AMD XC2S100E-6TQ144C

Overview

XC2S100E-6TQ144C from Xilinx is a 2,700-logic-cell Spartan®-IIE Field-Programmable Gate Array with 202 user I/Os, four Delay-Locked Loops (DLLs), 38,400 bits of distributed RAM, and 40 Kbits of block RAM in a 144-pin Thin Quad Flat Package (TQFP). It operates at 1.8 V core voltage and supports 3.3 V, 2.5 V, or 1.5 V I/O standards, targeting cost-sensitive high-volume embedded control and interface bridging applications.

For engineers reviewing the XC2S100E-6TQ144C datasheet, pinout, applications, or equivalent options, key selection criteria include DLL-based clock deskew for synchronous bus interfaces, hot-swap–capable I/O banks, LVTTL/LVCMOS/PCI-compatible signaling, and support for in-system reprogramming via serial PROM or JTAG.

Technical Context

The XC2S100E-6TQ144C implements a regular array of Configurable Logic Blocks (CLBs), each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its architecture integrates two columns of 4K-bit true dual-port block RAM and distributed RAM derived from LUTs, enabling efficient implementation of FIFOs and state machines.

Four corner-located DLLs provide clock multiplication, division, and phase shifting with zero hold-time guarantee on input paths. The device features eight I/O banks with shared VCCO per bank (single 3.3 V supply in TQ144), supporting mixed LVTTL, PCI, SSTL3, and CTT standards within compatible voltage groups - all IEEE 1149.1 boundary scan compliant.

Key Specifications

Pinout & Package

XC2S100E-6TQ144C is housed in a 144-pin Plastic Thin Quad Flat Package (TQFP) with 0.5 mm pitch, 20 × 20 mm body size, and exposed thermal pad. Pin functions are organized into eight I/O banks (Bank 0–7), four global clock inputs (GCLK0–GCLK3), JTAG boundary scan pins (TCK/TMS/TDI/TDO/TREN), configuration pins (INIT, PROGRAM, DONE), and dedicated VCCO/VREF supply pins per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Compared with XC2S100-6TQ144C, the XC2S100E-6TQ144C adds hot-swap safety and improved I/O drive control; versus XCR3256XL-10TQ144C, it delivers 10× higher logic capacity, integrated memory, and DLL-based timing precision - making it suitable for full subsystem integration rather than discrete logic replacement.

Availability

XC2S100E-6TQ144C is available at Aetrix Electronics and suitable for industrial PLC I/O modules, legacy bus bridges, video signal formatters, and communications protocol accelerators requiring stable component supply and long-term obsolescence mitigation planning.

Supply support for XC2S100E-6TQ144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures widely adopted in aerospace, industrial, and communications infrastructure.

The Spartan-IIE family was designed as a cost-optimized, high-volume alternative to ASICs - delivering reprogrammable logic density, integrated memory, and clock management for embedded control and interface consolidation without non-recurring engineering costs.

FAQ

What is the maximum operating frequency of the XC2S100E-6TQ144C?

The XC2S100E-6TQ144C is rated for system performance beyond 200 MHz, with its -6 speed grade specifying guaranteed timing closure for critical paths including CLB-to-CLB, IOB-to-CLB, and DLL-controlled clock networks. Actual achievable frequency depends on design topology, placement, and routing - but the device consistently meets 160 MHz synchronous bus timing (e.g., PCI 33/66 MHz) and supports 100+ MHz DDR data capture using DLL-aligned sampling clocks.

Does the XC2S100E-6TQ144C support JTAG boundary scan?

Yes, the XC2S100E-6TQ144C fully complies with IEEE 1149.1 boundary scan. Its TCK, TMS, TDI, TDO, and TREN pins enable in-system programming, functional testing, and debug visibility without requiring physical probe access. This capability is integral to production test flow and field firmware updates, and is validated in DS077-2's Functional Description module.

Can the XC2S100E-6TQ144C be used in hot-swap applications?

Yes, the XC2S100E-6TQ144C supports hot swap per CompactPCI v2.2 specifications. Its I/O pins remain in high-impedance state before and during configuration, with no current path to VCCINT or VCCO. This allows safe insertion into powered backplanes - confirmed in DS077-2 Section "Hot Swap, Hot Insertion, Hot Socketing Support" and applicable to all Spartan-IIE devices manufactured after PCN2002-05.

What I/O standards does the XC2S100E-6TQ144C support?

The XC2S100E-6TQ144C supports 19 I/O standards including LVTTL, LVCMOS (1.8 V/2.5 V/3.3 V), PCI, SSTL3, HSTL, GTL, LVDS, and LVPECL. In the TQ144 package, all eight I/O banks share a single VCCO supply (3.3 V), permitting simultaneous use of LVTTL, PCI, SSTL3, and CTT - as specified in Table 4 of DS077-2 and validated in the I/O Banking section.

Is the XC2S100E-6TQ144C still in production?

No - the XC2S100E-6TQ144C is obsolete per Xilinx Change Notice XCN12026 (August 2013). However, Aetrix Electronics maintains legacy inventory and offers extended lifecycle support, including traceable sourcing, cross-reference assistance, and migration guidance to Spartan-3 or Artix-7 alternatives where functionally appropriate.