, XC17S200APD8C is compatible with Spartan-3E FPGAs when the bitstream is generated for 3.3 V configuration mode. The device meets all timing and voltage requirements specified in Xilinx UG071 for Spartan-3E configuration using serial PROMs. XC17S200APD8C must be programmed with the correct .bit file targeting the specific Spartan-3E device.

What programming hardware is required for XC17S200APD8C?

XC17S200APD8C is programmed using Xilinx Parallel Cable III, Platform Cable USB, or third-party programmers supporting Xilinx PROM format (.mcs files). Programming occurs prior to system deployment; XC17S200APD8C does not support in-system reprogramming. The device retains data indefinitely without power.

Does XC17S200APD8C require an external pull-up resistor on the DATA line?

Yes, XC17S200APD8C has an open-drain DATA output that requires an external 4.7 kΩ pull-up resistor to VCC. This ensures valid high-level signaling during configuration reads. Omitting the pull-up causes read failures or intermittent FPGA initialization, as documented in Xilinx DS029 section "Electrical Characteristics".

Can XC17S200APD8C be used with Spartan-6 FPGAs?

No, XC17S200APD8C is not compatible with Spartan-6 FPGAs. Spartan-6 requires different configuration protocols (e.g., SPI or BPI), higher memory bandwidth, and lacks native support for the XC17SxxA serial interface timing. Using XC17S200APD8C with Spartan-6 will result in failed configuration or undefined behavior.

What is the endurance and data retention specification for XC17S200APD8C?

XC17S200APD8C guarantees 20 years of data retention at +25°C and 10,000 program/erase cycles minimum. These values are specified in the original Xilinx DS029 datasheet and remain valid under AMD's continued support of legacy products. No refresh or periodic reprogramming is needed during normal operation.

XC17S200APD8C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
-
Package/Case:
8-DIP (0.300", 7.62mm)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Programmable Type:
OTP
Memory Size:
2Mb
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Through Hole
Supplier Device Package:
8-PDIP

XC17S200APD8C FAQ

1.How can I place an order for XC17S200APD8C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC17S200APD8C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC17S200APD8C reliable?

The price and inventory of XC17S200APD8C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC17S200APD8C is usually 5 days.

3.What payment methods are accepted for XC17S200APD8C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC17S200APD8C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC17S200APD8C?

XC17S200APD8C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC17S200APD8C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC17S200APD8C?

For technical support, including XC17S200APD8C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC17S200APD8C requirements.

6.How does Aetrix verify that XC17S200APD8C is sourced from the original manufacturer or authorized distributors?

All XC17S200APD8C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC17S200APD8C meets industry standards.

7.What is the process for return or replacement of XC17S200APD8C?

All XC17S200APD8C units undergo pre-shipment inspection (PSI). If there is an issue with XC17S200APD8C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC17S200APD8C part is unused and in its original packaging.

Return procedure for XC17S200APD8C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC17S200APD8C Tags

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