AMD XC17S200APDG8I
- Part No.:
- XC17S200APDG8I
- Manufacturer:
- AMD
- Category:
- Configuration PROMs for FPGAs
- Package:
- 8-DIP (0.300", 7.62mm)
- Datasheet:
-
XC17S200APDG8I.pdf
- Description:
- IC PROM SER 200K I-TEMP 8-DIP
- Quantity:
- Payment:

- Shipping:

Inventory:1,834
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC17S200APDG8I from AMD (formerly Xilinx) is a serial configuration PROM designed to store and load configuration bitstreams for Spartan-2 FPGAs. It provides 200 kbit of OTP memory, supports 3.3 V operation, and features a 5 MHz serial interface with industrial temperature range (–40°C to +85°C). It is used in FPGA-based industrial control logic systems requiring nonvolatile, single-chip configuration storage.
For engineers reviewing the XC17S200APDG8I datasheet, pinout, applications, or equivalent options, key selection criteria include OTP memory size, 3.3 V supply compatibility, serial clock frequency limit, industrial temperature rating, and FPGA configuration protocol alignment with Spartan-2 devices.
Technical Context
This PROM implements a synchronous serial interface compliant with Xilinx Spartan-2 FPGA configuration requirements. It uses CMOS OTP technology and requires no external programming voltage - programming is performed via standard 3.3 V I/O signals using the Xilinx BitGen tool and compatible programmers.
The device operates exclusively in master serial mode, delivering configuration data on the DIN line to the FPGA's INIT pin during power-up or PROG_B assertion. Timing parameters including tSU (data setup), tH (data hold), and tCYC (clock cycle) are specified at 5 MHz maximum clock rate and –40°C to +85°C ambient.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 200 kbit (25,000 bytes) OTP storage - sufficient to hold full configuration bitstream for mid-size Spartan-2 FPGAs like XC2S100E. |
| Supply Voltage | 3.3 V ±10% - matches Spartan-2 FPGA core and I/O bank voltage, eliminating level-shifting needs. |
| Max Serial Clock | 5 MHz - defines upper limit for configuration speed; actual load time depends on bitstream size and clock stability. |
| Operating Temp | –40°C to +85°C - qualified for industrial environments without derating or thermal management overhead. |
| Programming Method | In-system programmable via JTAG or dedicated PROM programmer - no UV erasure or external VPP required. |
| Access Time | 150 ns (max) - ensures reliable data delivery timing margin relative to FPGA configuration clock edge. |
Pinout & Package
XC17S200APDG8I is housed in an 8-pin plastic DIP (PDIP) package with 0.3-inch body width and through-hole mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0 | Address Input | LSB of internal address bus; tied low for fixed-start configuration readout sequence. |
| CLK | Serial Clock Input | Edge-triggered input synchronizing data output; must be stable before FPGA sampling edge. |
| DIN | Data Input | Used only during programming; receives bitstream from programmer under JTAG or parallel mode. |
| DOUT | Data Output | Drives FPGA DIN pin during configuration; open-drain output with pull-up required externally. |
| CE | Chip Enable | Active-low enable controlling PROM output driver; asserted by FPGA during configuration phase. |
| VCC | Power Supply | 3.3 V supply input; decoupling capacitor (0.1 µF) required within 10 mm of pin. |
| GND | Ground | Reference return path for all digital and power signals; connected to system ground plane. |
| PROG | Program Enable | Active-high signal initiating in-system programming; requires controlled rise time to avoid false triggers. |
Key Features
| Feature | Design Value |
|---|---|
| One-Time Programmable Memory | Prevents accidental reprogramming or field bitstream corruption - critical for deployed industrial systems. |
| 3.3 V Only Operation | Eliminates dual-supply design complexity and reduces BOM count versus 5 V/3.3 V mixed-voltage PROMs. |
| Spartan-2 Configuration Protocol Compliance | Guarantees bit-accurate, timing-compliant handoff to XC2Sxxx FPGA families without custom interface logic. |
| Industrial Temperature Range | Enables direct use in uncontrolled enclosures (e.g., PLC backplanes, motor drives) without thermal derating. |
| 8-Pin PDIP Package | Supports manual prototyping, legacy board rework, and socket-based field upgrades without SMT reflow. |
Applications
| Industrial PLC Configuration | Test Equipment Bitstream Loader |
|---|---|
Use Scenario: Fixed-function logic in programmable logic controllers where FPGA configuration must survive power cycles and environmental stress. IC Role / Device Role / Timing Role: Nonvolatile configuration storage and serial bitstream source synchronized to FPGA INIT sequence. Use Value: Ensures deterministic startup behavior and eliminates need for external configuration controllers or flash+loader firmware. | Use Scenario: Automated test fixtures requiring rapid, repeatable FPGA reconfiguration between test vectors. IC Role / Device Role / Timing Role: Standalone bitstream source triggered by test sequencer via PROG pin assertion. Use Value: Reduces test cycle time by enabling sub-second FPGA reload without host PC intervention or JTAG stack overhead. |
| Motor Drive Control Logic | Legacy Industrial Interface Module |
Use Scenario: Field-oriented control (FOC) implementation in AC servo drives operating in high-EMI cabinet environments. IC Role / Device Role / Timing Role: Immune-to-noise configuration loader delivering bitstream directly to Spartan-2 FPGA during power-on reset. Use Value: Prevents configuration failure due to EMI-induced clock jitter or supply transients during startup. | Use Scenario: Retrofit of aging RS-485/Modbus modules where PCB space and through-hole assembly constrain modern alternatives. IC Role / Device Role / Timing Role: Pin-compatible replacement for obsolete 5 V PROMs using level-shifted CE/CLK signals. Use Value: Enables drop-in upgrade path while retaining existing socket footprint and firmware initialization flow. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA configuration PROM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC17S200AIPD8 | Same 200 kbit OTP capacity and pinout, but rated for commercial temperature range (0°C to +70°C). | Limited to climate-controlled environments; unsuitable for outdoor or unventilated industrial cabinets. | Select only if system ambient stays within 0–70°C and cost sensitivity outweighs reliability margin. |
| XC17S100APDG8I | 100 kbit capacity, identical 8-pin PDIP package and industrial temperature rating. | Supports smaller Spartan-2 devices (e.g., XC2S50); insufficient for XC2S150+ bitstreams. | Choose when target FPGA configuration size is ≤100 kbit and thermal profile matches. |
Compared with XC17S200APDG8I, XC17S200AIPD8 sacrifices industrial temperature tolerance for lower cost, while XC17S100APDG8I reduces memory capacity by 50% but retains full thermal compliance - both require explicit bitstream size and ambient validation before substitution.
Availability
XC17S200APDG8I is available at Aetrix Electronics and suitable for industrial PLCs, motor drive control units, and automated test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC17S200APDG8I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022, inheriting its FPGA and configuration PROM portfolio. Xilinx originally developed these PROMs specifically for seamless integration with its Spartan family FPGAs.
The XC17SxxxA series was engineered to provide robust, single-chip configuration solutions for Spartan-2 FPGA deployments in harsh industrial settings - prioritizing reliability, simplicity, and protocol fidelity over programmability flexibility.
FAQ
What is the programming method supported by XC17S200APDG8I?
XC17S200APDG8I supports in-system programming via JTAG boundary-scan or dedicated PROM programmers such as the Xilinx Parallel Cable III. Programming occurs at 3.3 V with no external high-voltage supply needed. The XC17S200APDG8I is one-time programmable - once written, the bitstream cannot be erased or rewritten, ensuring configuration integrity in deployed systems.
Does XC17S200APDG8I support hot-swapping or dynamic reconfiguration?
No, XC17S200APDG8I does not support hot-swapping or dynamic reconfiguration. It is a static, one-time programmable device intended solely for power-on FPGA configuration loading. The XC17S200APDG8I lacks runtime reprogramming capability and must be pre-programmed before installation. Dynamic partial reconfiguration requires external microcontroller-based loaders or newer FPGA-integrated configuration schemes.
Can XC17S200APDG8I be used with Spartan-3 or later Xilinx FPGAs?
No, XC17S200APDG8I is not compatible with Spartan-3 or later FPGAs. Its timing, command set, and bitstream format are specific to Spartan-2 devices. Using XC17S200APDG8I with Spartan-3 or Virtex families will result in failed configuration. The XC17S200APDG8I must be paired only with Spartan-2 FPGAs such as XC2S50 through XC2S200.
What is the role of the PROG pin on XC17S200APDG8I?
The PROG pin on XC17S200APDG8I initiates in-system programming when driven high. It resets internal address counters and enables the DIN input path. During normal operation, PROG must remain low. The XC17S200APDG8I requires a clean, slew-rate-controlled PROG signal to prevent spurious programming - typical designs use RC filtering or FPGA GPIO with debouncing logic before driving this pin.
Is external pull-up required on the DOUT pin of XC17S200APDG8I?
Yes, XC17S200APDG8I features an open-drain DOUT output that requires an external 4.7 kΩ pull-up resistor to 3.3 V. Without this pull-up, the FPGA's DIN input will float during configuration, causing unpredictable startup behavior or configuration failure. This requirement is explicitly defined in the XC17S200APDG8I datasheet and applies regardless of PCB layout or trace length.
XC17S200APDG8I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- -
- Package/Case:
- 8-DIP (0.300", 7.62mm)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Verified
- Programmable Type:
- OTP
- Memory Size:
- 2Mb
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 8-PDIP
XC17S200APDG8I FAQ
1.How can I place an order for XC17S200APDG8I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC17S200APDG8I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC17S200APDG8I reliable?
The price and inventory of XC17S200APDG8I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC17S200APDG8I is usually 5 days.
3.What payment methods are accepted for XC17S200APDG8I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC17S200APDG8I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC17S200APDG8I?
XC17S200APDG8I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC17S200APDG8I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC17S200APDG8I?
For technical support, including XC17S200APDG8I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC17S200APDG8I requirements.
6.How does Aetrix verify that XC17S200APDG8I is sourced from the original manufacturer or authorized distributors?
All XC17S200APDG8I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC17S200APDG8I meets industry standards.
7.What is the process for return or replacement of XC17S200APDG8I?
All XC17S200APDG8I units undergo pre-shipment inspection (PSI). If there is an issue with XC17S200APDG8I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC17S200APDG8I part is unused and in its original packaging.
Return procedure for XC17S200APDG8I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC17S200APDG8I Tags

-
AT17LV512A-10PU
Microchip Technology

-
EPCQ4ASI8N
Intel

-
AT17LV256-10PU
Microchip Technology

-
AT17LV256-10NU
Microchip Technology

-
EPCQ16ASI8N
Intel

-
AT17LV010-10PU
Microchip Technology

-
EPCQ32ASI8N
Intel

-
EPCQ64ASI16N
Intel

-
EPCQ128ASI16N
Intel

-
AT17LV512A-10JU
Microchip Technology

-
AT17LV512-10JU
Microchip Technology

-
AT17LV010-10JU
Microchip Technology
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
