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AMD XC18V256SO20C

Part No.:
XC18V256SO20C
Manufacturer:
AMD
Category:
Configuration PROMs for FPGAs
Package:
20-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixXC18V256SO20C.pdf
Description:
IC PROM SRL CONFIG 256K 20-SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,869

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Product details

Overview

XC18V256SO20C from Xilinx is a 262,144-bit (256 Kbit) in-system programmable 3.3V configuration PROM designed to store and serially/parallel load bitstreams into Xilinx FPGAs. It supports Master Serial, Slave Serial, Master-SelectMAP, and Slave-Parallel modes; features IEEE 1149.1 JTAG boundary-scan; offers 20,000 program/erase cycles; and uses a low-power advanced CMOS FLASH process. It is used in FPGA-based embedded control, industrial logic controllers, and reconfigurable communication interfaces.

For engineers reviewing the XC18V256SO20C datasheet, pinout, applications, or equivalent options, key selection criteria include its 256-Kbit capacity, SO20 package compatibility with Spartan-II/XC2S15 FPGAs, dual configuration mode support (serial up to 33 MHz / parallel up to 264 Mb/s), 5V-tolerant I/Os, and JTAG-initiated CONFIG functionality via CF pin.

Technical Context

The XC18V256SO20C implements a flash-based nonvolatile memory architecture with an internal address counter driven by CLK under CE Low and OE/RESET High conditions. Its JTAG TAP controller supports required instructions (BYPASS, SAMPLE/PRELOAD, EXTEST) and XC18V00-specific CONFIG instruction to pulse CF low for FPGA reset and configuration initiation.

It operates in two primary interface modes: serial (D0 only, 1-bit data path) and parallel (D0–D7, 8-bit data path), selectable via user control register programmed through JTAG. The device uses separate VCC (3.3V core) and VCCO (3.3V or 2.5V output drivers) supplies and maintains 5V tolerance on all I/O pins regardless of supply sequencing order.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Capacity262,144 bits (256 Kbit) - stores full configuration bitstream for Xilinx XC2S15 or XC2S30 FPGAs.
Configuration ModesSerial (up to 33 MHz) and Parallel (up to 264 Mb/s at 33 MHz) - enables flexible FPGA boot timing and bandwidth matching.
Endurance20,000 program/erase cycles - supports field firmware updates and design iteration without PROM replacement.
I/O Voltage Tolerance5V tolerant inputs - allows direct interfacing with legacy 5V logic without level shifters in mixed-voltage systems.
Output Drive VoltageConfigurable 3.3V or 2.5V outputs (via VCCO) - matches FPGA I/O bank voltage requirements for reliable signal integrity.
JTAG ComplianceFully compliant with IEEE Std 1149.1 - enables standardized in-system programming, verification, and boundary-scan test across production and debug environments.
Data RetentionMinimum 20 years - ensures long-term reliability for industrial and infrastructure deployments without refresh.

Pinout & Package

XC18V256SO20C is housed in a 20-pin Small Outline Integrated Circuit (SOIC) package with 0.300-inch body width and standard gull-wing lead form. Pin assignments are fixed per Xilinx DS026 v3.9 and validated for SO20 top-view orientation.

Pin/TerminalCircuit RoleDesign Meaning
D0Serial Data OutputDrives FPGA DIN pin in Master/Slave Serial mode; active only when CE=Low and OE/RESET=High.
CLKConfiguration Clock InputAccepts rising-edge-triggered clock from FPGA CCLK (Master modes) or external oscillator (Slave modes).
TDIJTAG Serial InputReceives JTAG instruction/data; internal 50 kΩ pull-up ensures logic high if unconnected.
TMSJTAG Mode SelectControls TAP state transitions; internal 50 kΩ pull-up provides default logic high.
TCKJTAG Test ClockSequences TAP controller; minimum period 100 ns (50 ns in Bypass mode).
CF/D4*Configuration Initiation OutputRouted to pin 7 in SO20; pulsed low (300–500 ns) by JTAG CONFIG instruction to trigger FPGA PROGRAM pin.
OE/RESETOutput Enable / Reset ControlBidirectional open-drain pin; held low during power-up reset; drives FPGA INIT pin to synchronize configuration start.
CEChip Enable InputHigh = standby mode (address reset, outputs high-Z); Low = active operation (counter increments on CLK).
CEOCascade Enable OutputOpen-drain output; goes low after terminal count to enable next PROM in daisy chain.
VCCCore Power Supply+3.3V supply for internal logic and input buffers; sequencing independent of VCCO or 5V signals.
VCCOOutput Driver Supply+3.3V or +2.5V supply for DATA pins; sets output voltage level to match target FPGA I/O bank.
GNDGround ReferenceCommon return path for VCC, VCCO, and all signal pins; multiple pins (11, 19) ensure low-impedance grounding.

Key Features

FeatureDesign Value
In-system programmability via JTAGEnables field reprogramming without socket removal; supports daisy-chained programming of multiple PROMs using standard 4-wire interface.
Dual configuration interfaceSerial (D0) and parallel (D0–D7) modes provide bandwidth scalability: serial for cost-sensitive designs, parallel for fast FPGA boot in high-throughput systems.
5V-tolerant I/O architectureEliminates need for external level translators when interfacing with 5V microcontrollers, CPLDs, or legacy peripherals in mixed-voltage PCBs.
JTAG CONFIG instructionHardware-level FPGA reset and configuration initiation without host processor involvement - critical for autonomous recovery and remote reconfiguration.
Read security bitUser-settable JTAG read-inhibit feature prevents unauthorized extraction of configuration bitstream while allowing erase and reprogram operations.

Applications

Industrial PLC Configuration StorageReconfigurable Communication Interface

Use Scenario: Storing FPGA configuration for real-time I/O processing in modular PLC backplanes with hot-swap capability.

IC Role / Device Role / Timing Role: Nonvolatile configuration PROM providing deterministic boot sequence and bitstream integrity verification before logic execution.

Use Value: Enables zero-downtime field upgrades via JTAG; 20,000-cycle endurance supports >10 years of scheduled firmware revisions in factory automation.

Use Scenario: Booting multi-protocol transceivers (e.g., Ethernet + CAN + SPI) on a single Spartan-II FPGA in edge gateway devices.

IC Role / Device Role / Timing Role: Dual-mode PROM delivering parallel configuration for sub-100ms boot time and serial fallback for diagnostic recovery.

Use Value: Reduces system startup latency by 60% vs. serial-only PROMs; 5V-tolerant I/O simplifies integration with legacy industrial bus controllers.

Automated Test Equipment (ATE) Pattern MemoryAvionics Reconfigurable Logic Module

Use Scenario: Storing stimulus/response patterns for FPGA-accelerated digital vector testing in semiconductor ATE platforms.

IC Role / Device Role / Timing Role: High-reliability configuration storage with JTAG-accessible USERCODE register for traceable pattern version identification.

Use Value: Supports automated calibration and pattern validation workflows; 20-year data retention meets MIL-STD-883 Class B requirements.

Use Scenario: Configuring radiation-tolerant Xilinx FPGAs in satellite payload subsystems requiring in-orbit reprogramming.

IC Role / Device Role / Timing Role: Secure, cascaded PROM chain enabling fault-isolated bitstream loading across redundant FPGA channels.

Use Value: Read security bit prevents IP leakage; CEO-driven daisy chain ensures synchronized configuration across triple-modular-redundant logic blocks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar configuration PROM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC18V256PC20CIdentical 256-Kbit capacity and electrical specs; uses 20-pin PLCC package instead of SO20.PLCC offers easier manual rework and socket compatibility but larger footprint and lower thermal performance than SOIC.Select PC20 for prototyping or repair scenarios requiring socket-based replacement; SO20 preferred for volume production with automated assembly.
XC18V512SO20CDouble capacity (512 Kbit); same SO20 package, pinout, and timing; requires updated bitstream generation.Supports larger FPGAs (e.g., XC2S50) or dual-bitstream storage for partial reconfiguration schemes.Choose when future FPGA upgrades or multi-image boot requirements are anticipated; no PCB change needed due to pin compatibility.

Compared with XC18V256PC20C and XC18V512SO20C, the XC18V256SO20C delivers optimal cost-per-bit for Spartan-II/XC2S15-based systems where board space and thermal constraints favor surface-mount SOIC packaging and 256-Kbit capacity suffices for full configuration.

Availability

XC18V256SO20C is available at Aetrix Electronics and suitable for industrial PLCs, avionics reconfigurable modules, and automated test equipment requiring stable component supply, long-lifecycle support, and guaranteed 20-year data retention.

Supply support for XC18V256SO20C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic and FPGA technology, specializing in adaptive computing solutions for aerospace, industrial, and communications markets.

The XC18V00 series was designed specifically to provide secure, in-system programmable configuration storage for Xilinx's early-generation FPGAs-including Spartan and Virtex families-enabling field-upgradable, high-integrity boot architectures.

FAQ

What configuration modes does the XC18V256SO20C support?

The XC18V256SO20C supports serial (Master/Slave) and parallel (Slave-Parallel/SelectMAP) configuration modes. Serial mode uses D0 only and operates up to 33 MHz; parallel mode uses D0–D7 and achieves up to 264 Mb/s at 33 MHz. Mode selection is performed via JTAG-programmable control register using Xilinx iMPACT software. The XC18V256SO20C defaults to serial mode after power-up or erase.

How is the CF function implemented on the XC18V256SO20C given its 20-pin SOIC package?

Because the XC18V256SO20C lacks a dedicated CF pin, the CF function is routed to pin 7 (D4) via the CF → D4 programming option. This routing is enabled only when parallel mode is disabled - ensuring D4 remains available as a data pin in parallel configurations. The JTAG CONFIG instruction pulses this pin low for 300–500 ns to initiate FPGA reconfiguration, and it must be connected to the FPGA's PROGRAM pin to function.

What are the power supply requirements for the XC18V256SO20C?

The XC18V256SO20C requires two independent supplies: VCC = +3.3V ±5% for core logic and input buffers, and VCCO = +3.3V or +2.5V for output drivers. All I/O pins are 5V tolerant regardless of supply sequencing order. OE/RESET is an open-drain bidirectional pin pulled high externally (typically 4.7 kΩ to VCC) to release FPGA INIT after power stabilization (~1 ms).

Can multiple XC18V256SO20C devices be cascaded, and how does CEO work?

Yes - XC18V256SO20C devices can be daisy-chained using the CEO (Chip Enable Output) pin. When the internal address counter exceeds the terminal count (TC), CEO goes low and enables the CE input of the next PROM in the chain. CLK and DATA lines are shared across all devices. Cascading allows storage of longer bitstreams or multiple configurations; the XC18V256SO20C's CEO behavior is identical across all XC18V00 family members.

Does the XC18V256SO20C support read protection, and how is it configured?

Yes - the XC18V256SO20C includes a user-settable read security bit that inhibits JTAG readback of the configuration array while permitting program/erase operations. It is configured via Xilinx iMPACT software using the "Security Bit" setting. Once set, the only way to clear it is to perform a full device erase, which resets all memory contents including the security bit itself.

XC18V256SO20C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
-
Package/Case:
20-SOIC (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Programmable Type:
In System Programmable
Memory Size:
256Kb
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC

XC18V256SO20C FAQ

1.How can I place an order for XC18V256SO20C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC18V256SO20C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC18V256SO20C reliable?

The price and inventory of XC18V256SO20C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC18V256SO20C is usually 5 days.

3.What payment methods are accepted for XC18V256SO20C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC18V256SO20C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC18V256SO20C?

XC18V256SO20C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC18V256SO20C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC18V256SO20C?

For technical support, including XC18V256SO20C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC18V256SO20C requirements.

6.How does Aetrix verify that XC18V256SO20C is sourced from the original manufacturer or authorized distributors?

All XC18V256SO20C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC18V256SO20C meets industry standards.

7.What is the process for return or replacement of XC18V256SO20C?

All XC18V256SO20C units undergo pre-shipment inspection (PSI). If there is an issue with XC18V256SO20C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC18V256SO20C part is unused and in its original packaging.

Return procedure for XC18V256SO20C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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