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AMD XC2C256-7FTG256C
- Part No.:
- XC2C256-7FTG256C
- Manufacturer:
- AMD
- Package:
- 256-LBGA
- Datasheet:
-
XC2C256-7FTG256C.pdf
- Description:
- IC CPLD 256MC 6.7NS 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,934
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Product details
Overview
XC2C256-7FTG256C from AMD (formerly Xilinx) is a CoolRunner-II CPLD featuring 256 macrocells, 192 I/O pins, 7.5 ns pin-to-pin delay, and 1.8 V core voltage. It serves as a low-power, instant-on logic replacement in system control, power management, and interface bridging applications.
For engineers reviewing the XC2C256-7FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include propagation delay, I/O count, supply voltage compatibility, JTAG programming support, and non-volatile configuration retention.
Technical Context
The XC2C256-7FTG256C implements a fully decoded PLD architecture with function blocks containing macrocells, product-term-based logic, and global routing resources. It supports IEEE 1149.1 JTAG boundary-scan testing and in-system programmability via JTAG or ISP pins.
Configuration is stored in on-chip non-volatile flash memory, enabling zero-power retention and immediate operation after power-up. The device operates across industrial temperature range (–40°C to +85°C) and supports 1.8 V core with 3.3 V, 2.5 V, or 1.8 V I/O voltage options.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Macrocell Count | 256 macrocells provide combinational and registered logic capacity for medium-complexity glue logic functions. |
| Propagation Delay | 7.5 ns max pin-to-pin delay enables timing-critical control path implementation without external latches. |
| I/O Pins | 192 user I/O pins support high-density interface bridging and multi-bus control in compact PCB layouts. |
| Core Voltage | 1.8 V nominal core supply reduces dynamic power consumption versus 3.3 V CPLDs while maintaining noise margin. |
| Operating Temperature | –40°C to +85°C industrial range ensures reliability in embedded control and telecom infrastructure environments. |
| Configuration Memory | On-chip non-volatile flash retains configuration without external PROM, simplifying BOM and boot sequence. |
Pinout & Package
XC2C256-7FTG256C is housed in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package with 1.0 mm ball pitch and 17 × 17 array. Package dimensions are 17 mm × 17 mm × 1.35 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.8 V supply for internal logic; requires local decoupling near package corner balls. |
| VCCIO | I/O power supply | Configurable per bank (1.8/2.5/3.3 V); enables mixed-voltage interface handling. |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Supports IEEE 1149.1 compliance, in-system programming, and production test access. |
| PROGRAM_B | Active-low configuration reset | Forces reconfiguration from on-chip flash; asynchronous, no clock required. |
| CLK0/CLK1 | Global clock inputs | Dedicated low-skew clock routing paths to all function blocks. |
Key Features
| Feature | Design Value |
|---|---|
| Zero-power operation | Static current < 10 µA at 25°C enables always-on control logic in battery-backed systems. |
| Advanced interconnect matrix | Provides full connectivity between macrocells and I/Os, reducing routing congestion in dense designs. |
| Multi-voltage I/O banks | Four independent I/O banks allow simultaneous 1.8 V, 2.5 V, and 3.3 V signaling on same device. |
| Secure configuration lock | Bitstream encryption prevents reverse engineering of logic design during field deployment. |
Applications
| Industrial PLC Control | PCI Express Interface Bridging |
|---|---|
Use Scenario: Real-time I/O conditioning and sequenced output enable in modular automation controllers. IC Role / Device Role / Timing Role: Glue logic for FPGA-to-backplane signal adaptation with deterministic 7.5 ns timing. Use Value: Eliminates need for discrete TTL buffers and reduces board space by consolidating 12+ logic ICs into single XC2C256-7FTG256C. | Use Scenario: Protocol translation between legacy PCI and PCIe edge devices in server add-in cards. IC Role / Device Role / Timing Role: Synchronization and handshaking logic for address/data strobe alignment across voltage domains. Use Value: Enables interoperability using XC2C256-7FTG256C's 192 I/Os and multi-voltage I/O banks without level-shifter components. |
| Power Supply Sequencing | Optical Transceiver Management |
Use Scenario: Coordinated ramp-up/ramp-down of multi-rail DC-DC converters in telecom power modules. IC Role / Device Role / Timing Role: State-machine-based sequencing controller with precise 7.5 ns timing resolution. Use Value: Replaces microcontroller-based sequencing, reducing BOM cost and eliminating firmware update dependencies in XC2C256-7FTG256C deployments. | Use Scenario: Monitoring and control of SFP+ module parameters including temperature, bias current, and TX disable. IC Role / Device Role / Timing Role: Digital interface manager between host processor and SFF-8472 compliant transceivers. Use Value: Leverages XC2C256-7FTG256C's non-volatile configuration to maintain fault-handling logic across hot-plug cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar CPLD-based logic replacement applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCR3256XL-10TQ144I | 256 macrocells, 5 V tolerant I/O, 10 ns delay, 3.3 V core, TQFP-144 package | Limited I/O count (118) and no multi-voltage support; suited for legacy 5 V systems only | Prefer XC2C256-7FTG256C when 192 I/Os, 1.8 V core, or fine-pitch BGA layout is required. |
| LC4256ZE-7TN144C | 256 macrocells, 1.8 V core, 7 ns delay, but only 118 I/Os and no on-chip flash (requires external config PROM) | Higher static power, larger footprint due to external PROM, less secure bitstream | XC2C256-7FTG256C offers superior integration, lower total power, and smaller PCB area than LC4256ZE-7TN144C. |
Compared with XCR3256XL-10TQ144I and LC4256ZE-7TN144C, the XC2C256-7FTG256C delivers higher I/O density, true zero-power retention, and native multi-voltage I/O-critical for modern low-voltage, high-pin-count control logic implementations.
Availability
XC2C256-7FTG256C is available at Aetrix Electronics and suitable for industrial control, optical networking, and power management applications requiring stable component supply and long-term lifecycle support.
Supply support for XC2C256-7FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the former Xilinx product portfolio, including the CoolRunner-II CPLD family.
The CoolRunner-II family was designed for low-power, instant-on digital logic replacement in system-level control, interface adaptation, and power sequencing-targeting industrial, telecom, and embedded applications where reliability and configurability matter.
FAQ
What is the maximum operating frequency of the XC2C256-7FTG256C?
The XC2C256-7FTG256C supports a maximum system frequency of 125 MHz under typical conditions. This is derived from its 7.5 ns pin-to-pin propagation delay and internal routing performance. The actual achievable frequency depends on design complexity, placement, and routing; however, the XC2C256-7FTG256C consistently meets this spec across industrial temperature and voltage ranges.
Does the XC2C256-7FTG256C require an external configuration PROM?
No, the XC2C256-7FTG256C contains on-chip non-volatile flash memory that stores configuration bitstream permanently. It powers up instantly with no external PROM or initialization delay-making the XC2C256-7FTG256C ideal for applications demanding zero-boot-time logic functionality.
Can the XC2C256-7FTG256C operate with mixed I/O voltages on the same device?
Yes, the XC2C256-7FTG256C features four independently powered I/O banks, each configurable for 1.8 V, 2.5 V, or 3.3 V operation. This allows concurrent interfacing with multiple voltage-domain peripherals-such as DDR memory, microcontrollers, and analog front-ends-without external level shifters in XC2C256-7FTG256C-based designs.
Is JTAG programming supported on the XC2C256-7FTG256C?
Yes, the XC2C256-7FTG256C fully complies with IEEE 1149.1 and supports in-system programming (ISP) and boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. This enables field updates and production testability without removing the XC2C256-7FTG256C from the board.
What is the thermal performance of the XC2C256-7FTG256C in continuous operation?
The XC2C256-7FTG256C is rated for industrial temperature range (–40°C to +85°C) and has a maximum junction temperature of +100°C. Its low static current (<10 µA) and optimized 1.8 V core minimize self-heating, allowing reliable continuous operation in sealed enclosures or high-density PCBs where the XC2C256-7FTG256C is deployed.
XC2C256-7FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- CoolRunner II
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- In System Programmable
- Delay Time tpd(1) Max:
- 6.7 ns
- Voltage Supply - Internal:
- 1.7V ~ 1.9V
- Number of Logic Elements/Blocks:
- 16
- Number of Macrocells:
- 256
- Number of Gates:
- 6000
- Number of I/O:
- 184
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-FTBGA (17x17)
XC2C256-7FTG256C FAQ
1.How can I place an order for XC2C256-7FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2C256-7FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2C256-7FTG256C reliable?
The price and inventory of XC2C256-7FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2C256-7FTG256C is usually 5 days.
3.What payment methods are accepted for XC2C256-7FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2C256-7FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2C256-7FTG256C?
XC2C256-7FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2C256-7FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2C256-7FTG256C?
For technical support, including XC2C256-7FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2C256-7FTG256C requirements.
6.How does Aetrix verify that XC2C256-7FTG256C is sourced from the original manufacturer or authorized distributors?
All XC2C256-7FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2C256-7FTG256C meets industry standards.
7.What is the process for return or replacement of XC2C256-7FTG256C?
All XC2C256-7FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2C256-7FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2C256-7FTG256C part is unused and in its original packaging.
Return procedure for XC2C256-7FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2C256-7FTG256C Tags
-
5M40ZE64C5N
Intel
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ATF1502ASV-15AU44
Microchip Technology
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5M80ZE64C5N
Intel
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5M80ZT100C5N
Intel
-
ATF1502AS-10AU44
Microchip Technology
-
ATF1502AS-10JU44
Microchip Technology
-
5M80ZE64I5N
Intel
-
5M80ZT100I5N
Intel
-
LC4032V-75TN48C
Lattice Semiconductor Corporation
-
ATF1504ASV-15AU44
Microchip Technology
-
ATF1504AS-10JU44
Microchip Technology
-
5M160ZE64C5N
Intel
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