AMD XC2S100-5FG456C
- Part No.:
- XC2S100-5FG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2S100-5FG456C.pdf
- Description:
- IC FPGA 196 I/O 456FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC2S100-5FG456C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 100,000 system gates, 1728 logic cells, and 128 I/O pins in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 5 ns maximum input-to-output delay and supports 3.3 V I/O with 2.5 V core voltage, targeting cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC2S100-5FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade (-5), FBGA456 thermal and routing constraints, and compatibility with Xilinx ISE 14.7 design tools.
Technical Context
The XC2S100-5FG456C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM up to 56 kbits, and eighteen 18×18 multipliers. Its SelectIO technology supports LVCMOS, LVTTL, PCI, and SSTL-2 I/O standards with programmable slew rate and drive strength.
Configuration is performed via serial PROM or JTAG boundary-scan; it lacks on-chip configuration memory and requires external bitstream loading. The -5 speed grade guarantees timing performance across commercial temperature range (0°C to 85°C) with 3.3 V ±10% I/O supply and 2.5 V ±10% core supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 100,000 system gates - defines maximum combinational logic complexity for gate-equivalent designs |
| Logic Cells | 1,728 CLBs - each contains two 4-LUTs + 2 FFs, enabling synchronous datapath implementation |
| I/O Pins | 128 user I/O - supports parallel bus interfaces, sensor arrays, and multi-protocol peripheral connectivity |
| Speed Grade | -5 - specifies 5 ns maximum Tio (input-to-output delay) under worst-case commercial conditions |
| Core Voltage | 2.5 V ±10% - requires dedicated low-noise core regulator; not compatible with 3.3 V or 1.8 V cores |
| I/O Voltage | 3.3 V tolerant - allows direct interfacing with legacy microcontrollers and peripherals without level shifters |
| Package | 456-pin FBGA (20×20 mm, 1.0 mm pitch) - demands precision PCB layout with controlled impedance and thermal vias |
Pinout & Package
XC2S100-5FG456C uses a 456-ball fine-pitch BGA (FBGA) package with 20×20 array, 1.0 mm ball pitch, and standard JEDEC MO-230 footprint. Thermal pad is absent; mechanical mounting relies on solder joint integrity and board-level thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1–G3, H1–H3 | Configuration Mode Pins (M2:M0) | Select boot source: Master Serial, Slave Serial, JTAG, or Boundary Scan mode at power-up |
| P1, P2, R1, R2 | JTAG TDI/TDO/TMS/TCK | Enable IEEE 1149.1 boundary-scan testing and in-system programming without external PROM |
| A1–A10, B1–B10 | User I/O Banks 0–3 | Each bank independently configurable for LVCMOS/LVTTL/PCI; VCCO per bank must match I/O standard |
| T14, U14, V14, W14 | Dedicated Global Clock Inputs (GCLK0–GCLK3) | Low-skew routing to all CLBs; require external termination and clean clock source |
| V17, W17, Y17, Y18 | Power/Ground (VCCINT/VCCAUX/GND) | VCCINT = 2.5 V core; VCCAUX = 3.3 V auxiliary for JTAG and configuration logic |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | 1728 units with dual 4-LUTs + flip-flops per CLB - enables pipelined arithmetic and state-machine implementation |
| Distributed RAM | Up to 56 kbits of fast asynchronous RAM - usable as FIFO buffers or register files without block RAM overhead |
| SelectIO Technology | Programmable drive strength (2–24 mA) and slew rate - reduces EMI and signal integrity issues on long traces |
| Embedded Multipliers | 18 × 18-bit signed/unsigned multipliers - accelerates digital filtering and motor control algorithms |
| Boundary-Scan Support | IEEE 1149.1 compliant JTAG chain - enables PCB-level testability and field firmware updates |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O modules to programmable logic controllers using RS-485 or CAN physical layers. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and glue logic between microcontroller and field I/O, managing timing-critical strobes and handshaking. Use Value: XC2S100-5FG456C provides sufficient logic density and 128 I/Os to implement dual-port memory mapping and real-time interrupt arbitration without external address decoders. | Use Scenario: Bridging ISA or PCI bus peripherals to modern ARM-based host processors in medical imaging subsystems. IC Role / Device Role / Timing Role: FPGA serves as synchronous bus arbitrator and address decoder, converting burst transfers into sequential memory-mapped accesses. Use Value: XC2S100-5FG456C's -5 speed grade ensures sub-5 ns setup/hold timing compliance with 33 MHz PCI clock domain and 8 MHz ISA timing windows. |
| Video Signal Formatter | Motor Control Encoder Interface |
Use Scenario: Converting parallel RGB video data from image sensors into serialized LVDS streams for display driver ICs. IC Role / Device Role / Timing Role: FPGA performs pixel clock domain crossing, sync pulse generation, and 8b/10b encoding for noise-immune transmission. Use Value: XC2S100-5FG456C's distributed RAM and fast I/O support real-time line buffering and precise pixel edge alignment within 1-clock-cycle jitter. | Use Scenario: Interfacing quadrature encoder signals from servo motors to motion controller MCUs in CNC equipment. IC Role / Device Role / Timing Role: FPGA implements high-speed quadrature decoding, index pulse filtering, and 32-bit position counters with zero CPU overhead. Use Value: XC2S100-5FG456C's 128 I/O pins allow simultaneous connection to 8 independent encoder channels plus direction/speed outputs, eliminating multiplexing latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV300E-4BG432C | Higher density (300K gates), 432-pin BGA, -4 speed grade; 2.5 V core, 3.3 V I/O | Supports larger state machines and embedded soft-core processors (e.g., MicroBlaze); requires more PCB area and power | Choose when >1728 CLBs or integrated BlockRAM are required; not pin-compatible |
| XC2S15-5TQ144C | Lower density (15K gates), 144-pin TQFP, same -5 speed grade and 2.5 V/3.3 V voltage scheme | Suitable for compact, low-I/O designs; lacks FBGA thermal performance and I/O count for high-channel-count systems | Choose for cost-sensitive, space-constrained prototypes where 128 I/O and FBGA routing are unnecessary |
Compared with XC2S100-5FG456C, XCV300E-4BG432C offers greater logic capacity but higher cost and power, while XC2S15-5TQ144C trades I/O count and thermal capability for ease of prototyping - neither is pin-compatible, requiring full PCB redesign.
Availability
XC2S100-5FG456C is available at Aetrix Electronics and suitable for industrial automation, medical device interface, and legacy system modernization requiring stable component supply and long-term obsolescence management.
Supply support for XC2S100-5FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-II product documentation, toolchain support, and lifecycle notifications through the AMD Adaptive SoC portal.
The Spartan-II family was designed for cost-optimized, non-volatile configuration-reliant embedded control and interface bridging - prioritizing gate density per dollar over advanced features like embedded processors or high-speed transceivers.
FAQ
What configuration methods does the XC2S100-5FG456C support?
The XC2S100-5FG456C supports Master Serial (via external PROM), Slave Serial (host-driven), JTAG boundary-scan, and Boundary-Scan modes. It lacks internal configuration memory, so an external bitstream source is mandatory at power-up. Configuration occurs on power-on reset, and the mode is selected by M2:M0 pin states. The XC2S100-5FG456C does not support passive parallel or SelectMAP modes.
Is the XC2S100-5FG456C RoHS compliant?
Yes, the XC2S100-5FG456C is RoHS-6 compliant (lead-free solderable, no restricted substances above threshold). It meets JEDEC J-STD-020D moisture sensitivity level 3 (MSL3) and requires bake conditioning before reflow if exposed beyond floor life. The XC2S100-5FG456C packaging uses matte tin finish on solder balls.
Can the XC2S100-5FG456C operate with a 1.8 V I/O supply?
No, the XC2S100-5FG456C only supports 3.3 V I/O standards (LVCMOS33, LVTTL, PCI). Its I/O banks are not 1.8 V tolerant, and applying 1.8 V to VCCO may cause functional failure or damage. The XC2S100-5FG456C requires strict 3.3 V ±10% on I/O supplies and 2.5 V ±10% on VCCINT.
Does the XC2S100-5FG456C include built-in clock management circuitry?
No, the XC2S100-5FG456C lacks DLLs, PLLs, or DCMs. Clock distribution relies on global clock buffers (GCLK) with fixed fanout and no phase alignment or frequency synthesis. External clock conditioners or zero-delay buffers are required for skew-sensitive or multi-frequency designs. The XC2S100-5FG456C provides four dedicated GCLK inputs routed to all CLBs with low skew.
What software tools are required to develop for the XC2S100-5FG456C?
Xilinx ISE Design Suite 14.7 is the final supported version for XC2S100-5FG456C synthesis, place-and-route, and bitstream generation. Later tools like Vivado do not support Spartan-II devices. The XC2S100-5FG456C requires Foundation or WebPACK licenses; third-party tools (e.g., GHDL, Yosys) lack official timing models or bitstream validation for this device.
XC2S100-5FG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 600
- Number of Logic Elements/Cells:
- 2700
- Total RAM Bits:
- 40960
- Number of I/O:
- 196
- Number of Gates:
- 100000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2S100-5FG456C FAQ
1.How can I place an order for XC2S100-5FG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S100-5FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S100-5FG456C reliable?
The price and inventory of XC2S100-5FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S100-5FG456C is usually 5 days.
3.What payment methods are accepted for XC2S100-5FG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S100-5FG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S100-5FG456C?
XC2S100-5FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S100-5FG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S100-5FG456C?
For technical support, including XC2S100-5FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S100-5FG456C requirements.
6.How does Aetrix verify that XC2S100-5FG456C is sourced from the original manufacturer or authorized distributors?
All XC2S100-5FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S100-5FG456C meets industry standards.
7.What is the process for return or replacement of XC2S100-5FG456C?
All XC2S100-5FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S100-5FG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S100-5FG456C part is unused and in its original packaging.
Return procedure for XC2S100-5FG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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