AMD XC2S100E-6FT256C

Overview

XC2S100E-6FT256C from Xilinx is a 2,700-logic-cell Spartan-IIE Field-Programmable Gate Array with 202 user I/O pins, 40K bits of block RAM, and four Delay-Locked Loops (DLLs), operating at 1.8V core voltage and supporting 3.3V/2.5V/1.5V I/O standards. It delivers system performance beyond 200 MHz and is used in high-volume embedded control, industrial interface bridging, and legacy PCI peripheral logic.

For engineers reviewing the XC2S100E-6FT256C datasheet, pinout, applications, or equivalent options, key selection criteria include its FT256 fine-pitch BGA package, -6 speed grade (6 ns CLB delay), commercial temperature range (0°C to +85°C), and support for LVTTL, LVCMOS, HSTL, SSTL, and differential LVDS I/O standards.

Technical Context

The XC2S100E-6FT256C implements a regular array of Configurable Logic Blocks (CLBs), each containing four 4-input LUTs with distributed RAM capability (16×1-bit per LUT), dual flip-flops per slice, dedicated carry chains, and F5/F6 multiplexers enabling up to 19-input logic functions. Its architecture includes two columns of 4K-bit true dual-port block RAMs and four corner-placed DLLs for zero-delay clock distribution, multiplication, division, and phase shifting.

It features eight independent I/O banks with separate VCCO and VREF supply domains, enabling mixed-voltage I/O operation (e.g., 3.3V LVTTL and 1.5V HSTL in different banks), IEEE 1149.1 boundary scan, hot-swap support per PCN2002-05, and configuration via master/slave serial, slave parallel, or JTAG modes using external PROM or host processor.

Key Specifications

Pinout & Package

XC2S100E-6FT256C uses a 256-ball Fine-Pitch Ball Grid Array (FT256) package with 1.0 mm ball pitch, 17 × 17 array, and standard JEDEC MO-207AC footprint. Pin assignments follow Xilinx DS077-4 (v3.0) pinout tables, with dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, DONE), JTAG boundary scan (TCK/TMS/TDI/TDO), and eight I/O banks (Bank 0–7).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and I/O applications.

Compared with XC2S100-6PQ208C, the XC2S100E-6FT256C offers 20 more I/Os, differential signaling, and superior clock management-justifying BGA use in production. Against XCR3256XL-10TQ144I, it provides orders-of-magnitude higher logic density, embedded memory, and advanced timing control essential for system-on-chip integration.

Availability

XC2S100E-6FT256C is available at Aetrix Electronics and suitable for industrial motion controllers, legacy PCI bridge modules, automotive diagnostic tools, and automated test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2S100E-6FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022; it developed the first commercial FPGA and continues to lead in adaptive computing architectures.

The Spartan-IIE family was designed for cost-sensitive, high-volume applications requiring ASIC-like performance with FPGA flexibility-targeting industrial automation, communications infrastructure, and embedded vision systems.

FAQ

What is the maximum operating frequency supported by XC2S100E-6FT256C?

The XC2S100E-6FT256C has a -6 speed grade specifying a 6 ns CLB propagation delay, enabling guaranteed system clock operation up to 166 MHz under typical conditions. With DLL-assisted clock distribution and careful floorplanning, real-world designs achieve >200 MHz in critical paths such as counters or state machines, as confirmed in DS077-3 switching characteristics tables.

Does XC2S100E-6FT256C support differential I/O standards like LVDS?

Yes, XC2S100E-6FT256C supports LVDS and Bus LVDS I/O standards across up to 86 differential I/O pairs (172 pins total), as documented in Table 1 and Section "Versatile I/O and packaging" of DS077-1. Each differential pair requires dedicated P/N routing and matching trace lengths; VCCO must be set to 2.5V for LVDS operation per Table 3.

Is XC2S100E-6FT256C still in active production or obsolete?

Xilinx declared the Spartan-IIE family obsolete per XCN12026 (2012), and DS077 v3.0 (2013) carries an "OBSOLETE" banner. However, XC2S100E-6FT256C remains available through authorized distributors and Aetrix Electronics' legacy component program with full traceability and extended lifecycle support for existing designs.

How many block RAM blocks does XC2S100E-6FT256C contain?

XC2S100E-6FT256C contains ten 4K-bit block RAMs totaling 40K bits, as specified in Table 1 of DS077-1. Each block is configurable as 4K×1, 2K×2, 1K×4, 512×8, or 256×16 single-port RAM, or as 2K×2 true dual-port RAM-enabling efficient FIFO, buffer, and lookup table implementations.

Can XC2S100E-6FT256C be configured via JTAG interface?

Yes, XC2S100E-6FT256C supports IEEE 1149.1 JTAG boundary scan for both configuration and testing. The TCK, TMS, TDI, and TDO pins enable in-system programming of the configuration PROM or direct SRAM loading, as detailed in DS077-2 "Configuration" section and XAPP151 application note.