AMD XC18V256SO20I
- Part No.:
- XC18V256SO20I
- Manufacturer:
- AMD
- Category:
- Configuration PROMs for FPGAs
- Package:
- 20-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
XC18V256SO20I.pdf
- Description:
- IC PROM SER I-TEMP 3.3V 20-SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC18V256SO20I from Xilinx is a 262,144-bit (256 Kbit) in-system programmable 3.3V configuration PROM designed to store and serially/parallel load bitstreams into Xilinx FPGAs. It supports Master Serial, Slave Serial, Master-SelectMAP, and Slave-Parallel modes; features 5V-tolerant I/Os; offers 20,000 program/erase cycles; and operates across industrial temperature range (–40°C to +85°C). It is used in FPGA-based embedded control, communications infrastructure, and reconfigurable computing systems.
For engineers reviewing the XC18V256SO20I datasheet, pinout, applications, or equivalent options, key selection criteria include its 20-pin SOIC package compatibility with Spartan-II/Spartan-IIE and Virtex families, JTAG-initiated CONFIG capability via CF pin, dual-mode configuration flexibility (serial up to 33 MHz / parallel up to 264 Mb/s), and industrial-grade reliability with 20-year data retention.
Technical Context
The XC18V256SO20I implements a flash-based nonvolatile memory architecture with integrated JTAG TAP controller compliant to IEEE Std 1149.1. Its internal address counter advances on each rising CLK edge when CE = Low and OE/RESET = High, enabling deterministic sequential readout synchronized to FPGA CCLK.
It supports cascading via CEO-to-CE daisy-chaining for multi-PROM configurations and provides dedicated boundary-scan instructions including CONFIG (11101110b) to pulse CF low and trigger FPGA reconfiguration without power cycle. The device uses an advanced CMOS FLASH process with 3.3V core (VCC) and selectable 3.3V/2.5V output drivers (VCCO).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 262,144 bits (256 Kbit) - stores full configuration bitstream for Xilinx XC2S15 or XC2S30 FPGAs. |
| Configuration Modes | Serial Slow/Fast (up to 33 MHz) and Parallel (up to 264 Mb/s at 33 MHz) - enables flexible interface matching to FPGA mode pins (M0–M2). |
| Endurance | 20,000 program/erase cycles - supports field firmware updates and design iteration without PROM replacement. |
| Data Retention | Minimum 20 years - ensures long-term reliability in unattended industrial deployments. |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments including base station equipment and motor control systems. |
| I/O Voltage Tolerance | 5V tolerant inputs - allows direct interfacing with legacy 5V logic without level shifters in mixed-voltage systems. |
| Output Drive Voltage | Configurable 3.3V or 2.5V (via VCCO) - matches FPGA I/O bank voltage requirements for reliable signal integrity. |
Pinout & Package
XC18V256SO20I is housed in a 20-pin Small Outline Integrated Circuit (SOIC) package with 0.300-inch body width and standard JEDEC MS-013 footprint. Pin 1 is marked by a notch or dot; pins are numbered counterclockwise from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D0 | Serial Data Output | Drives FPGA DIN pin in Master/Slave Serial mode; active only when CE = Low and OE/RESET = High. |
| CLK | Configuration Clock Input | Accepts FPGA-generated CCLK (Master modes) or external oscillator (Slave modes); increments internal address counter on rising edge. |
| TDI | JTAG Serial Input | Shifts instruction/data into TAP controller; internal 50 kΩ pull-up ensures logic "1" if left floating. |
| TMS | JTAG Mode Select | Controls TAP state transitions on rising TCK edge; internal 50 kΩ pull-up maintains default state. |
| TCK | JTAG Test Clock | Sequences TAP controller and boundary-scan registers; minimum period 100 ns (10 MHz max). |
| OE/RESET | Output Enable / FPGA INIT Control | Bidirectional open-drain pin; drives FPGA INIT low during reset; polarity not programmable. |
| CE | Chip Enable Input | High = standby mode (address reset, outputs high-Z); low = active read mode. |
| CEO | Cascade Enable Output | Open-drain output pulsed low when terminal count exceeded; drives CE of next PROM in chain. |
| VCC | Core Power Supply | +3.3V ±5% supply for internal logic and input buffers; decoupling required per Xilinx layout guidelines. |
| VCCO | Output Driver Supply | +3.3V or +2.5V supply setting output voltage level; must match target FPGA I/O bank voltage. |
Key Features
| Feature | Design Value |
|---|---|
| In-system programmability via JTAG | Enables field reprogramming using iMPACT software or third-party JTAG tools - eliminates socketing and manual PROM replacement. |
| Dual configuration interface support | Single device serves both serial (D0-only) and parallel (D0–D7) FPGA configurations - reduces BOM count and simplifies design reuse. |
| JTAG CONFIG instruction | Pulses CF pin low for 300–500 ns to reset and initiate FPGA configuration - enables hot reconfiguration without power cycling. |
| 5V-tolerant I/Os | Accepts 5V, 3.3V, and 2.5V input signals directly - eliminates external level translators in mixed-voltage PCB designs. |
| Industrial temperature rating | Guaranteed operation from –40°C to +85°C - suitable for deployment in harsh environments including factory automation and outdoor telecom gear. |
| Data security via read-inhibit bit | User-settable JTAG read protection prevents unauthorized bitstream extraction - critical for IP-protected FPGA designs. |
Applications
| Industrial Motor Control | Telecom Baseband Processing |
|---|---|
Use Scenario: Configuring Spartan-II FPGAs in servo drive controllers that require field-upgradable logic for adaptive motion profiles. IC Role / Device Role / Timing Role: Stores and delivers full FPGA bitstream on power-up or JTAG-triggered reconfiguration; synchronizes to FPGA CCLK in Master Serial mode. Use Value: Enables zero-downtime firmware updates via JTAG CONFIG command while maintaining real-time motor timing integrity. |
Use Scenario: Booting Virtex-E FPGAs in wireless base station channel cards where configuration reliability under thermal cycling is critical. IC Role / Device Role / Timing Role: Provides parallel configuration (D0–D7) at 33 MHz to reduce boot time; uses VCCO = 2.5V to match FPGA I/O banks. Use Value: Achieves sub-100 ms FPGA initialization with 20-year data retention - meets carrier-grade equipment MTBF requirements. |
| Reconfigurable Test Equipment | Avionics Signal Processing |
Use Scenario: Supporting multiple FPGA configurations in automated test systems that switch between DUT-specific bitstreams. IC Role / Device Role / Timing Role: Cascaded XC18V256SO20I devices store distinct bitstreams; CEO/CE chaining enables seamless mode switching. Use Value: Eliminates manual PROM swaps and reduces test setup time by >70% through JTAG-controlled configuration selection. |
Use Scenario: Configuring radiation-tolerant Spartan-IIE FPGAs in satellite payload subsystems requiring guaranteed configuration integrity. IC Role / Device Role / Timing Role: Uses OE/RESET tied to FPGA INIT to ensure deterministic reset before configuration; leverages 20,000-cycle endurance for in-orbit updates. Use Value: Meets DO-254 Level A certification requirements via documented reliability metrics (20 yr retention, industrial temp range). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar configuration PROM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC18V256PC20I | Same 256 Kbit capacity and functionality, but in 20-pin PLCC package with leaded, through-hole mounting. | Preferred for prototyping or legacy PCBs requiring socketed components; lacks SOIC's surface-mount density and thermal performance. | Select XC18V256PC20I only when board layout mandates PLCC footprint or manual rework capability is required. |
| XC18V512SO20I | Double capacity (512 Kbit), identical SO20 package, pin-compatible, same timing and voltage specs. | Supports larger FPGAs (e.g., XC2S50) or dual-bitstream storage; requires no PCB change but occupies more memory space. | Choose XC18V512SO20I when future FPGA upgrades or redundant configuration storage are anticipated - no layout or firmware changes needed. |
Compared with XC18V256PC20I, the XC18V256SO20I offers superior thermal dissipation and board-space efficiency for volume production; compared with XC18V512SO20I, it provides optimal cost/performance balance for Spartan-II/XC2S15-class FPGAs without over-provisioning memory.
Availability
XC18V256SO20I is available at Aetrix Electronics and suitable for industrial motor control, telecom baseband processing, reconfigurable test equipment, and avionics signal processing requiring stable component supply across extended product lifecycles.
Supply support for XC18V256SO20I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic and FPGA technology, delivering high-performance, configurable silicon solutions since 1984.
The XC18V00 series was designed specifically to provide robust, in-system programmable configuration memory for Xilinx FPGAs - emphasizing reliability, JTAG integration, and seamless interoperability with Spartan and Virtex families.
FAQ
What configuration modes does the XC18V256SO20I support?
The XC18V256SO20I supports Master Serial, Slave Serial, Master-SelectMAP, and Slave-Parallel modes. Serial mode uses D0 only and runs up to 33 MHz; parallel mode uses D0–D7 and achieves up to 264 Mb/s at 33 MHz. Mode selection is controlled via JTAG-accessible user bits set in Xilinx iMPACT software - the default is serial mode.
How is FPGA configuration initiated using the XC18V256SO20I?
FPGA configuration can be initiated automatically on power-up via the FPGA's mode pins, or manually using the JTAG CONFIG instruction. When executed, CONFIG pulses the CF pin low for 300–500 ns - this signal must be connected to the FPGA's PROGRAM pin. For the XC18V256SO20I (20-pin SOIC), CF is routed to pin 7 via the CF→D4 programming option when parallel mode is disabled.
Does the XC18V256SO20I support cascading with other PROMs?
Yes, the XC18V256SO20I supports daisy-chain cascading using the CEO (Chip Enable Output) pin. When the internal address counter reaches terminal count, CEO goes low and enables the CE input of the next PROM in the chain. All CLK and DATA lines are shared across the chain, allowing concatenated bitstreams for larger FPGAs like XC2V1000 or multi-FPGA systems.
What is the purpose of the VCCO pin on the XC18V256SO20I?
The VCCO pin supplies voltage to the XC18V256SO20I's output drivers and sets the logic-high level of D0–D7 and CEO outputs. It accepts either 3.3V or 2.5V, allowing direct interface with FPGA I/O banks operating at either voltage. VCCO must be decoupled independently from VCC, and its voltage must match the target FPGA's configuration I/O standard to prevent signal integrity issues.
Is the XC18V256SO20I compatible with modern Xilinx FPGA families?
The XC18V256SO20I is fully compatible with Spartan-II, Spartan-IIE, Virtex, Virtex-E, and early Virtex-II FPGAs - as confirmed in Xilinx DS026 Table 2. While newer 7-series and UltraScale FPGAs use different configuration schemes (e.g., QSPI flash), the XC18V256SO20I remains the certified solution for legacy and long-lifecycle industrial designs based on those supported families.
XC18V256SO20I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- -
- Package/Case:
- 20-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- In System Programmable
- Memory Size:
- 256Kb
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-SOIC
XC18V256SO20I FAQ
1.How can I place an order for XC18V256SO20I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC18V256SO20I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC18V256SO20I reliable?
The price and inventory of XC18V256SO20I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC18V256SO20I is usually 5 days.
3.What payment methods are accepted for XC18V256SO20I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC18V256SO20I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC18V256SO20I?
XC18V256SO20I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC18V256SO20I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC18V256SO20I?
For technical support, including XC18V256SO20I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC18V256SO20I requirements.
6.How does Aetrix verify that XC18V256SO20I is sourced from the original manufacturer or authorized distributors?
All XC18V256SO20I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC18V256SO20I meets industry standards.
7.What is the process for return or replacement of XC18V256SO20I?
All XC18V256SO20I units undergo pre-shipment inspection (PSI). If there is an issue with XC18V256SO20I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC18V256SO20I part is unused and in its original packaging.
Return procedure for XC18V256SO20I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC18V256SO20I Tags

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AT17LV512A-10PU
Microchip Technology

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EPCQ4ASI8N
Intel

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AT17LV256-10PU
Microchip Technology

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AT17LV256-10NU
Microchip Technology

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EPCQ16ASI8N
Intel

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AT17LV010-10PU
Microchip Technology

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EPCQ32ASI8N
Intel

-
EPCQ64ASI16N
Intel

-
EPCQ128ASI16N
Intel

-
AT17LV512A-10JU
Microchip Technology

-
AT17LV512-10JU
Microchip Technology

-
AT17LV010-10JU
Microchip Technology
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