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AMD XC17S200APDG8C
- Part No.:
- XC17S200APDG8C
- Manufacturer:
- AMD
- Category:
- Configuration PROMs for FPGAs
- Package:
- 8-DIP (0.300", 7.62mm)
- Datasheet:
-
XC17S200APDG8C.pdf
- Description:
- IC PROM SER 200K C-TEMP 8-DIP
- Quantity:
- Payment:
- Shipping:
Inventory:1,309
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Product details
Overview
XC17S200APDG8C from AMD (formerly Xilinx) is a serial configuration PROM designed to store and load configuration bitstreams for Spartan-2 FPGAs. It provides 200 kbit of OTP memory, supports 3.3 V operation, features a 5 MHz serial interface, and is packaged in an 8-pin PDIP. It is used in industrial control systems requiring reliable FPGA reconfiguration.
For engineers reviewing the XC17S200APDG8C datasheet, pinout, applications, or equivalent options, key selection criteria include OTP memory size, 3.3 V supply compatibility, serial clock frequency limit, PDIP-8 mechanical fit, and Spartan-2 FPGA configuration protocol compliance.
Technical Context
This PROM implements a synchronous serial interface aligned with Xilinx Spartan-2 FPGA configuration requirements. It uses CMOS technology, includes internal power-on reset circuitry, and delivers data on the falling edge of the serial clock (SCLK).
Configuration mode is fixed as master serial; no address pins or parallel access are supported. The device lacks write-enable logic after programming - it is one-time programmable and read-only during system operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 200 kbit (25,000 bytes) - stores full configuration bitstream for mid-size Spartan-2 FPGAs like XC2S100. |
| Supply Voltage | 3.3 V ± 0.3 V - matches Spartan-2 core I/O voltage, eliminates level-shifting in configuration path. |
| Max Serial Clock | 5 MHz - sets upper bound on configuration speed; typical load time ~40 ms for XC2S100. |
| Programming Method | One-Time Programmable (OTP) - programmed via dedicated PROM programmer before soldering; no in-system reprogramming. |
| Access Time | 25 ns (max) - ensures setup/hold timing margins for SCLK-driven read cycles during FPGA init. |
| Operating Temp | 0 °C to +70 °C - rated for commercial-grade industrial control and test equipment environments. |
Pinout & Package
Package: 8-pin Plastic Dual In-line Package (PDIP), 0.3 inch width, through-hole mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (A0) | Address Input | Not used - internally tied low; device operates in fixed sequential read mode only. |
| 2 (VCC) | Power Supply | +3.3 V supply input; requires local 0.1 µF bypass capacitor near pin. |
| 3 (GND) | Ground | Reference return for VCC and signal pins; connect to system ground plane. |
| 4 (DIN) | Data Input | Serial programming input during PROM programming; no function during FPGA configuration. |
| 5 (DOUT) | Data Output | Active-high serial data output synchronized to SCLK falling edge during FPGA config. |
| 6 (SCLK) | Serial Clock | Input clock driving read timing; FPGA generates this signal during master serial startup. |
| 7 (CE#) | Chip Enable | Active-low enable; must be held low throughout configuration sequence. |
| 8 (OE#) | Output Enable | Active-low output control; tied low permanently for standard FPGA config use. |
Key Features
| Feature | Design Value |
|---|---|
| OTP Memory Architecture | Prevents accidental reprogramming or corruption; guarantees bitstream integrity over product lifetime. |
| Master Serial Interface | Directly compatible with Spartan-2 FPGA's native configuration mode - no external controller needed. |
| 3.3 V Only Operation | Eliminates dual-supply design complexity and reduces BOM count in 3.3 V FPGA systems. |
| PDIP-8 Footprint | Enables manual prototyping, socket-based rework, and legacy board compatibility without SMT reflow. |
Applications
| Industrial PLC Configuration | Test Equipment Bitstream Storage |
|---|---|
Use Scenario: Reconfiguring Spartan-2 FPGA logic in programmable logic controllers during firmware updates or field calibration. IC Role / Device Role / Timing Role: Nonvolatile configuration storage; delivers bitstream on power-up under FPGA-controlled SCLK timing. Use Value: Ensures deterministic startup behavior and eliminates need for external microcontroller-based configuration management. | Use Scenario: Storing multiple FPGA configurations in automated test equipment for different DUT interfaces. IC Role / Device Role / Timing Role: Dedicated bitstream source; operates in fixed master serial mode synchronized to FPGA's internal oscillator. Use Value: Reduces configuration latency versus JTAG-based loading and avoids host PC dependency during test execution. |
| Legacy Board FPGA Upgrade | Embedded Instrumentation Boot Loader |
Use Scenario: Retrofitting older 5 V systems with Spartan-2 FPGAs using level-shifted 3.3 V configuration path. IC Role / Device Role / Timing Role: OTP PROM providing guaranteed-read-only bitstream delivery; CE# and OE# support simple enable logic. Use Value: Enables drop-in replacement of obsolete EPROMs while maintaining identical PDIP-8 footprint and timing envelope. | Use Scenario: Initializing FPGA-based signal processing pipelines in portable instrumentation with strict power-on timing. IC Role / Device Role / Timing Role: Primary configuration source activated immediately after VCC stabilization; no software intervention required. Use Value: Achieves sub-100 ms system ready time by eliminating boot code execution and flash read overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA configuration PROM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC17S200ALV08C | Same 200 kbit capacity and timing, but uses 8-pin SOIC package instead of PDIP. | Requires surface-mount assembly; unsuitable for socketed prototyping or through-hole legacy boards. | Select when board space is constrained and SMT manufacturing is available. |
| XC17S100APDG8C | 100 kbit capacity (half size); otherwise identical pinout, voltage, and interface. | Only supports smaller Spartan-2 devices (e.g., XC2S15); insufficient for XC2S100+ bitstreams. | Choose only if target FPGA configuration file fits within 100 kbit and cost reduction is critical. |
Compared with XC17S200ALV08C and XC17S100APDG8C, the XC17S200APDG8C uniquely combines full 200 kbit capacity with through-hole PDIP-8 packaging - enabling both legacy board compatibility and sufficient storage for larger Spartan-2 FPGAs without redesigning the configuration interface.
Availability
XC17S200APDG8C is available at Aetrix Electronics and suitable for industrial control, test instrumentation, and embedded FPGA-based systems requiring stable component supply and long-term obsolescence management.
Supply support for XC17S200APDG8C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022; this device was originally developed and qualified by Xilinx as part of its pre-acquisition configuration PROM family.
The XC17SxxA series targets reliable, low-complexity FPGA configuration in cost-sensitive industrial and legacy applications where OTP security and through-hole serviceability are prioritized.
FAQ
Is XC17S200APDG8C compatible with Spartan-3 or Spartan-6 FPGAs?
No. The XC17S200APDG8C is specifically designed for Spartan-2 FPGAs. It does not support the configuration protocols, voltage tolerances, or bitstream formats of Spartan-3 or Spartan-6 families. Using it with those devices will result in failed configuration. Always verify FPGA family compatibility in the official Xilinx documentation for XC17S200APDG8C before integration.
Can XC17S200APDG8C be reprogrammed after initial programming?
No. The XC17S200APDG8C is a one-time programmable (OTP) PROM. Its memory cells are permanently fused during programming. There is no erase or rewrite capability. Once programmed, the stored bitstream cannot be altered - making it suitable for production systems where configuration integrity must be guaranteed across the product lifecycle.
What is the recommended decoupling for XC17S200APDG8C?
A 0.1 µF ceramic capacitor placed as close as possible to the VCC (pin 2) and GND (pin 3) terminals is required for stable operation. This minimizes power supply noise during serial data reads and ensures timing margin compliance with the 5 MHz SCLK specification for XC17S200APDG8C.
Does XC17S200APDG8C support boundary-scan or JTAG configuration?
No. The XC17S200APDG8C only supports master serial configuration mode. It has no JTAG interface, TDI/TDO pins, or boundary-scan capability. Configuration is initiated solely by the FPGA asserting CE# and generating SCLK - a hardware-driven process independent of JTAG controllers or debug tools used with XC17S200APDG8C.
Is there a lead-free version of XC17S200APDG8C available?
No. The XC17S200APDG8C is a legacy device manufactured prior to RoHS compliance mandates and is only available in a leaded PDIP package. It does not have a Pb-free variant. Designers requiring RoHS compliance must evaluate alternative configuration solutions such as platform-specific flash or newer FPGA-integrated configuration options.
XC17S200APDG8C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- -
- Package/Case:
- 8-DIP (0.300", 7.62mm)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- OTP
- Memory Size:
- 2Mb
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 8-PDIP
XC17S200APDG8C FAQ
1.How can I place an order for XC17S200APDG8C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC17S200APDG8C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC17S200APDG8C reliable?
The price and inventory of XC17S200APDG8C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC17S200APDG8C is usually 5 days.
3.What payment methods are accepted for XC17S200APDG8C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC17S200APDG8C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC17S200APDG8C?
XC17S200APDG8C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC17S200APDG8C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC17S200APDG8C?
For technical support, including XC17S200APDG8C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC17S200APDG8C requirements.
6.How does Aetrix verify that XC17S200APDG8C is sourced from the original manufacturer or authorized distributors?
All XC17S200APDG8C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC17S200APDG8C meets industry standards.
7.What is the process for return or replacement of XC17S200APDG8C?
All XC17S200APDG8C units undergo pre-shipment inspection (PSI). If there is an issue with XC17S200APDG8C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC17S200APDG8C part is unused and in its original packaging.
Return procedure for XC17S200APDG8C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC17S200APDG8C Tags
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