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AMD XC2S100-5FG256C
- Part No.:
- XC2S100-5FG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2S100-5FG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,869
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Product details
Overview
XC2S100-5FG256C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 100,000 system gates, 1728 logic cells, and a 5 ns maximum input-to-output delay. It features 256-pin Fine-Pitch Ball Grid Array (FBGA) packaging, 128 kB of total block RAM, and supports 3.3 V I/O with 2.5 V internal core voltage. It is used in industrial motion control systems for real-time encoder interface and PWM generation.
For engineers reviewing the XC2S100-5FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include logic cell count, I/O voltage compatibility, block RAM capacity, timing performance at 5 ns, and FBGA256 package footprint constraints.
Technical Context
The XC2S100-5FG256C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM per CLB, and dedicated carry logic for arithmetic. It includes eight global clock buffers and supports up to 176 user I/O pins with programmable slew rate and drive strength.
Configuration is performed via serial PROM or boundary-scan (JTAG), and it supports in-system reprogramming. The device uses SRAM-based configuration memory and requires external configuration memory for power-up initialization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1728 - defines maximum combinational/sequential logic capacity for state machines or data path implementation |
| System Gates | 100,000 - industry-standard metric estimating equivalent NAND gate count for logic density comparison |
| Max I/O Pins | 176 - number of user-programmable bidirectional I/Os available in FG256 package |
| Block RAM | 128 kB - on-chip memory for FIFOs, lookup tables, or small buffer storage without external memory |
| Input-to-Output Delay | 5 ns - worst-case propagation delay critical for meeting setup/hold timing in high-speed interfaces |
| I/O Voltage | 3.3 V - compatible with LVTTL and LVCMOS33 signaling standards |
| Core Voltage | 2.5 V - required internal supply for CLB and interconnect operation |
Pinout & Package
XC2S100-5FG256C is housed in a 256-ball Fine-Pitch Ball Grid Array (FG256) package with 1.27 mm ball pitch, 17 mm × 17 mm body size, and thermal pad exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCK0–GCK7 | Global Clock Input | Dedicated low-skew inputs for clock distribution to all CLBs and I/O blocks |
| PROGRAM_B | Configuration Initiate | Active-low signal that resets configuration memory and initiates reload from external PROM |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan | IEEE 1149.1-compliant test and programming interface for debugging and in-system programming |
| VCCO_0–VCCO_7 | I/O Bank Supply | Independent 3.3 V supplies per I/O bank enabling mixed-voltage interface support |
| VCCINT | Core Power | 2.5 V supply powering CLBs, interconnect, and internal logic |
| INIT_B | Configuration Status | Open-drain output indicating successful configuration completion or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | Each contains two 4-input LUTs + two flip-flops, enabling efficient implementation of synchronous logic and registered outputs |
| Dedicated Carry Chain | Fast arithmetic path across CLBs for high-performance counters and adders without routing delay penalty |
| Eight Global Clock Buffers | Low-jitter, low-skew distribution network supporting multiple synchronous clock domains within one device |
| Programmable I/O Standards | Supports LVTTL, LVCMOS33, and PCI-compliant input thresholds with adjustable drive strength and slew rate |
| Boundary-Scan Support | Full IEEE 1149.1 compliance enables board-level testability and in-system programming without dedicated programming hardware |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time closed-loop servo control with multi-axis position feedback and PWM motor drive signals. IC Role / Device Role / Timing Role: FPGA fabric implements encoder interpolation, PID computation, and synchronized PWM generation with deterministic 5 ns timing. Use Value: Eliminates need for discrete logic and microcontroller co-processing by integrating control logic, timing, and I/O in single FG256 package. | Use Scenario: High-speed digital pattern generation and response capture for IC functional validation. IC Role / Device Role / Timing Role: Configurable I/O banks interface to DUT at 3.3 V while internal logic generates precise stimulus sequences and evaluates responses with sub-10 ns resolution. Use Value: 176 user I/Os and 5 ns delay enable parallel test vectors across multiple pins with tight timing correlation. |
| Medical Imaging Interface | Legacy System Emulation |
Use Scenario: Bridging between custom ASIC-based image sensor front-end and modern FPGA-based processing pipeline. IC Role / Device Role / Timing Role: Replaces aging gate arrays to reconstruct LVDS or CMOS image data streams using programmable I/O and on-chip RAM buffering. Use Value: 128 kB block RAM provides frame-level buffering for burst-mode sensor readout without external memory. | Use Scenario: Replicating obsolete PAL/GAL logic in avionics maintenance test rigs with unchanged PCB layout. IC Role / Device Role / Timing Role: SRAM-based configuration allows field updates to match legacy timing behavior, including setup/hold margins and propagation delays. Use Value: 5 ns max delay and pin-compatible migration path from XC2S50-5FG256C or XC2S150-5FG256C variants. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-5FG256C | Higher logic density (2176 CLBs, 150K gates), same FG256 package and I/O structure | Supports larger state machines and wider datapaths; requires identical PCB but higher power and thermal management | Select when design exceeds XC2S100-5FG256C resource utilization by >15% and board space is constrained |
| XC3S200-4FT256C | Spartan-3 generation; 200K system gates, 4.6 ns delay, 256-ball FTBGA (same footprint but different ball map) | Improved DSP slice count and lower static power; not pin-compatible due to altered I/O bank assignment and VREF placement | Choose for new designs requiring higher performance or lower power; redesign required for XC2S100-5FG256C replacement |
Compared with XC2S100-5FG256C, XC2S150-5FG256C offers direct upgrade path with no PCB change, while XC3S200-4FT256C delivers better speed/power trade-off but mandates layout revision due to non-identical pin mapping and voltage reference requirements.
Availability
XC2S100-5FG256C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, medical imaging interface, and legacy system emulation requiring stable component supply and long-term obsolescence mitigation.
Supply support for XC2S100-5FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now oversees the legacy Spartan FPGA product lines, maintaining long-term support for industrial and aerospace customers.
The Spartan-II family, including XC2S100-5FG256C, was designed for cost-sensitive, high-volume embedded logic replacement-targeting applications where gate count, I/O flexibility, and predictable timing outweigh advanced features like embedded processors or high-speed transceivers.
FAQ
What is the configuration method supported by XC2S100-5FG256C?
XC2S100-5FG256C supports master serial, slave serial, and JTAG boundary-scan configuration modes. It loads configuration bitstream from external PROM on power-up or via PROGRAM_B assertion. JTAG mode enables in-system programming and debugging without interrupting system operation. The XC2S100-5FG256C does not support configuration from processor bus or parallel mode.
Does XC2S100-5FG256C support mixed-voltage I/O operation?
Yes, XC2S100-5FG256C supports mixed-voltage I/O through eight independent I/O banks, each with its own VCCO supply. Each bank can be set to 3.3 V and configured for LVTTL or LVCMOS33 standards. The XC2S100-5FG256C does not support 1.8 V or 2.5 V I/O standards natively.
What is the maximum operating junction temperature for XC2S100-5FG256C?
The XC2S100-5FG256C has a maximum junction temperature rating of 85 °C for commercial-grade operation (denoted by 'C' suffix). Thermal design must ensure die temperature remains below this limit under full logic utilization and worst-case ambient conditions. The XC2S100-5FG256C does not specify extended or industrial temperature grades in this variant.
Can XC2S100-5FG256C be reconfigured in-system without power cycling?
Yes, XC2S100-5FG256C supports in-system reconfiguration via JTAG or by asserting PROGRAM_B while maintaining power. Configuration memory is SRAM-based and volatile, so the XC2S100-5FG256C reloads from external PROM after each PROGRAM_B pulse. No FPGA-specific configuration controller is required beyond standard JTAG TAP or serial PROM interface.
Is XC2S100-5FG256C pin-compatible with other Spartan-II devices in FG256 package?
XC2S100-5FG256C shares identical FG256 mechanical footprint and ball map with XC2S50-5FG256C and XC2S150-5FG256C, enabling drop-in replacement among these three variants. Power and configuration pins are fixed; I/O pin assignments match across the family. The XC2S100-5FG256C differs only in logic resource count and internal routing capacity-not pin function or location.
XC2S100-5FG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 600
- Number of Logic Elements/Cells:
- 2700
- Total RAM Bits:
- 40960
- Number of I/O:
- 176
- Number of Gates:
- 100000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2S100-5FG256C FAQ
1.How can I place an order for XC2S100-5FG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S100-5FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S100-5FG256C reliable?
The price and inventory of XC2S100-5FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S100-5FG256C is usually 5 days.
3.What payment methods are accepted for XC2S100-5FG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S100-5FG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S100-5FG256C?
XC2S100-5FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S100-5FG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S100-5FG256C?
For technical support, including XC2S100-5FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S100-5FG256C requirements.
6.How does Aetrix verify that XC2S100-5FG256C is sourced from the original manufacturer or authorized distributors?
All XC2S100-5FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S100-5FG256C meets industry standards.
7.What is the process for return or replacement of XC2S100-5FG256C?
All XC2S100-5FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S100-5FG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S100-5FG256C part is unused and in its original packaging.
Return procedure for XC2S100-5FG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2S100-5FG256C Tags
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ICE40UL1K-CM36AI
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ICE5LP1K-SG48ITR
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ICE40LP1K-CM36
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LCMXO2-256ZE-1SG32I
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