AMD XC2S150-5FG456C
- Part No.:
- XC2S150-5FG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2S150-5FG456C.pdf
- Description:
- IC FPGA 260 I/O 456FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,007
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Product details
Overview
XC2S150-5FG456C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 150,000 system gates, 176 I/O pins, and a 5 ns input/output delay specification in the Fine-Pitch Ball Grid Array (FBGA) 456-pin package. It integrates configurable logic blocks, distributed RAM, and DLL-based clock management for embedded control and digital signal processing applications.
For engineers reviewing the XC2S150-5FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, system gate density, DLL support, timing grade (-5), and FBGA456 thermal/mechanical compatibility in industrial motor control and communications interface designs.
Technical Context
The XC2S150-5FG456C implements a hierarchical architecture with CLBs containing four 3-input LUTs and flip-flops per slice, supporting synchronous logic and registered outputs. It features eight global clock networks and a Digital Delay Lock Loop (DLL) for zero-delay clock distribution and input deskew.
Configuration is performed via serial mode using an external PROM or master processor; boundary-scan (JTAG) supports IEEE 1149.1 testing. The device operates at 3.3 V I/O and 2.5 V core voltage, with LVCMOS/LVTTL-compatible I/O standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 150,000 - defines maximum combinational logic capacity for logic synthesis mapping |
| I/O Pins | 176 - supports high-channel-count interfaces such as parallel buses or multi-lane data acquisition |
| Logic Cells | 4,160 - number of configurable logic blocks (CLBs), each with dual 4-LUTs and registers |
| Max Clock Frequency | 200 MHz - achievable system clock rate with full timing closure using -5 speed grade |
| Internal Delay (TPD) | 5 ns - guaranteed propagation delay from input to registered output under worst-case conditions |
| Package | FBGA-456 - 23×23 mm body, 1.0 mm ball pitch, suitable for automated SMT assembly and thermal dissipation |
Pinout & Package
XC2S150-5FG456C is housed in a 456-ball Fine-Pitch Ball Grid Array (FBGA) package with 176 user I/Os, 8 dedicated global clock inputs, 4 configuration pins (INIT, PROGRAM, DONE, CCLK), and power/ground balls distributed across the array for low-noise operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration shift register during master serial mode; requires clean 3.3 V CMOS waveform |
| DONE | Configuration Status | Open-drain output indicating successful configuration completion; pulled high externally |
| PROGRAM_B | Initiate Reconfiguration | Active-low asynchronous reset that clears configuration memory and restarts loading sequence |
| INIT_B | Configuration Initialization | Open-drain status signal indicating readiness to accept new bitstream; used for error detection |
| GCLK0–GCLK7 | Global Clock Inputs | Dedicated low-skew routing paths to all CLBs; enables synchronous design across large logic regions |
Key Features
| Feature | Design Value |
|---|---|
| Digital Delay Lock Loop (DLL) | Eliminates clock skew between input and internal logic domains; supports phase alignment up to ±180° |
| Distributed RAM | Up to 48 Kbits of fast, dual-port block RAM implemented within CLBs for FIFO or lookup table use |
| LVCMOS/LVTTL I/O Support | Configurable per-bank voltage (3.3 V) with programmable drive strength and slew rate control |
| IEEE 1149.1 JTAG Boundary Scan | Enables in-circuit testability and programming without requiring dedicated configuration hardware |
Applications
| Industrial Motion Control | Communications Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop coordination in multi-axis CNC controllers requiring deterministic latency. IC Role / Device Role / Timing Role: FPGA fabric implements position interpolators, PWM generators, and encoder interface logic with sub-microsecond response. Use Value: DLL ensures synchronized sampling of analog feedback and precise timing of 20 kHz PWM outputs across all axes. | Use Scenario: Protocol translation between legacy RS-485 fieldbus and modern Ethernet-based SCADA systems. IC Role / Device Role / Timing Role: Configurable logic handles UART-to-MAC framing, CRC generation, and packet buffering. Use Value: 176 I/O pins enable simultaneous connection to multiple serial peripherals and Ethernet PHY interface signals. |
| Medical Imaging Data Acquisition | Test Equipment Pattern Generator |
Use Scenario: High-speed digitization and preprocessing of ultrasound echo data before transfer to DSP subsystem. IC Role / Device Role / Timing Role: Implements real-time FIR filtering, channel multiplexing, and DDR memory controller for frame buffering. Use Value: 150K system gates accommodate complex filter pipelines while maintaining 5 ns I/O timing for ADC/DAC interfacing. | Use Scenario: Generating precise stimulus waveforms and capturing response signatures in ATE platforms. IC Role / Device Role / Timing Role: Serves as programmable pattern engine with deterministic cycle-accurate output sequencing. Use Value: -5 speed grade guarantees 200 MHz operation for 5 ns resolution timing control across 176 parallel test channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-6FG456C | Faster speed grade (-6) with 4.5 ns TPD; identical pinout and logic resources | Required only when design exceeds 200 MHz timing closure with -5 grade | Select XC2S150-6FG456C only if post-place-and-route timing analysis fails with XC2S150-5FG456C |
| XC3S200-4PQ240C | Spartan-3 family; higher logic density (200K gates), different package (240-pin PQFP), no DLL | Lacks DLL-based clock deskew; requires external PLL or careful PCB layout for timing-critical I/O | Choose XC3S200-4PQ240C only if board space allows PQFP and DLL functionality is not required |
Compared with XC2S150-6FG456C, the XC2S150-5FG456C trades 0.5 ns propagation delay for broader availability and lower cost in volume production; versus XC3S200-4PQ240C, it retains DLL support and FBGA thermal performance but offers lower gate count and mature toolchain compatibility.
Availability
XC2S150-5FG456C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging data acquisition, and communications interface bridge applications requiring stable component supply and long-term obsolescence management.
Supply support for XC2S150-5FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-II product support, documentation, and cross-reference tools for industrial and aerospace customers.
The Spartan-II family, including XC2S150-5FG456C, was designed for cost-sensitive, high-volume embedded control and digital interface applications requiring predictable timing and proven reliability.
FAQ
What is the core voltage requirement for XC2S150-5FG456C?
The XC2S150-5FG456C requires a 2.5 V ± 3% core supply (VCCINT) and a separate 3.3 V ± 5% I/O supply (VCCO). Decoupling must follow Xilinx Spartan-II Hardware User Guide recommendations, using 0.1 µF ceramic capacitors near each power ball and bulk electrolytic capacitance on the board. Failure to meet these tolerances may cause configuration failure or metastability in XC2S150-5FG456C operation.
Does XC2S150-5FG456C support in-system programming?
Yes, XC2S150-5FG456C supports in-system programming via JTAG (IEEE 1149.1) using compatible download cables or embedded processors. Configuration bitstreams can be reloaded without power cycling, enabling field firmware updates. The XC2S150-5FG456C does not support internal flash storage, so external PROM or processor-controlled serial loading remains necessary for power-on initialization.
What is the maximum operating junction temperature for XC2S150-5FG456C?
The XC2S150-5FG456C is rated for a maximum junction temperature of +100°C under continuous operation, consistent with its Industrial temperature grade ('C' suffix). Thermal design must ensure case temperature stays below 85°C under worst-case ambient and airflow conditions. The XC2S150-5FG456C FBGA-456 package includes thermal balls to aid heat conduction to the PCB ground plane.
Can XC2S150-5FG456C replace XC2S100-5FG456C in an existing design?
Yes, XC2S150-5FG456C is pin-compatible and functionally upward-compatible with XC2S100-5FG456C, sharing identical FBGA-456 packaging, I/O bank structure, and configuration interface. The XC2S150-5FG456C provides additional logic resources (150K vs. 100K gates) and CLBs without requiring PCB changes, making it a direct upgrade path where increased logic capacity is needed.
Is third-party toolchain support available for XC2S150-5FG456C?
Xilinx ISE WebPACK v14.7 remains the officially supported synthesis and implementation toolchain for XC2S150-5FG456C. While some open-source tools like Yosys+Nextpnr offer limited experimental support, timing closure, DLL configuration, and bitstream generation are only guaranteed with ISE. Customers must use ISE to generate valid, verified bitstreams for production use of XC2S150-5FG456C.
XC2S150-5FG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 864
- Number of Logic Elements/Cells:
- 3888
- Total RAM Bits:
- 49152
- Number of I/O:
- 260
- Number of Gates:
- 150000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2S150-5FG456C FAQ
1.How can I place an order for XC2S150-5FG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S150-5FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S150-5FG456C reliable?
The price and inventory of XC2S150-5FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S150-5FG456C is usually 5 days.
3.What payment methods are accepted for XC2S150-5FG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S150-5FG456C transactions.
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4.How is shipping managed for XC2S150-5FG456C?
XC2S150-5FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S150-5FG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S150-5FG456C?
For technical support, including XC2S150-5FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S150-5FG456C requirements.
6.How does Aetrix verify that XC2S150-5FG456C is sourced from the original manufacturer or authorized distributors?
All XC2S150-5FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S150-5FG456C meets industry standards.
7.What is the process for return or replacement of XC2S150-5FG456C?
All XC2S150-5FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S150-5FG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S150-5FG456C part is unused and in its original packaging.
Return procedure for XC2S150-5FG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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