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AMD XC17S30ASO20C

Part No.:
XC17S30ASO20C
Manufacturer:
AMD
Category:
Configuration PROMs for FPGAs
Package:
20-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixXC17S30ASO20C.pdf
Description:
IC PROM SER 30000 C-TEMP 20-SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,908

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Product details

Overview

XC17S30ASO20C from AMD (formerly Xilinx) is a serial configuration PROM designed to store and load configuration bitstreams into Spartan-3 FPGAs. It provides 3 Mbit of OTP memory, operates at 5 V, supports 33 MHz read speed, and uses a 20-pin SOIC package. It is used in industrial control systems requiring reliable FPGA reconfiguration.

For engineers reviewing the XC17S30ASO20C datasheet, pinout, applications, or equivalent options, key selection criteria include OTP memory capacity, 5 V supply compatibility, SOIC-20 mechanical footprint, read timing performance, and Spartan-3 FPGA configuration interface support.

Technical Context

This PROM implements a synchronous serial interface compatible with Xilinx Spartan-3 FPGA configuration protocols. It requires no external clock during read operations and supports standard SPI-like command sequences for address setup and data output.

It features built-in power-on reset logic and automatic address incrementing during sequential reads. The device lacks write capability after initial programming - all memory cells are one-time programmable fuses.

Key Specifications

ParameterValue and Actual Design Meaning
Memory TypeOTP PROM - permanently stores FPGA bitstream; no reprogramming after initial fuse programming.
Total Capacity3 Mbit (3,145,728 bits) - sufficient to configure XC3S200 and smaller Spartan-3 devices.
Supply Voltage5.0 V ±10% - matches legacy 5 V FPGA configuration voltage domain; no level-shifting required.
Max Read Speed33 MHz - enables fast FPGA startup; supports tCONFIG ≤ 100 ms for typical Spartan-3 designs.
PackageSOIC-20 (300 mil) - industry-standard surface-mount footprint; pin-compatible with XC17SxxA family.
Interface ProtocolSynchronous serial - uses CCLK, DIN, DOUT, and CS# signals per Xilinx configuration spec.

Pinout & Package

XC17S30ASO20C is housed in a 20-pin Small Outline Integrated Circuit (SOIC) package with 300-mil body width and standard gull-wing leads. Pin spacing is 0.050 inch (1.27 mm), and lead thickness complies with JEDEC MS-012.

Pin/TerminalCircuit RoleDesign Meaning
1 (CS#)Chip Select InputActive-low enable; must be low for read access; high-Z state when inactive.
2 (DIN)Data InputSerial command/address input during configuration setup phase.
3 (DOUT)Data OutputSerial bitstream output synchronized to CCLK rising edge.
4 (CCLK)Configuration Clock InputDrives internal shift register; sourced by FPGA or external controller.
5–20No Connect / Ground / PowerPins 5–12 and 14–20 are NC or GND/VCC per layout; pin 13 is VCC.

Key Features

FeatureDesign Value
One-Time Programmable MemoryEnsures bitstream integrity and prevents accidental overwrite in deployed systems.
5 V OperationEliminates need for voltage translation when interfacing with 5 V Spartan-3 FPGAs.
33 MHz Read RateReduces FPGA configuration time to meet industrial boot-time requirements.
SOIC-20 FootprintEnables drop-in replacement within existing PCB layouts designed for XC17SxxA series.

Applications

Industrial PLCsTest Equipment Controllers

Use Scenario: Reconfigurable logic modules in programmable logic controllers require persistent, tamper-resistant bitstream storage.

IC Role / Device Role / Timing Role: Configuration PROM providing nonvolatile bitstream loading at power-up.

Use Value: OTP architecture prevents field corruption; 5 V compatibility simplifies power design with legacy I/O rails.

Use Scenario: Automated test equipment uses Spartan-3 FPGAs for real-time signal generation and analysis.

IC Role / Device Role / Timing Role: Bitstream loader enabling deterministic FPGA initialization before test sequence execution.

Use Value: 33 MHz read speed ensures sub-100 ms FPGA configuration, meeting tight system boot deadlines.

Avionics Data InterfacesMedical Imaging Subsystems

Use Scenario: Ruggedized airborne communication gateways rely on FPGA-based protocol translation.

IC Role / Device Role / Timing Role: Secure configuration storage ensuring consistent FPGA behavior across mission cycles.

Use Value: SOIC-20 package supports conformal coating and meets MIL-STD-883 handling requirements.

Use Scenario: Ultrasound beamforming modules use Spartan-3 FPGAs for parallel digital signal processing.

IC Role / Device Role / Timing Role: Primary configuration source enabling repeatable hardware behavior across production units.

Use Value: OTP memory guarantees identical bitstream delivery - critical for FDA-regulated medical device consistency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA configuration PROM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC17S30AFTG20CSame 3 Mbit OTP capacity and 5 V operation, but in thin-profile TSSOP-20 package (4.4 mm width vs. SOIC's 7.5 mm).Preferred where board height or thermal profile limits SOIC usage; same timing and interface.Select when PCB space or Z-height constraints prohibit SOIC-20.
XC17S25ASO20CLower 2.5 Mbit capacity; otherwise identical pinout, voltage, speed, and OTP architecture.Suitable only for Spartan-3 devices ≤ XC3S1500; insufficient for XC3S2000+ configurations.Choose only if target FPGA bitstream fits within 2.5 Mbit and SOIC-20 footprint is mandatory.

Compared with XC17S30AFTG20C and XC17S25ASO20C, the XC17S30ASO20C uniquely balances full 3 Mbit capacity with standard SOIC-20 manufacturability - making it optimal for cost-sensitive, volume industrial designs where board real estate and assembly process maturity are prioritized.

Availability

XC17S30ASO20C is available at Aetrix Electronics and suitable for industrial PLCs, automated test equipment, and avionics data interfaces requiring stable component supply and long-term obsolescence management.

Supply support for XC17S30ASO20C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now oversees legacy Xilinx programmable logic products. The company specializes in adaptive computing solutions for data center, AI, and embedded markets.

The XC17SxxA PROM family was developed by Xilinx to provide robust, low-risk configuration storage for Spartan-3 FPGAs in industrial and aerospace applications where reliability and long-term supply stability are essential.

FAQ

What is the memory technology used in XC17S30ASO20C?

The XC17S30ASO20C uses metal-fuse one-time programmable (OTP) PROM technology. Each bit is stored as a physical fuse link that is permanently blown during programming. This eliminates risk of bitstream corruption from radiation, ESD, or power glitches - a key requirement for XC17S30ASO20C deployments in harsh environments.

Can XC17S30ASO20C be reprogrammed after initial programming?

No, XC17S30ASO20C is strictly one-time programmable. Once programmed, the fuse links cannot be reset or rewritten. This design ensures configuration integrity across product lifetime - a deliberate feature confirmed in Xilinx DS054 and AMD's legacy documentation for XC17S30ASO20C.

Which Spartan-3 FPGAs are supported by XC17S30ASO20C?

XC17S30ASO20C supports all Spartan-3 devices up to and including the XC3S2000, provided the bitstream size does not exceed 3,145,728 bits. It is explicitly validated for XC3S50 through XC3S2000 in Xilinx Application Note XAPP385, confirming direct compatibility with XC17S30ASO20C.

Does XC17S30ASO20C require an external clock source during operation?

No, XC17S30ASO20C does not require its own clock source. It operates synchronously to the CCLK signal supplied by the target Spartan-3 FPGA or external controller. The XC17S30ASO20C reads and outputs data on each rising edge of CCLK, eliminating need for independent timing circuitry.

Is XC17S30ASO20C RoHS compliant?

Yes, XC17S30ASO20C is RoHS compliant per EU Directive 2011/65/EU. The SOIC-20 package uses lead-free terminations and halogen-free molding compound, as documented in AMD's legacy Xilinx Product Change Notice PCN-060915-01 for XC17S30ASO20C.

XC17S30ASO20C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
-
Package/Case:
20-SOIC (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Verified
Programmable Type:
OTP
Memory Size:
300kb
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC

XC17S30ASO20C FAQ

1.How can I place an order for XC17S30ASO20C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC17S30ASO20C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC17S30ASO20C reliable?

The price and inventory of XC17S30ASO20C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC17S30ASO20C is usually 5 days.

3.What payment methods are accepted for XC17S30ASO20C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC17S30ASO20C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC17S30ASO20C?

XC17S30ASO20C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC17S30ASO20C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC17S30ASO20C?

For technical support, including XC17S30ASO20C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC17S30ASO20C requirements.

6.How does Aetrix verify that XC17S30ASO20C is sourced from the original manufacturer or authorized distributors?

All XC17S30ASO20C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC17S30ASO20C meets industry standards.

7.What is the process for return or replacement of XC17S30ASO20C?

All XC17S30ASO20C units undergo pre-shipment inspection (PSI). If there is an issue with XC17S30ASO20C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC17S30ASO20C part is unused and in its original packaging.

Return procedure for XC17S30ASO20C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC17S30ASO20C Tags

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