AMD XC2S100E-6TQG144C

Overview

XC2S100E-6TQG144C from Xilinx is a 100K-system-gate Spartan®-IIE Field-Programmable Gate Array with 2,700 logic cells, 600 CLBs, 202 user I/Os, four Delay-Locked Loops (DLLs), and 40 Kbits of block RAM. It operates at 1.8 V core voltage and supports 19 I/O standards including LVTTL, LVCMOS, SSTL, HSTL, LVDS, and PCI-compliant 3.3 V interfaces. It is used in cost-sensitive, high-volume embedded control and interface bridging applications requiring reprogrammable logic with deterministic timing.

For engineers reviewing the XC2S100E-6TQG144C datasheet, pinout, applications, or equivalent options, key selection considerations include its TQG144 Pb-free thin quad flat package, -6 speed grade (max 200 MHz system performance), commercial temperature range (0°C to +85°C), and support for hot-swap I/O in CompactPCI-compatible systems.

Technical Context

The XC2S100E-6TQG144C implements a hierarchical FPGA architecture with Configurable Logic Blocks (CLBs) containing four logic cells each, distributed 16×1-bit synchronous RAM per LUT, and dual-port 4K-bit block RAM modules. Its four corner-placed DLLs provide clock delay compensation, multiplication, division, and phase shifting - critical for synchronous interface timing closure.

I/O functionality is organized into eight independent banks supporting mixed-voltage operation: VCCO is shared across all banks in the TQG144 package, while each bank accepts independent VREF voltages. The device supports IEEE 1149.1 boundary scan and hot-swap capability per PCN2002-05, with I/O pins remaining high-impedance during power-up and configuration.

Key Specifications

Pinout & Package

The XC2S100E-6TQG144C is housed in a 144-pin Thin Quad Flat Package (TQFP) with Pb-free (G) finish, 0.5 mm pitch, and 20 × 20 mm body size. Pin definitions follow Xilinx DS077-4 (v3.0), with dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, DONE), JTAG boundary scan (TCK/TMS/TDI/TDO), and eight I/O banks (Bank 0–7).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2S100E-6TQG144C, the XC2S100-6TQ144C offers identical functionality without RoHS compliance, while the XC3S1000-4PQ240C delivers significantly higher capacity and lower power but mandates board-level redesign - making the XC2S100E-6TQG144C optimal for cost-constrained, Pb-free, drop-in replacement scenarios in mature industrial platforms.

Availability

XC2S100E-6TQG144C is available at Aetrix Electronics and suitable for industrial PLC I/O modules, CompactPCI hot-swap controllers, legacy bus bridges, video signal formatters, and embedded protocol converters requiring stable component supply through extended product lifecycles.

Supply support for XC2S100E-6TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures widely adopted in communications, aerospace, and industrial automation.

The Spartan-IIE family was designed for cost-sensitive, high-volume applications requiring reprogrammable logic with predictable timing, low power, and robust I/O flexibility - targeting industrial control, test equipment, and interface bridging where ASIC NRE costs were prohibitive.

FAQ

What is the maximum operating frequency of the XC2S100E-6TQG144C?

The XC2S100E-6TQG144C has a -6 speed grade specifying guaranteed performance up to 200 MHz for system clocking and internal logic paths. This rating is validated under recommended operating conditions (1.8 V VCCINT, 3.3 V VCCO, 0°C to +85°C) and reflects worst-case timing across process, voltage, and temperature corners. Actual achievable frequency depends on design utilization and routing congestion.

Does the XC2S100E-6TQG144C support JTAG boundary scan?

Yes, the XC2S100E-6TQG144C fully implements IEEE 1149.1-compliant boundary scan logic with dedicated TCK, TMS, TDI, and TDO pins. This enables in-circuit testing, configuration verification, and debug access without requiring additional test points. The boundary scan chain covers all I/O pins and internal logic elements as defined in Xilinx DS077-2.

Can the XC2S100E-6TQG144C be used in hot-swap applications?

Yes, the XC2S100E-6TQG144C supports hot-swap functionality per Xilinx Product Change Notice PCN2002-05. Its I/O pins remain high-impedance before and during configuration, with no current path to VCCINT or VCCO, and immunity to latch-up - meeting CompactPCI v2.2 requirements for live insertion into powered backplanes.

What I/O standards does the XC2S100E-6TQG144C support?

The XC2S100E-6TQG144C supports 19 I/O standards including LVTTL, LVCMOS (1.8 V/2.5 V/3.3 V), SSTL2/I, SSTL3/I, HSTL Class I/III/IV, AGP, CTT, GTL, GTL+, LVDS, and LVPECL. I/O banks allow mixing compatible standards within voltage constraints - e.g., LVTTL and PCI on same VCCO=3.3 V, but not with SSTL2 on same bank.

Is the XC2S100E-6TQG144C still in production?

No, the XC2S100E-6TQG144C is obsolete per Xilinx Notice XCN12026 (August 2013). However, Aetrix Electronics maintains verified legacy inventory with full traceability and offers lifecycle management support - including cross-reference guidance, obsolescence mitigation planning, and long-term supply assurance for industrial and defense programs dependent on this device.