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AMD XC2S100-6FGG256C
- Part No.:
- XC2S100-6FGG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2S100-6FGG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,314
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Product details
Overview
XC2S100-6FGG256C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 100,000 system gates, 1728 logic cells, and 176 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 6 ns CLB delay and supports 3.3 V I/O with 2.5 V core voltage, targeting cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC2S100-6FGG256C datasheet, pinout, applications, or equivalent options, key selection factors include CLB count, I/O voltage compatibility, configuration mode support (Master Serial, Slave Parallel), and availability of dedicated multipliers and RAM blocks for digital logic implementation.
Technical Context
The XC2S100-6FGG256C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM (16-bit wide × 32 deep per CLB), and dedicated carry logic for arithmetic functions. It includes eight global clock buffers and supports JTAG boundary-scan testing per IEEE 1149.1.
Configuration is performed via external PROM or microprocessor using Master Serial or Slave Parallel modes. The device lacks on-chip oscillator or analog features, and does not support partial reconfiguration or dynamic reconfiguration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 100,000 system gates - defines maximum combinational logic density for gate-equivalent design mapping |
| CLB Count | 1728 CLBs - determines parallel logic execution capability and resource allocation granularity |
| I/O Pins | 176 user I/O - supports high-pin-count peripheral interfacing with programmable slew rate and drive strength |
| Core Voltage | 2.5 V ± 0.1 V - requires dedicated low-noise core regulator; not compatible with 3.3 V or 1.8 V core supplies |
| I/O Voltage | 3.3 V LVTTL/LVCMOS - enables direct connection to legacy microcontrollers and industrial buses without level shifters |
| Max Clock Frequency | 125 MHz system clock - achievable with critical path timing closure under worst-case conditions |
| Configuration Mode | Master Serial, Slave Parallel - determines boot source architecture and FPGA initialization sequence |
Pinout & Package
XC2S100-6FGG256C is housed in a 256-ball Fine-Pitch BGA (FBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and thermal pad exposed on underside for enhanced heat dissipation in sustained operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCK0–GCK7 | Global Clock Input | Dedicated low-skew routing to all CLBs; only these pins drive internal global clock network |
| PROGRAM_B | Active-Low Configuration Initiate | Pulls low to reset configuration logic and clear SRAM contents before reload |
| DONE | Configuration Completion Indicator | Open-drain output signals successful bitstream loading; must be pulled up externally |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant test access and in-system programming |
| HSWAP_EN | Hot-Swap Enable Control | When tied high, enables weak pull-up on I/O during power-up to prevent floating states |
Key Features
| Feature | Design Value |
|---|---|
| Distributed RAM per CLB | 32 × 16-bit synchronous RAM - eliminates need for external SRAM in small data buffering tasks |
| Dedicated Carry Chain | Fast ripple-carry propagation across CLBs - enables efficient counter and arithmetic logic synthesis |
| SelectIO Technology | Programmable I/O standards (LVTTL, LVCMOS, PCI) - supports mixed-voltage board designs without discrete level translators |
| Eight Global Clock Buffers | Low-jitter, low-skew distribution - essential for synchronous timing closure in multi-domain systems |
| IEEE 1149.1 JTAG Support | Fully compliant boundary-scan chain - enables production test, debug, and in-field firmware update |
Applications
| Industrial PLC I/O Module | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Replacing fixed-function ASICs in programmable logic controller backplane modules requiring field-upgradable I/O mapping. IC Role / Device Role / Timing Role: Configurable glue logic and protocol translator between CPU bus and isolated digital I/O banks. Use Value: Enables single-hardware design supporting multiple I/O configurations via reprogrammable bitstream, reducing inventory SKUs. | Use Scenario: Bridging ISA or PC/104 bus peripherals to modern microcontroller subsystems in medical instrumentation. IC Role / Device Role / Timing Role: Synchronous address/data demultiplexer and handshaking signal generator with precise setup/hold timing control. Use Value: Eliminates discrete logic chips and reduces PCB layer count while maintaining strict ISA timing compliance. |
| Automotive Diagnostic Tool | Test Equipment Pattern Generator |
Use Scenario: Real-time CAN message filtering and diagnostic response generation in handheld OBD-II scanners. IC Role / Device Role / Timing Role: Protocol-aware state machine implementing ISO 15765-2 framing and error detection logic. Use Value: Provides deterministic latency (<500 ns) for time-critical diagnostic responses without software overhead. | Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for IC functional validation. IC Role / Device Role / Timing Role: High-speed pattern sequencer with independent channel enable/disable and cycle repeat control. Use Value: Delivers 125 MHz waveform edge precision using internal carry chain and distributed RAM for pattern storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S100-5PQ208C | 208-pin PQFP package, 5 ns CLB delay, lower I/O count (140), no thermal pad | Better suited for prototyping with socketed mounting and manual rework; limited thermal performance in high-density layouts | Select when board space allows larger footprint and thermal management is less constrained |
| XC3S100E-4VQ100C | Spartan-3E family, 100K gates, 100-pin VQFP, 1.2 V core, higher logic utilization efficiency | Offers integrated DLL and improved I/O flexibility but requires different configuration EEPROM and power sequencing | Choose for new designs needing lower power and enhanced clock management, accepting redesign effort |
Compared with XC2S100-6FGG256C, the XC2S100-5PQ208C trades thermal performance and I/O density for ease of assembly, while the XC3S100E-4VQ100C provides architectural upgrades at the cost of full hardware redesign and revised power delivery.
Availability
XC2S100-6FGG256C is available at Aetrix Electronics and suitable for industrial automation, test equipment, and automotive diagnostics requiring stable component supply across extended product lifecycles.
Supply support for XC2S100-6FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA portfolio for cost-optimized digital logic applications.
The Spartan-II family, including XC2S100-6FGG256C, was designed for high-volume, price-sensitive embedded systems requiring reliable, non-volatile-configurable logic without advanced DSP or high-speed transceivers.
FAQ
What configuration methods does the XC2S100-6FGG256C support?
The XC2S100-6FGG256C supports Master Serial (via on-board PROM), Slave Parallel (driven by microprocessor), and JTAG boundary-scan configuration. It does not support Slave Serial or SelectMAP modes. Configuration bitstream is loaded into volatile SRAM, requiring reload on power-up unless paired with external non-volatile memory.
Does the XC2S100-6FGG256C include on-chip memory blocks?
No, the XC2S100-6FGG256C contains only distributed RAM within each CLB (32 × 16-bit per CLB) and no dedicated block RAM. For larger memory requirements, external SRAM or Flash must be used. This distinguishes it from later Spartan families that integrate 18-kbit block RAMs.
What is the operating temperature range for the XC2S100-6FGG256C?
The XC2S100-6FGG256C is rated for commercial temperature range: 0 °C to +70 °C ambient. It is not qualified for industrial (−40 °C to +85 °C) or extended temperature operation. Thermal derating applies above 60 °C case temperature due to FBGA package limitations.
Can the XC2S100-6FGG256C be used with 1.8 V I/O standards?
No, the XC2S100-6FGG256C supports only 3.3 V LVTTL and LVCMOS I/O standards. Its I/O circuitry is not compatible with 1.8 V, 2.5 V, or SSTL signaling. Using 1.8 V signals directly risks input threshold violation and potential damage to I/O buffers.
Is JTAG debugging supported on the XC2S100-6FGG256C?
Yes, the XC2S100-6FGG256C fully complies with IEEE 1149.1 JTAG boundary-scan, enabling device identification, interconnect testing, and in-system programming. However, it does not support embedded processor debug (e.g., MicroBlaze) since no hard or soft processor core is integrated in the Spartan-II architecture.
XC2S100-6FGG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 600
- Number of Logic Elements/Cells:
- 2700
- Total RAM Bits:
- 40960
- Number of I/O:
- 176
- Number of Gates:
- 100000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2S100-6FGG256C FAQ
1.How can I place an order for XC2S100-6FGG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S100-6FGG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S100-6FGG256C reliable?
The price and inventory of XC2S100-6FGG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S100-6FGG256C is usually 5 days.
3.What payment methods are accepted for XC2S100-6FGG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S100-6FGG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S100-6FGG256C?
XC2S100-6FGG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S100-6FGG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S100-6FGG256C?
For technical support, including XC2S100-6FGG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S100-6FGG256C requirements.
6.How does Aetrix verify that XC2S100-6FGG256C is sourced from the original manufacturer or authorized distributors?
All XC2S100-6FGG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S100-6FGG256C meets industry standards.
7.What is the process for return or replacement of XC2S100-6FGG256C?
All XC2S100-6FGG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S100-6FGG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S100-6FGG256C part is unused and in its original packaging.
Return procedure for XC2S100-6FGG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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