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AMD XC2S100-6FG456C
- Part No.:
- XC2S100-6FG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2S100-6FG456C.pdf
- Description:
- IC FPGA 196 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,713
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Product details
Overview
XC2S100-6FG456C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 100,000 system gates, 1728 logic cells, and 160 I/O pins in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 6 ns gate delay and supports 3.3 V I/O with 2.5 V core voltage, commonly used in industrial control logic and low-cost communication interface bridging.
For engineers reviewing the XC2S100-6FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade (-6), FBGA456 thermal and routing constraints, and legacy 2.5 V core compatibility for cost-sensitive reworkable designs.
Technical Context
The XC2S100-6FG456C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM, and dedicated carry logic for arithmetic. It includes global clock networks with up to four user-defined clock inputs and supports SelectIO standards including LVTTL, LVCMOS, and PCI.
Configuration is performed via serial PROM or boundary-scan (JTAG), with support for master parallel mode using an external microcontroller. The device lacks on-chip configuration memory and requires external bitstream storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1728 CLBs - defines maximum combinational/sequential logic capacity for gate-equivalent implementation |
| System Gates | 100,000 - industry-standard metric for relative logic density vs. ASIC equivalents |
| I/O Pins | 160 user-programmable - supports multi-bank voltage assignment and mixed-voltage interfacing |
| Speed Grade | -6 - guarantees 6 ns typical CLB propagation delay under specified conditions |
| Core Voltage | 2.5 V ± 0.1 V - requires dedicated low-noise core regulator; not compatible with 1.8 V or 3.3 V core supplies |
| I/O Voltage | 3.3 V - supports LVTTL/LVCMOS33 signaling without level shifters |
| Package | 456-pin FBGA (Fine-Pitch BGA) - 27 × 27 mm body, 1.0 mm ball pitch, JEDEC MO-205 standard |
Pinout & Package
XC2S100-6FG456C is housed in a 456-ball fine-pitch BGA (FBGA) package with 27 × 27 mm footprint and 1.0 mm ball pitch. Thermal pad is absent; mechanical mounting relies on solder joint integrity across all balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1–G3, H1–H3 | Global Clock Inputs (GCLK) | Four dedicated low-skew clock inputs supporting internal PLL-free clock distribution |
| A1–A12, B1–B12 | User I/O Banks (Bank 0–3) | Each bank independently configurable for LVTTL/LVCMOS/PCI; VCCO per bank must match signal standard |
| T14, U14, V14, W14 | JTAG Boundary-Scan TDI/TDO/TMS/TCK | IEEE 1149.1-compliant test access port; enables programming and debug without dedicated configuration interface |
| P15, R15, T15, U15 | Configuration Mode Pins (M0–M2) | Determine startup source: master parallel, slave serial, JTAG, or boundary-scan mode |
| V17, W17 | Program Enable (PROG_B) & Initiate (INIT_B) | Active-low signals controlling configuration reset and status reporting during bitstream load |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | Each CLB contains two 4-input LUTs + two registers - enables efficient mapping of synchronous logic and small state machines |
| Distributed RAM | Up to 128 bits per CLB - provides fast, low-latency register-based memory without block RAM overhead |
| SelectIO Technology | Per-bank I/O voltage control - allows mixing LVTTL and LVCMOS33 interfaces on same device without external translators |
| Global Clock Networks | Four independent low-skew clock trees - reduces clock skew across large logic regions without manual routing |
| Boundary-Scan Support | Full IEEE 1149.1 compliance - enables in-system programming and board-level interconnect testing |
Applications
| Industrial Motion Controller | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Real-time coordination of stepper/servo drives using encoder feedback and PWM outputs. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID logic, pulse generation, and safety monitoring in deterministic sub-microsecond cycles. Use Value: XC2S100-6FG456C delivers sufficient logic density and I/O count to replace multiple discrete glue logic ICs while maintaining 6 ns timing closure for motion profile updates. | Use Scenario: Bridging ISA or PCI bus peripherals to modern microcontroller buses (e.g., SPI or parallel GPIO). IC Role / Device Role / Timing Role: Protocol translator and address decoder handling asynchronous bus handshaking and wait-state insertion. Use Value: XC2S100-6FG456C supports mixed 3.3 V I/O banks and provides 160 pins for full bus width capture, enabling direct connection to legacy peripheral controllers. |
| Low-Cost Test Equipment | Automated Optical Inspection (AOI) Preprocessor |
Use Scenario: Digital pattern generator and response analyzer for PCB continuity and component functional testing. IC Role / Device Role / Timing Role: Generates synchronized stimulus waveforms and captures return signals with precise timing alignment. Use Value: XC2S100-6FG456C's -6 speed grade ensures reliable 166 MHz sampling edge alignment across 160 I/O channels without external timing ICs. | Use Scenario: Real-time pixel data filtering and defect flagging prior to host CPU analysis in inline manufacturing inspection systems. IC Role / Device Role / Timing Role: Parallel image pipeline processor implementing median filtering and threshold comparison on streaming video frames. Use Value: XC2S100-6FG456C's distributed RAM and LUT-based logic enable 8-bit pixel processing at 25 MHz line rate using only on-chip resources, eliminating external SRAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S100-5FG456C | Slower -5 speed grade (7 ns CLB delay); identical logic cells, I/O count, and package | Suitable where timing margin exceeds 166 MHz operation; lower power at same frequency due to relaxed drive strength | Select when design meets timing with margin and thermal budget is constrained |
| XC2S150-6FG456C | Higher-density variant: 2176 CLBs and 110,000 system gates; same package and speed grade | Required for designs exceeding 1728 CLBs but retaining identical PCB layout and thermal profile | Choose when logic utilization exceeds 90% in XC2S100-6FG456C synthesis reports |
Compared with XC2S100-6FG456C, the -5 variant trades speed for reduced dynamic power, while the XC2S150-6FG456C extends logic capacity without changing board layout or cooling requirements - both preserve pin-compatible migration paths within the Spartan-II FG456 footprint.
Availability
XC2S100-6FG456C is available at Aetrix Electronics and suitable for industrial motion control, legacy bus bridging, and low-cost automated test equipment requiring stable component supply and long-term obsolescence management.
Supply support for XC2S100-6FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-II product support through its programmable solutions group. Xilinx pioneered commercial FPGAs and established foundational architecture for cost-optimized logic integration.
The Spartan-II family was designed for high-volume, cost-sensitive applications requiring moderate logic density, robust I/O flexibility, and predictable timing - targeting industrial automation, communications infrastructure, and test instrumentation markets.
FAQ
What is the core voltage requirement for XC2S100-6FG456C?
The XC2S100-6FG456C requires a regulated 2.5 V ± 0.1 V core supply. This voltage powers internal CLBs and interconnect; deviation beyond tolerance risks timing violation or configuration loss. External DC/DC converters with tight regulation and low ripple are mandatory - the XC2S100-6FG456C does not support 1.8 V or 3.3 V core operation.
Does XC2S100-6FG456C include embedded block RAM?
No, the XC2S100-6FG456C does not contain dedicated block RAM resources. It relies solely on distributed RAM implemented within CLBs, offering up to 128 bits per CLB. For applications requiring >1 kbit contiguous memory, external SRAM or a higher-density Spartan-II variant like XC2S200 must be used alongside the XC2S100-6FG456C.
Can XC2S100-6FG456C be programmed via JTAG in-system?
Yes, XC2S100-6FG456C supports full IEEE 1149.1 JTAG boundary-scan for in-system programming and debugging. Pins T14 (TCK), U14 (TMS), V14 (TDI), and W14 (TDO) provide direct access. No external configuration PROM is needed when using JTAG mode, though configuration is volatile and reloads required after power cycle.
What I/O standards are supported by XC2S100-6FG456C?
The XC2S100-6FG456C supports LVTTL, LVCMOS33, and PCI I/O standards across its 160-user I/O pins. Each of the four I/O banks can be independently set to 3.3 V VCCO, enabling mixed-standard interfacing. It does not support LVDS, SSTL, or differential signaling natively - those require external termination or higher-series devices.
Is XC2S100-6FG456C still in active production?
XC2S100-6FG456C is discontinued by AMD/Xilinx but remains available through authorized distributors and Aetrix Electronics' legacy component program. Full datasheets, application notes, and configuration tools are archived and supported. Long-term supply is maintained via controlled inventory and lifecycle coordination for existing designs.
XC2S100-6FG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 600
- Number of Logic Elements/Cells:
- 2700
- Total RAM Bits:
- 40960
- Number of I/O:
- 196
- Number of Gates:
- 100000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2S100-6FG456C FAQ
1.How can I place an order for XC2S100-6FG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S100-6FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S100-6FG456C reliable?
The price and inventory of XC2S100-6FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S100-6FG456C is usually 5 days.
3.What payment methods are accepted for XC2S100-6FG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S100-6FG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S100-6FG456C?
XC2S100-6FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S100-6FG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S100-6FG456C?
For technical support, including XC2S100-6FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S100-6FG456C requirements.
6.How does Aetrix verify that XC2S100-6FG456C is sourced from the original manufacturer or authorized distributors?
All XC2S100-6FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S100-6FG456C meets industry standards.
7.What is the process for return or replacement of XC2S100-6FG456C?
All XC2S100-6FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S100-6FG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S100-6FG456C part is unused and in its original packaging.
Return procedure for XC2S100-6FG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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