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AMD XC2S100-5FG256I
- Part No.:
- XC2S100-5FG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2S100-5FG256I.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,250
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Product details
Overview
XC2S100-5FG256I from AMD (formerly Xilinx) is a Spartan-II family FPGA with 100,000 system gates, 1728 logic cells, and a 5 ns maximum input-to-output delay. It features 256-pin Fine-Pitch Ball Grid Array (FBGA) packaging, operates at 3.3 V I/O, and supports IEEE 1149.1 JTAG boundary-scan testing. It is used in industrial control logic replacement and low-cost digital signal preprocessing.
For engineers reviewing the XC2S100-5FG256I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count (176 user I/Os), speed grade (-5), thermal performance in FBGA-256, and compatibility with Xilinx ISE 6.x–14.x design tools.
Technical Context
The XC2S100-5FG256I implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM up to 56 kbits, and global clock routing with four dedicated clock pins. It supports SelectIO standards including LVTTL, LVCMOS, and PCI-compliant 3.3 V signaling.
Configuration is performed via serial PROM or master/slave parallel mode using internal startup circuitry. The device includes internal pull-up resistors on configuration pins and supports multi-boot through external address lines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 100,000 system gates - defines maximum combinational logic complexity for gate-equivalent designs |
| Logic Cells | 1,728 CLBs - each contains two 4-input LUTs and two registers, enabling pipelined synchronous logic |
| Max I/O Count | 176 user I/Os - supports high-pin-count peripheral interfacing in compact PCB layouts |
| Speed Grade | -5 - guarantees 5 ns input-to-output propagation delay under worst-case commercial conditions |
| Package | 256-pin FBGA (Fine-Pitch BGA) - 17 mm × 17 mm body, 1.0 mm ball pitch, JEDEC MO-205 standard |
| VCCINT / VCCO | 2.5 V core / 3.3 V I/O - enables mixed-voltage operation with legacy 3.3 V peripherals |
| Configuration Mode | Serial PROM or parallel master/slave - allows flexible boot architecture without external microcontroller |
Pinout & Package
XC2S100-5FG256I is housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA) package compliant with JEDEC MO-205AB. The package provides 176 user I/Os, 4 dedicated global clock inputs, 8 power/ground pairs for core and I/O banks, and 12 configuration interface pins (including INIT_B, PROGRAM_B, DONE, TCK/TMS/TDI/TDO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO_LxxYy_# | User-configurable I/O bank pin | Supports programmable drive strength, slew rate, and input termination per bank |
| CLK0–CLK3 | Dedicated global clock input | Low-skew routing to all CLBs; required for synchronous timing-critical paths |
| PROGRAM_B | Active-low configuration initiator | Pulls device into configuration mode when asserted; asynchronous reset to known state |
| DONE | Open-drain configuration status output | Drives high when configuration completes successfully; used for system readiness handshake |
| INIT_B | Active-low initialization indicator | Signals configuration error or incomplete bitstream loading; resets internal logic |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables in-system programming, debugging, and production test without physical probe access |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | 1728 CLBs with dual 4-LUT + dual FF per CLB enable efficient register-rich datapath implementation |
| Distributed RAM | Up to 56 kbits of fast synchronous RAM built into CLBs - eliminates need for external SRAM in small buffers |
| SelectIO Technology | Per-bank voltage selection (3.3 V only on this variant) supports mixed-signaling without level shifters |
| Four Global Clock Nets | Provides low-jitter, low-skew clock distribution across full die - critical for >100 MHz synchronous designs |
| IEEE 1149.1 JTAG Support | Enables boundary-scan testing and in-system programming - reduces test fixture cost and field update time |
Applications
| Industrial PLC Logic Replacement | Automotive Body Control Module |
|---|---|
Use Scenario: Replacing discrete TTL/PLD-based ladder logic in legacy programmable logic controllers with field-upgradable digital logic. IC Role / Device Role / Timing Role: Configurable state machine and I/O interface controller managing relay drivers, sensor inputs, and HMI communication. Use Value: Reduces board space by 60% vs. discrete logic and enables firmware updates without hardware change. | Use Scenario: Centralized control of door locks, window lifts, and interior lighting in entry-level automotive platforms. IC Role / Device Role / Timing Role: Real-time I/O aggregator and protocol translator between LIN bus sensors and local CAN gateway. Use Value: Supports 176 I/Os for direct connection to 20+ actuators/sensors; -5 speed grade ensures sub-500 ns response latency. |
| Medical Infusion Pump Controller | Test Equipment Pattern Generator |
Use Scenario: Safety-critical motor sequencing and fault monitoring in Class II medical infusion devices requiring IEC 62304 compliance. IC Role / Device Role / Timing Role: Dual-redundant safety monitor and stepper motor phase sequencer with watchdog timer integration. Use Value: Internal configuration memory and JTAG trace support simplify DO-254/IEC 62304 verification and audit trails. | Use Scenario: Generating precise digital stimulus waveforms for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: High-speed pattern generator with deterministic timing alignment across 128 parallel outputs. Use Value: 5 ns propagation delay and 176 I/Os allow synchronized 100 MHz vector generation without external latch staging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic replacement applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S100-6FG256I | Faster speed grade (-6 = 4.5 ns max delay); identical logic resources and pinout | Better suited for 125 MHz clock domains; requires tighter timing closure | Select when target system clock exceeds 100 MHz and timing margin is constrained |
| XC2S150-5FG256I | Higher logic density (150K gates, 2176 CLBs); same package and I/O count | Enables larger state machines or additional protocol stacks (e.g., UART + SPI + I²C simultaneously) | Choose when future firmware expansion or multi-interface support is required |
Compared with XC2S100-5FG256I, the -6 variant improves timing margin for higher-frequency operation while the -150 variant adds headroom for logic growth-both retain identical footprint and I/O compatibility, simplifying migration paths within the Spartan-II family.
Availability
XC2S100-5FG256I is available at Aetrix Electronics and suitable for industrial automation, medical device manufacturing, and test equipment development requiring stable component supply over extended product lifecycles.
Supply support for XC2S100-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing solutions including FPGAs, adaptive SoCs, and AI engines for data center, edge, and embedded markets.
The Spartan-II family, including XC2S100-5FG256I, was designed for cost-sensitive, high-volume applications requiring reliable reconfigurable logic with predictable timing and industrial temperature support.
FAQ
What is the operating temperature range for XC2S100-5FG256I?
The XC2S100-5FG256I is specified for industrial temperature operation from –40 °C to +85 °C. This range is validated per Xilinx DS001 and DS002 datasheets and applies to the FG256 package variant. Thermal derating is not required within this envelope, and the device maintains full timing compliance across the range.
Does XC2S100-5FG256I support in-system programming?
Yes, XC2S100-5FG256I supports in-system programming via its IEEE 1149.1 JTAG interface (TCK/TMS/TDI/TDO pins). Configuration bitstreams can be loaded dynamically using Xilinx iMPACT or third-party boundary-scan tools, enabling field firmware updates without removing the device from the PCB.
What configuration modes are supported by XC2S100-5FG256I?
XC2S100-5FG256I supports Master Serial, Slave Serial, Master SelectMAP, and Slave SelectMAP configuration modes. These are selected via MODE pins during power-up. External PROM (e.g., XCF02S) is commonly used for Master Serial mode, while microcontrollers often drive Slave SelectMAP for dynamic reconfiguration.
Is XC2S100-5FG256I pin-compatible with other Spartan-II devices in FG256 packaging?
XC2S100-5FG256I shares the same 256-ball FBGA footprint and I/O pin assignments with XC2S150-5FG256I and XC2S200-5FG256I. However, unused I/Os on lower-density variants are no-connects-not tri-stated-so PCB layout must account for potential floating pins in migration scenarios.
What software tools are required to develop for XC2S100-5FG256I?
Xilinx ISE Design Suite versions 6.3 through 14.7 fully support XC2S100-5FG256I synthesis, place-and-route, and bitstream generation. Post-implementation simulation requires ModelSim XE or ISIM. No newer Vivado toolchain support exists, as Spartan-II is retired from active tool development.
XC2S100-5FG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 600
- Number of Logic Elements/Cells:
- 2700
- Total RAM Bits:
- 40960
- Number of I/O:
- 176
- Number of Gates:
- 100000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2S100-5FG256I FAQ
1.How can I place an order for XC2S100-5FG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S100-5FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S100-5FG256I reliable?
The price and inventory of XC2S100-5FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S100-5FG256I is usually 5 days.
3.What payment methods are accepted for XC2S100-5FG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S100-5FG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S100-5FG256I?
XC2S100-5FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S100-5FG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S100-5FG256I?
For technical support, including XC2S100-5FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S100-5FG256I requirements.
6.How does Aetrix verify that XC2S100-5FG256I is sourced from the original manufacturer or authorized distributors?
All XC2S100-5FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S100-5FG256I meets industry standards.
7.What is the process for return or replacement of XC2S100-5FG256I?
All XC2S100-5FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2S100-5FG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S100-5FG256I part is unused and in its original packaging.
Return procedure for XC2S100-5FG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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