AMD XC2S100E-6FTG256C

Overview

XC2S100E-6FTG256C from Xilinx is a 2,700-logic-cell Spartan®-IIE Field-Programmable Gate Array with 202 user I/O pins, four Delay-Locked Loops (DLLs), 40 Kbits of block RAM, and 38,400 bits of distributed RAM. It operates at 1.8 V core voltage (VCCINT) and supports configurable I/O standards including LVTTL, LVCMOS, SSTL, HSTL, LVDS, and PCI up to 66 MHz - deployed in industrial control logic, legacy interface bridging, and reconfigurable data acquisition systems.

For engineers reviewing the XC2S100E-6FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include DLL-based clock deskew for synchronous timing closure, dual-voltage I/O bank architecture (VCCO = 1.5/2.5/3.3 V), hot-swap capability per CompactPCI v2.2, and support for IEEE 1149.1 boundary scan testing.

Technical Context

The XC2S100E-6FTG256C implements a regular array of Configurable Logic Blocks (CLBs), each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its architecture includes two columns of 4K-bit true dual-port block RAM and distributed RAM formed from LUTs - enabling both deep memory structures and high-speed register files.

Four corner-placed DLLs provide clock multiplication, division, and phase shifting with zero hold-time pad-to-pad timing; I/O banks are electrically isolated with independent VCCO and VREF supply domains - supporting mixed-signaling standards like LVDS (2.5 V) and SSTL3 (3.3 V) on adjacent pins when assigned to separate banks.

Key Specifications

Pinout & Package

XC2S100E-6FTG256C uses a 256-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 17×17 array configuration. The package supports 202 user I/O pins distributed across eight electrically isolated I/O banks, plus dedicated global clock inputs, configuration pins (INIT_B, PROGRAM_B, DONE), JTAG boundary scan pins (TCK/TMS/TDI/TDO), and power/ground balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and interface applications.

Compared with XC2S100-6PQ208C, XC2S100E-6FTG256C delivers 20 additional I/Os, hot-swap capability, and finer-pitch BGA packaging for higher board density; versus XC3S1000-4FG320C, it offers proven toolchain stability and lower power at 1.8 V core, but lacks embedded multipliers and has lower maximum frequency.

Availability

XC2S100E-6FTG256C is available at Aetrix Electronics and suitable for industrial control logic, legacy interface bridging, and reconfigurable data acquisition systems requiring stable component supply across extended product lifecycles.

Supply support for XC2S100E-6FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022; it developed the first commercial FPGA and established foundational architectures for reconfigurable computing.

The Spartan-IIE family was designed as a cost-optimized, high-volume alternative to ASICs - targeting industrial, communications, and automotive applications where field-upgradability, short design cycles, and predictable timing closure were critical.

FAQ

What is the maximum operating frequency of the XC2S100E-6FTG256C?

The XC2S100E-6FTG256C is rated for system clock rates beyond 200 MHz, with the -6 speed grade specifying guaranteed timing performance up to 166 MHz for internal CLB paths and 100 MHz for I/O paths under recommended operating conditions. Actual achievable frequency depends on design complexity, routing congestion, and clock domain usage - especially when leveraging the four DLLs for clock multiplication or deskewing.

Does the XC2S100E-6FTG256C support hot-swap functionality?

Yes, the XC2S100E-6FTG256C supports hot-swap per CompactPCI v2.2 specifications. Its I/O pins remain high-impedance before and during power-up, with no current path from I/O to VCCINT or VCCO supplies. This allows safe insertion into powered backplanes without risk of latch-up or system disruption - confirmed for all Spartan-IIE devices manufactured after PCN2002-05.

How many block RAM blocks does the XC2S100E-6FTG256C contain?

The XC2S100E-6FTG256C contains ten 4K-bit block RAMs, totaling 40 Kbits of true dual-port synchronous memory. Each block supports independent read/write addresses, enabling use cases such as ping-pong buffering, FIFOs, or coefficient storage - without consuming CLB resources or distributed RAM LUTs.

Can the XC2S100E-6FTG256C operate with mixed I/O voltages on the same device?

Yes, the XC2S100E-6FTG256C supports mixed I/O voltages through its eight independent I/O banks. Each bank has dedicated VCCO and VREF pins, allowing simultaneous operation of LVTTL (3.3 V), SSTL2 (2.5 V), and HSTL Class I (1.5 V) interfaces - provided compatible standards are grouped per bank per Table 4 in DS077-2.

Is the XC2S100E-6FTG256C still in active production?

No, the XC2S100E-6FTG256C was discontinued per Xilinx Change Notice XCN12026 (2012). However, Aetrix Electronics maintains verified legacy inventory with full traceability and offers lifecycle management support - including obsolescence forecasting, cross-reference guidance, and last-time-buy coordination for ongoing production programs.