AMD XC2S150-5FG256I
- Part No.:
- XC2S150-5FG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2S150-5FG256I.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,512
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Product details
Overview
XC2S150-5FG256I from AMD (formerly Xilinx) is a Spartan-II family FPGA with 150,000 system gates, 1728 logic cells, and a 5 ns maximum input-to-output delay. It features 224 I/O pins, embedded block RAM, and supports LVCMOS/LVTTL I/O standards. It is used in industrial control logic and reconfigurable digital signal processing subsystems.
For engineers reviewing the XC2S150-5FG256I datasheet, pinout, applications, or equivalent options, key selection considerations include logic density, I/O count, speed grade (-5), and FG256 flip-chip BGA package compatibility with thermal and routing constraints.
Technical Context
The XC2S150-5FG256I implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM, and dedicated carry logic for arithmetic. It includes eight global clock buffers and supports internal clock division via DLL-based clock management.
Configuration is performed via serial mode using an external PROM or master processor through the JTAG boundary-scan interface. The device operates at 2.5 V core voltage and supports 3.3 V or 2.5 V I/O banks with programmable drive strength and slew rate control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 150,000 system gates - defines maximum combinational logic complexity supported |
| Logic Cells | 1,728 CLBs - each contains two function generators and two storage elements for synchronous logic |
| Max I/O Pins | 224 - supports high-pin-count interface bridging and parallel bus interfacing |
| Speed Grade | -5 - guarantees 5 ns input-to-output propagation delay under specified conditions |
| Core Voltage | 2.5 V ± 0.1 V - requires dedicated low-noise 2.5 V supply rail with tight regulation |
| I/O Standards | LVCMOS, LVTTL - enables direct interfacing with common microcontrollers and memory devices |
| Package | FG256 - 256-ball fine-pitch flip-chip BGA with 1.0 mm pitch and 17 × 17 mm body |
Pinout & Package
XC2S150-5FG256I is housed in a 256-ball flip-chip BGA (FG256) package with 1.0 mm ball pitch, thermal pad on underside, and standard JEDEC MO-205 footprint. Pin assignment follows Xilinx Spartan-II pinout conventions with dedicated configuration, clock, and I/O bank groups.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCK0–GCK7 | Global Clock Input | Eight dedicated low-skew inputs feeding global clock networks |
| PROGRAM_B | Configuration Initiate | Active-low signal that resets configuration logic and clears SRAM contents |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan | IEEE 1149.1-compliant test and programming interface |
| VCCO_0–VCCO_7 | I/O Bank Supply | Independent 3.3 V or 2.5 V supplies per I/O bank for mixed-voltage operation |
| VCCINT | Core Power | 2.5 V supply for internal logic and CLB circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | Each CLB provides dual 4-input LUTs + dual flip-flops, enabling efficient register-rich logic implementation |
| Embedded Block RAM | 176 kbits total - usable as dual-port RAM, FIFO, or shift register without external memory |
| Digital Clock Manager (DCM) | On-chip DLL-based clock synthesis supporting frequency synthesis, phase shifting, and duty-cycle correction |
| SelectIO Technology | Programmable drive strength (2–24 mA) and slew rate control per I/O bank for EMI reduction and signal integrity |
| Boundary-Scan Support | Full IEEE 1149.1 compliance for board-level test, debug, and in-system programming |
Applications
| Industrial Motion Control | Automotive Body Controller |
|---|---|
Use Scenario: Real-time closed-loop servo positioning with encoder feedback and PWM motor drive timing. IC Role / Device Role / Timing Role: FPGA fabric implements custom PID loop logic, pulse-width modulation generator, and safety interlock state machine. Use Value: Deterministic 5 ns timing enables sub-microsecond control cycle resolution and jitter-free PWM edge placement. | Use Scenario: Centralized door/window/mirror control with LIN bus interface and LED driver sequencing. IC Role / Device Role / Timing Role: Configurable I/O and logic handles protocol translation, debounce, and multi-channel LED current control timing. Use Value: 224 I/O pins support simultaneous connection to sensors, actuators, and LIN transceivers without glue logic. |
| Medical Imaging Interface | Test & Measurement Equipment |
Use Scenario: High-speed ADC data capture and real-time pixel preprocessing before transfer to host processor. IC Role / Device Role / Timing Role: Synchronizes parallel ADC outputs, applies fixed-point filtering, and formats data for PCI/PCIe transfer. Use Value: Embedded block RAM buffers full frame data while CLBs execute pixel-level operations at system clock rate. | Use Scenario: Modular signal generation and acquisition with programmable trigger logic and waveform memory. IC Role / Device Role / Timing Role: Generates precise timing sequences for DAC update clocks, ADC sampling strobes, and digital pattern stimulus. Use Value: DCM-generated clocks provide stable, phase-aligned timing domains across multiple analog and digital subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O expansion applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-6FG256C | Slower -6 speed grade (6 ns delay); commercial temperature range (0°C to 70°C) | Lacks extended industrial temperature support; unsuitable for environments exceeding 70°C | Choose only if cost sensitivity outweighs timing margin and temperature requirements |
| XC2S200-5FG256I | Higher logic density (200K gates, 2176 CLBs); same speed grade and package | Provides additional resources for larger state machines or wider datapaths without PCB change | Select when design requires >150K gates but must retain FG256 footprint and thermal profile |
Compared with XC2S150-5FG256I, the XC2S150-6FG256C trades timing margin for lower cost in benign environments, while XC2S200-5FG256I extends logic capacity within identical mechanical and thermal constraints.
Availability
XC2S150-5FG256I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interfaces, and test & measurement equipment requiring stable component supply and long-term obsolescence planning.
Supply support for XC2S150-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the Spartan, Virtex, and Artix FPGA families originally introduced by Xilinx.
The Spartan-II product line was designed for cost-sensitive, high-volume applications requiring moderate logic density, fast I/O, and deterministic timing - especially in industrial automation and embedded control.
FAQ
What is the operating temperature range for XC2S150-5FG256I?
The XC2S150-5FG256I is rated for industrial temperature operation from –40°C to +85°C. This range ensures reliable functionality in factory-floor controllers, outdoor instrumentation, and automotive under-hood modules where ambient thermal stress exceeds commercial-grade limits. The FG256 package's thermal pad aids heat dissipation under sustained logic activity.
Does XC2S150-5FG256I support in-system programming?
Yes, XC2S150-5FG256I supports in-system programming via its IEEE 1149.1 JTAG interface (TCK/TMS/TDI/TDO pins). Configuration bitstreams can be loaded dynamically during operation using a host processor or dedicated JTAG controller, enabling field-upgradable logic functions without physical rework or device replacement.
What power supply requirements does XC2S150-5FG256I have?
XC2S150-5FG256I requires a regulated 2.5 V ±0.1 V supply for VCCINT (core logic) and separate 3.3 V or 2.5 V supplies for each I/O bank (VCCO). Decoupling capacitors must be placed near all VCCINT and VCCO pins per Xilinx Spartan-II PCB layout guidelines to maintain signal integrity and prevent configuration failure.
Can XC2S150-5FG256I replace XC2S100-5FG256I in an existing design?
Yes, XC2S150-5FG256I is pin-compatible with XC2S100-5FG256I in the FG256 package and shares identical power, clock, and configuration pinouts. The higher gate count and CLB count of XC2S150-5FG256I allow functional upgrades without PCB revision, provided thermal and power delivery margins accommodate the increased logic utilization.
What configuration modes are supported by XC2S150-5FG256I?
XC2S150-5FG256I supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. External PROMs (e.g., Xilinx XC18V02) are commonly used in Master Serial mode, while microcontrollers often drive Slave Parallel mode for dynamic reconfiguration. JTAG is used for debugging and initial programming.
XC2S150-5FG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 864
- Number of Logic Elements/Cells:
- 3888
- Total RAM Bits:
- 49152
- Number of I/O:
- 176
- Number of Gates:
- 150000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2S150-5FG256I FAQ
1.How can I place an order for XC2S150-5FG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S150-5FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S150-5FG256I reliable?
The price and inventory of XC2S150-5FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S150-5FG256I is usually 5 days.
3.What payment methods are accepted for XC2S150-5FG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S150-5FG256I transactions.
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4.How is shipping managed for XC2S150-5FG256I?
XC2S150-5FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S150-5FG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S150-5FG256I?
For technical support, including XC2S150-5FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S150-5FG256I requirements.
6.How does Aetrix verify that XC2S150-5FG256I is sourced from the original manufacturer or authorized distributors?
All XC2S150-5FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S150-5FG256I meets industry standards.
7.What is the process for return or replacement of XC2S150-5FG256I?
All XC2S150-5FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2S150-5FG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S150-5FG256I part is unused and in its original packaging.
Return procedure for XC2S150-5FG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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