AMD XC2S100-5FGG256C

Overview

XC2S100-5FGG256C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 100,000 system gates, 1728 logic cells, and 128 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 5 ns input/output delay and supports 3.3 V I/O with 2.5 V core voltage, targeting cost-sensitive embedded control and interface bridging applications.

For engineers reviewing the XC2S100-5FGG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, logic cell density, core voltage requirement, timing grade (-5 speed grade), and FBGA256 thermal/mechanical compatibility with legacy Spartan-II PCB footprints.

Technical Context

The XC2S100-5FGG256C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM up to 48 Kbits, and global clock routing with four dedicated clock inputs. It supports IEEE 1149.1 JTAG boundary-scan for configuration and test.

Configuration is performed via serial PROM (Master Serial mode) or parallel slave mode using external microcontroller or processor. The device requires external configuration memory and does not include on-chip nonvolatile configuration storage.

Key Specifications

Pinout & Package

XC2S100-5FGG256C uses a 256-ball fine-pitch BGA (FGG) package with 16 × 16 array, 1.0 mm ball pitch, and thermal pad center. Pinout follows Xilinx Spartan-II FG256 mechanical and signal assignment specification.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic integration applications.

Compared with XC2S100-5FGG256C, XC2S100-5PQ208C offers identical logic and timing but trades FBGA thermal performance for QFP assembly flexibility, while XC3S100E-4VQ100C reduces system-level BOM count via on-chip configuration storage but increases worst-case path delay by 2 ns.

Availability

XC2S100-5FGG256C is available at Aetrix Electronics and suitable for industrial automation, test equipment, and automotive body electronics requiring stable component supply and long-term obsolescence management.

Supply support for XC2S100-5FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now oversees the Spartan FPGA product line, maintaining legacy support and documentation for industrial and aerospace customers.

The Spartan-II family, including XC2S100-5FGG256C, was designed for cost-optimized, high-volume embedded logic replacement in applications demanding predictable timing and mature toolchain support.

FAQ

What is the core voltage requirement for XC2S100-5FGG256C?

The XC2S100-5FGG256C requires a regulated 2.5 V ± 0.1 V core supply (VCCINT) delivered to pin R1. This voltage powers all CLBs, interconnect, and internal RAM. Deviation beyond tolerance risks timing violations or configuration loss. External regulation with low-noise LDO and proper decoupling is mandatory - the XC2S100-5FGG256C does not support 1.8 V or 3.3 V core operation.

Does XC2S100-5FGG256C include on-chip configuration memory?

No, the XC2S100-5FGG256C does not contain nonvolatile configuration memory. It must be configured externally at power-up using Master Serial mode (via XCFxx PROM) or Slave Parallel mode (driven by microcontroller). Configuration data is volatile and lost on power-down. This behavior is inherent to the XC2S100-5FGG256C architecture and requires external memory in all deployments.

Can XC2S100-5FGG256C operate with 3.3 V I/O standards?

Yes, the XC2S100-5FGG256C supports 3.3 V LVTTL and LVCMOS I/O standards across its 128 user I/O pins. Each of the four I/O banks can be independently set to 3.3 V, enabling direct interfacing with microcontrollers, ADCs, and legacy peripherals. However, VCCO must be supplied at 3.3 V for the targeted bank, and core voltage remains fixed at 2.5 V - the XC2S100-5FGG256C does not support mixed 3.3 V core operation.

What JTAG signals are required to program XC2S100-5FGG256C?

Programming the XC2S100-5FGG256C via JTAG requires TCK (pin P1), TMS (pin M1), TDI (pin N2), TDO (pin N1), and TCK return (VSS). All five signals must be connected per IEEE 1149.1. The XC2S100-5FGG256C supports boundary-scan testing and in-system configuration but does not allow partial reconfiguration - full bitstream reload is required for any logic change.

Is XC2S100-5FGG256C still in active production?

The XC2S100-5FGG256C is in continued availability through Aetrix Electronics' legacy component program, supported by original Xilinx documentation and AMD's long-term product stewardship. While not in active wafer fabrication, it remains available from qualified inventory with full traceability. Customers designing new systems should evaluate migration paths, but the XC2S100-5FGG256C is fully supported for sustaining engineering and repair.