My Inquiry
My Account
AMD XC2C256-7FTG256I
- Part No.:
- XC2C256-7FTG256I
- Manufacturer:
- AMD
- Package:
- 256-LBGA
- Datasheet:
-
XC2C256-7FTG256I.pdf
- Description:
- IC CPLD 256MC 6.7NS 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,532
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2C256-7FTG256I from AMD (formerly Xilinx) is a CoolRunner-II CPLD featuring 256 macrocells, 192 I/O pins, 7.5 ns pin-to-pin delay, and 1.8 V core voltage. It implements synchronous logic in low-power portable and battery-operated systems requiring deterministic timing and non-volatile configuration.
For engineers reviewing the XC2C256-7FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include propagation delay, I/O count, supply voltage compatibility, JTAG programming support, and industrial temperature range operation.
Technical Context
The XC2C256-7FTG256I uses a fully decoded product-term architecture with function generators, macrocells, and global routing resources. It supports IEEE 1149.1 JTAG boundary-scan testing and in-system programmability via JTAG or ISP pins.
Configuration is stored in on-chip non-volatile flash memory, enabling instant-on operation without external configuration PROM. The device operates across –40°C to +85°C and supports 1.8 V core with 3.3 V, 2.5 V, or 1.8 V I/O standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Macrocell Count | 256 macrocells provide combinational and registered logic capacity for medium-complexity glue logic or state-machine implementation. |
| Pin-to-Pin Delay | 7.5 ns maximum ensures predictable timing closure in high-speed control paths without external timing compensation. |
| I/O Pins | 192 user I/O pins support flexible interface bridging between legacy and modern peripherals in space-constrained PCBs. |
| Core Voltage | 1.8 V core enables low static power consumption (< 10 µA standby), critical for battery-powered applications. |
| Operating Temperature | –40°C to +85°C industrial range guarantees reliable operation in embedded control and industrial automation environments. |
| Configuration Memory | Non-volatile flash retains configuration after power cycle, eliminating boot-time FPGA reconfiguration overhead. |
Pinout & Package
XC2C256-7FTG256I is housed in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package with 1.0 mm ball pitch and 17 × 17 array layout. The package supports standard reflow soldering and provides thermal and electrical performance suitable for industrial-grade designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TCK, TMS, TDI, TDO | JTAG Test Access Port | Enable IEEE 1149.1 boundary-scan testing and in-system programming without dedicated programming hardware. |
| IO_L0_0 through IO_L15_15 | Configurable I/O Banks | Support mixed-voltage I/O (1.8/2.5/3.3 V) per bank; each pin configurable as input, output, or bidirectional with slew-rate control. |
| CLK0–CLK3 | Global Clock Inputs | Dedicated low-skew clock routing to all macrocells; supports asynchronous reset and clock enable functions. |
| GTS0, GTS1 | Global Three-State Enables | Simultaneously disable output drivers across multiple I/O banks for bus arbitration or power gating. |
| VCCINT | Core Power Supply | 1.8 V regulated supply required for internal logic; decoupling capacitors must be placed within 10 mm of each pin. |
| VCCO_0–VCCO_3 | I/O Bank Power Supplies | Independent voltage rails per I/O bank allow interfacing with multiple voltage domains on same device. |
Key Features
| Feature | Design Value |
|---|---|
| Zero-Power Technology | Dynamic power scales with toggle rate; static current < 10 µA at 25°C enables always-on logic in energy-sensitive systems. |
| Advanced Interconnect Matrix | Provides full connectivity between macrocells and I/Os with < 2% routing congestion even at >90% utilization. |
| Multi-Voltage I/O Support | Each of four I/O banks independently configurable for 1.8 V, 2.5 V, or 3.3 V signaling-no level shifters needed for mixed-voltage boards. |
| Secure In-System Programming | JTAG-based ISP supports encrypted bitstream loading and readback protection to prevent IP theft during field updates. |
Applications
| Industrial PLC I/O Expansion | Automotive Body Control Module |
|---|---|
Use Scenario: Adding isolated digital input/output channels to legacy PLC backplanes using existing 24 V logic levels and optocoupled interfaces. IC Role / Device Role / Timing Role: Glue logic CPLD implementing signal conditioning, debounce, and protocol translation between microcontroller and field-side I/O. Use Value: Eliminates need for discrete logic ICs and reduces board area by 65% while maintaining deterministic 7.5 ns response time. | Use Scenario: Managing door lock actuators, window lift motors, and interior lighting sequences in automotive body electronics modules. IC Role / Device Role / Timing Role: Configurable logic unit handling PWM generation, fault detection, and CAN message preprocessing before MCU handoff. Use Value: Enables single-chip replacement of 8–10 discrete SMT logic devices, reducing BOM cost and improving thermal reliability at 85°C ambient. |
| Medical Infusion Pump Controller | Test Equipment Digital Pattern Generator |
Use Scenario: Real-time monitoring of motor stall, air-in-line, and occlusion sensors in Class II medical infusion pumps with safety-critical timing constraints. IC Role / Device Role / Timing Role: Safety monitor CPLD performing independent watchdog supervision and hardware-enforced interlock logic outside main MCU domain. Use Value: Provides fail-safe response within 7.5 ns to sensor faults-meeting IEC 62304 SW safety Class C requirements without software intervention. | Use Scenario: Generating precise digital stimulus waveforms (up to 133 MHz) for validating ASIC and FPGA functional behavior during ATE testing. IC Role / Device Role / Timing Role: High-speed pattern generator CPLD driving parallel test vectors with sub-ns skew control across 192 pins. Use Value: Delivers deterministic 7.5 ns timing margin for 100+ MHz vector rates, reducing test time by 22% versus FPGA-based solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar CPLD-based glue logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCR3256XL-10TQ144I | 256 macrocells, 10 ns delay, 3.3 V core, TQFP-144 package (144 pins, smaller I/O count) | Limited to 118 user I/Os; lacks multi-voltage I/O banks and zero-power mode | Preferred where PCB space is constrained and 3.3 V-only I/O suffices; not suitable for battery-powered or mixed-voltage designs. |
| LC4256ZE-7TN144C | 256 macrocells, 7.5 ns delay, 1.8 V core, but only 118 I/Os and no JTAG boundary-scan | No IEEE 1149.1 support; requires external programming adapter; lower thermal rating (0°C to +70°C) | Valid for cost-sensitive consumer applications with simplified test requirements and commercial temperature needs. |
Compared with XC2C256-7FTG256I, the XCR3256XL-10TQ144I trades I/O flexibility and low-power operation for compact packaging, while the LC4256ZE-7TN144C sacrifices testability and temperature range to reduce unit cost-neither offers identical feature parity.
Availability
XC2C256-7FTG256I is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, medical device control, and automated test equipment requiring stable component supply and long-term lifecycle support.
Supply support for XC2C256-7FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the former Xilinx product portfolio, including the CoolRunner-II family of CPLDs.
The CoolRunner-II series was designed specifically for low-power, high-reliability glue logic replacement in industrial, medical, and automotive applications where instant-on operation and deterministic timing are mandatory.
FAQ
What is the maximum operating frequency supported by XC2C256-7FTG256I?
The XC2C256-7FTG256I supports internal logic operation up to 133 MHz, derived from its 7.5 ns pin-to-pin delay specification and optimized routing architecture. This frequency applies to registered outputs under worst-case industrial temperature and voltage conditions. The actual system clock rate depends on design topology, fan-out, and I/O loading-verified per implementation using Xilinx ISE software timing analysis.
Does XC2C256-7FTG256I require an external configuration PROM?
No, XC2C256-7FTG256I does not require an external configuration PROM. Its on-chip non-volatile flash memory stores the configuration bitstream permanently. Upon power-up, the XC2C256-7FTG256I loads and executes its logic immediately-enabling true instant-on behavior without boot delay or external components.
Can XC2C256-7FTG256I operate with mixed I/O voltages on the same device?
Yes, XC2C256-7FTG256I supports mixed I/O voltages: its four I/O banks can be independently powered at 1.8 V, 2.5 V, or 3.3 V. Each bank's VCCO rail is separate, allowing direct interfacing with multiple voltage-domain peripherals-such as 3.3 V sensors and 1.8 V FPGAs-without external level shifters.
Is JTAG boundary-scan supported on XC2C256-7FTG256I?
Yes, XC2C256-7FTG256I fully complies with IEEE 1149.1 and supports JTAG boundary-scan testing, in-system programming (ISP), and configuration verification. The TCK, TMS, TDI, and TDO pins are dedicated and electrically compatible with standard JTAG debuggers and programmers used in production and lab environments.
What is the standby current consumption of XC2C256-7FTG256I at 25°C?
The XC2C256-7FTG256I exhibits typical standby current of less than 10 µA at 25°C and 1.8 V VCCINT, enabled by its Zero-Power technology. This ultra-low quiescent draw makes it suitable for battery-backed systems and always-on monitoring circuits where energy budget is tightly constrained.
XC2C256-7FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- CoolRunner II
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- In System Programmable
- Delay Time tpd(1) Max:
- 6.7 ns
- Voltage Supply - Internal:
- 1.7V ~ 1.9V
- Number of Logic Elements/Blocks:
- 16
- Number of Macrocells:
- 256
- Number of Gates:
- 6000
- Number of I/O:
- 184
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-FTBGA (17x17)
XC2C256-7FTG256I FAQ
1.How can I place an order for XC2C256-7FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2C256-7FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2C256-7FTG256I reliable?
The price and inventory of XC2C256-7FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2C256-7FTG256I is usually 5 days.
3.What payment methods are accepted for XC2C256-7FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2C256-7FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2C256-7FTG256I?
XC2C256-7FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2C256-7FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2C256-7FTG256I?
For technical support, including XC2C256-7FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2C256-7FTG256I requirements.
6.How does Aetrix verify that XC2C256-7FTG256I is sourced from the original manufacturer or authorized distributors?
All XC2C256-7FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2C256-7FTG256I meets industry standards.
7.What is the process for return or replacement of XC2C256-7FTG256I?
All XC2C256-7FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2C256-7FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2C256-7FTG256I part is unused and in its original packaging.
Return procedure for XC2C256-7FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2C256-7FTG256I Tags
-
5M40ZE64C5N
Intel
-
ATF1502ASV-15AU44
Microchip Technology
-
5M80ZE64C5N
Intel
-
5M80ZT100C5N
Intel
-
ATF1502AS-10AU44
Microchip Technology
-
ATF1502AS-10JU44
Microchip Technology
-
5M80ZE64I5N
Intel
-
5M80ZT100I5N
Intel
-
LC4032V-75TN48C
Lattice Semiconductor Corporation
-
ATF1504ASV-15AU44
Microchip Technology
-
ATF1504AS-10JU44
Microchip Technology
-
5M160ZE64C5N
Intel
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
