AMD XC2S100-5FG456I

Overview

XC2S100-5FG456I from AMD (formerly Xilinx) is a Spartan-II family FPGA with 100,000 system gates, 1728 logic cells, and 128 I/O pins in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 5 ns input/output delay and supports 3.3 V I/O with 2.5 V core voltage, commonly used in industrial control logic and low-cost communication interface bridging.

For engineers reviewing the XC2S100-5FG456I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, core voltage tolerance, timing grade (-5 speed grade), and FBGA456 thermal/mechanical compatibility in space-constrained embedded designs.

Technical Context

The XC2S100-5FG456I implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM up to 56 kbits, and global clock networks with up to four dedicated clock inputs. It supports IEEE 1149.1 JTAG boundary-scan testing and in-system configuration via SelectMAP or serial PROM interfaces.

It integrates digital clock managers (DCMs) for clock synthesis, phase shifting, and duty-cycle correction, and supports LVCMOS/LVTTL I/O standards with programmable slew rate and drive strength per bank. Configuration is volatile and requires external PROM or processor loading at power-up.

Key Specifications

Pinout & Package

XC2S100-5FG456I is housed in a 456-ball fine-pitch BGA (FBGA) package with 20×20 array, 1.0 mm ball pitch, and thermal pad on underside. Pinout follows Xilinx Spartan-II FG456 mechanical and functional layout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and I/O bridging applications.

Compared with XC2S100-5PQ208I and XC3S100E-4VQ100C, the XC2S100-5FG456I delivers superior thermal performance, higher I/O count, and integrated clock synthesis - making it optimal for production-grade, space-constrained, and timing-critical embedded logic applications.

Availability

XC2S100-5FG456I is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and legacy interface modernization requiring stable component supply and long-term obsolescence mitigation.

Supply support for XC2S100-5FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now owns the Spartan FPGA product line. Xilinx pioneered SRAM-based FPGAs and introduced the Spartan series as a cost-optimized, high-volume alternative to Virtex.

The Spartan-II family, including XC2S100-5FG456I, was designed for mainstream embedded logic replacement - targeting applications needing moderate density, predictable timing, and reliable I/O interfacing without premium cost.

FAQ

What is the core voltage requirement for XC2S100-5FG456I?

The XC2S100-5FG456I requires a regulated 2.5 V ± 0.1 V core supply (VCCINT). This voltage powers the internal logic fabric and CLBs. Deviation beyond tolerance risks timing violation or configuration loss. The XC2S100-5FG456I does not support 3.3 V or 1.8 V core operation - using an incorrect regulator will cause functional failure.

Does XC2S100-5FG456I support in-system programming?

Yes, the XC2S100-5FG456I supports in-system programming via its JTAG (IEEE 1149.1) interface using TCK, TMS, TDI, and TDO pins. It also allows parallel configuration through the SelectMAP interface for host-controlled reprogramming. The XC2S100-5FG456I does not support internal nonvolatile configuration storage - external PROM or processor-initiated reload is mandatory after each power cycle.

How many Digital Clock Managers (DCMs) are integrated into XC2S100-5FG456I?

The XC2S100-5FG456I integrates two fully functional Digital Clock Managers (DCMs). Each DCM provides input jitter filtering, frequency synthesis, 0–255° phase shifting, and 50% duty-cycle correction. These DCMs are essential for building robust clock trees in the XC2S100-5FG456I and cannot be substituted with CLB-based logic due to analog feedback loop requirements.

What is the maximum operating temperature range for XC2S100-5FG456I?

The XC2S100-5FG456I is rated for industrial temperature operation from –40 °C to +85 °C ambient. This rating applies under specified airflow, PCB copper area, and power dissipation limits. The XC2S100-5FG456I's thermal pad must be soldered to a solid ground plane for effective heat conduction - omitting this compromises thermal margin and may trigger thermal shutdown in sustained 100 MHz operation.

Can XC2S100-5FG456I replace XC2S100-5PQ208I directly on the same PCB?

No, the XC2S100-5FG456I cannot replace XC2S100-5PQ208I directly on the same PCB. They differ in package type (FBGA vs. PQFP), pin count (456 vs. 208), pinout mapping, thermal pad presence, and I/O inductance. The XC2S100-5FG456I requires a new PCB layout with BGA footprint, controlled impedance routing, and thermal via design - no mechanical or electrical drop-in compatibility exists.