My Inquiry
My Account
AMD XC2S150-5FG456I
- Part No.:
- XC2S150-5FG456I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2S150-5FG456I.pdf
- Description:
- IC FPGA 260 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,376
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2S150-5FG456I from AMD (formerly Xilinx) is a Spartan-II family FPGA with 150,000 system gates, 17,280 bits of block RAM, and a 5 ns logic delay. It features 456-pin Fine-Pitch Ball Grid Array (FBGA) packaging and operates at -5 speed grade (5 ns CLB propagation delay), targeting cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC2S150-5FG456I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (304 user I/Os), voltage supply (2.5 V core / 3.3 V I/O), configuration mode support (Master Serial, Slave Parallel), and thermal performance in industrial temperature range (-40°C to +100°C).
Technical Context
The XC2S150-5FG456I implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM, and dedicated carry logic for arithmetic. It supports SelectI/O standards including LVTTL, LVCMOS, PCI, and HSTL Class I on its 304 user I/O pins.
Configuration is performed via external PROM or microprocessor using Master Serial, Slave Serial, or Slave Parallel modes. The device includes internal 2.5 V voltage regulator for core logic and supports JTAG boundary-scan testing per IEEE 1149.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 150,000 system gates - defines maximum combinational/sequential logic density for gate-equivalent design mapping |
| Block RAM | 17,280 bits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external SRAM |
| User I/O Pins | 304 - supports high-pin-count interface bridging (e.g., parallel bus translation or multi-peripheral control) |
| Core Voltage | 2.5 V ± 0.1 V - requires dedicated low-noise core regulator; impacts power integrity layout and decoupling strategy |
| Speed Grade | -5 (5 ns CLB Tpd) - specifies worst-case propagation delay through one CLB; determines maximum achievable clock frequency |
| Operating Temperature | -40°C to +100°C - qualifies for industrial-grade deployment without derating in convection-cooled enclosures |
| I/O Standards | LVTTL, LVCMOS, PCI, HSTL Class I - enables direct interfacing with legacy microcontrollers, FPGAs, and memory devices |
Pinout & Package
XC2S150-5FG456I uses a 456-ball fine-pitch BGA (FBGA) package with 20 × 20 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-230 footprint. Thermal pad is not present; mechanical mounting relies on perimeter solder joints.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally with 10 µF + 0.1 µF capacitors |
| H2 | VCCINT | Core logic power (2.5 V) - shared across all CLBs and interconnect; sensitive to ripple & noise |
| K3 | TCK | JTAG test clock input - requires 10 kΩ pull-down for compliance with IEEE 1149.1 boundary-scan |
| M4 | PROGRAM_B | Active-low configuration reset - asynchronous assertion forces re-initialization from configuration source |
| P5 | DONE | Open-drain status output - goes high-Z after successful configuration; pulled up externally to indicate readiness |
| R6 | INIT_B | Open-drain initialization status - asserted low during configuration, released upon completion or error |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | Each CLB contains two function generators (4-LUTs) and two storage elements - enables efficient implementation of state machines and pipelined logic |
| Dedicated Carry Chain | Fast arithmetic path across CLBs - reduces adder/subtractor propagation delay by >40% vs. general routing |
| SelectI/O Technology | Per-bank I/O voltage assignment (VCCO) - allows mixed-voltage operation (e.g., 3.3 V CPU interface + 2.5 V memory interface) |
| Internal 2.5 V Regulator | On-die core voltage regulation - eliminates need for external core regulator but requires strict input voltage tolerance (2.5 V ± 0.1 V) |
| JTAG Boundary-Scan | IEEE 1149.1-compliant test access port - enables board-level interconnect verification without physical probe access |
Applications
| Industrial PLC I/O Module | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Replacing ASIC-based digital I/O expansion in programmable logic controllers with field-upgradable logic. IC Role / Device Role / Timing Role: Configurable glue logic and protocol translator between microcontroller and isolated digital I/O banks. Use Value: Enables firmware-driven I/O mapping changes without PCB redesign; 304 I/Os support up to 24-channel analog/digital modules. | Use Scenario: Bridging ISA or VMEbus peripherals to modern microprocessor buses in test equipment upgrades. IC Role / Device Role / Timing Role: Synchronous protocol converter with timing control for address/data strobes and handshaking signals. Use Value: 5 ns CLB delay ensures sub-20 MHz bus cycle timing compliance; SelectI/O supports both 3.3 V and 5 V signaling domains. |
| Motor Control Encoder Interface | Medical Imaging Data Formatter |
Use Scenario: Real-time quadrature decoding and position interpolation for servo drives in factory automation. IC Role / Device Role / Timing Role: High-speed counter and direction logic synchronized to encoder clock (up to 20 MHz). Use Value: Dedicated carry chain enables 32-bit position counters with zero-cycle overflow detection; 100°C rating supports enclosed drive environments. | Use Scenario: Formatting parallel CCD sensor outputs into serialized LVDS streams for FPGA-based image acquisition cards. IC Role / Device Role / Timing Role: Pixel clock domain crossing, line buffering, and packet framing engine. Use Value: 17,280-bit block RAM provides 2-line deep buffering at 40 MSPS; 304 I/Os route parallel sensor bus and serial output lanes simultaneously. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-6FG456C | Same logic resources and package, but -6 speed grade (4.5 ns CLB Tpd) and commercial temperature range (0°C to +70°C) | Lacks industrial temperature qualification; unsuitable for extended ambient or uncooled enclosures | Choose only for cost-sensitive commercial systems where timing margin exceeds 0.5 ns and ambient stays below 70°C |
| XC3S200-4PQ240C | Smaller logic capacity (200,000 gates), different package (240-pin PQFP), no internal core regulator, and Spartan-3 architecture | Requires external 1.2 V core regulator; lacks SelectI/O flexibility for mixed-voltage interfaces | Consider only if migrating to newer architecture with lower power and higher density, accepting PCB redesign and new power delivery |
Compared with XC2S150-5FG456I, the XC2S150-6FG456C trades industrial reliability for marginal speed gain, while XC3S200-4PQ240C introduces architectural and packaging discontinuity requiring full hardware revision - neither offers drop-in replacement capability.
Availability
XC2S150-5FG456I is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and legacy bus upgrade programs requiring stable component supply over extended production lifecycles.
Supply support for XC2S150-5FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-II product support, documentation, and quality assurance under the AMD Adaptive SoC portfolio.
The Spartan-II family was designed for cost-optimized, high-volume embedded control and interface logic applications where predictable timing, industrial temperature operation, and long-term supply stability are critical.
FAQ
What is the maximum operating frequency supported by XC2S150-5FG456I?
The XC2S150-5FG456I has a -5 speed grade specifying 5 ns CLB propagation delay. While maximum system clock frequency depends on design topology, synthesis tools report typical achievable frequencies of 120–160 MHz for register-to-register paths. Critical paths involving carry chains or distributed RAM may sustain >200 MHz in optimized implementations. The actual frequency for XC2S150-5FG456I must be verified per design using Xilinx ISE timing analysis.
Does XC2S150-5FG456I require an external configuration PROM?
Yes, XC2S150-5FG456I does not include on-chip nonvolatile configuration memory and requires an external serial PROM (e.g., Xilinx XC18V02) or microprocessor-controlled parallel loading. Configuration occurs on power-up or after PROGRAM_B assertion. The XC2S150-5FG456I supports Master Serial, Slave Serial, and Slave Parallel modes, but all rely on external storage for bitstream persistence.
Can XC2S150-5FG456I operate with 3.3 V core voltage?
No, XC2S150-5FG456I requires 2.5 V ± 0.1 V on VCCINT for core logic operation. Applying 3.3 V will cause permanent damage. Its I/O banks accept 3.3 V signaling levels (via VCCO), but core voltage is strictly 2.5 V and regulated internally. External supply must meet tight tolerance; deviation beyond ±0.1 V risks timing violation or functional failure of XC2S150-5FG456I.
Is XC2S150-5FG456I pin-compatible with other Spartan-II devices in FG456 package?
XC2S150-5FG456I shares the same 456-ball FBGA footprint with other Spartan-II devices in the FG456 package (e.g., XC2S100, XC2S200), but pin functions differ across densities due to varying CLB counts, RAM distribution, and I/O bank assignments. Direct substitution without netlist and constraint file updates is not supported. Pin compatibility applies only within identical density and speed grade variants.
What configuration modes does XC2S150-5FG456I support?
XC2S150-5FG456I supports three configuration modes: Master Serial (using on-chip oscillator to clock external PROM), Slave Serial (microprocessor clocks data into FPGA), and Slave Parallel (8- or 16-bit wide parallel loading). Mode selection is controlled by MODE pins (M0–M2); all modes require external configuration source and are mutually exclusive per power cycle. JTAG is available for programming and debugging but does not replace primary configuration.
XC2S150-5FG456I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 864
- Number of Logic Elements/Cells:
- 3888
- Total RAM Bits:
- 49152
- Number of I/O:
- 260
- Number of Gates:
- 150000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2S150-5FG456I FAQ
1.How can I place an order for XC2S150-5FG456I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S150-5FG456I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S150-5FG456I reliable?
The price and inventory of XC2S150-5FG456I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S150-5FG456I is usually 5 days.
3.What payment methods are accepted for XC2S150-5FG456I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S150-5FG456I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S150-5FG456I?
XC2S150-5FG456I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S150-5FG456I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S150-5FG456I?
For technical support, including XC2S150-5FG456I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S150-5FG456I requirements.
6.How does Aetrix verify that XC2S150-5FG456I is sourced from the original manufacturer or authorized distributors?
All XC2S150-5FG456I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S150-5FG456I meets industry standards.
7.What is the process for return or replacement of XC2S150-5FG456I?
All XC2S150-5FG456I units undergo pre-shipment inspection (PSI). If there is an issue with XC2S150-5FG456I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S150-5FG456I part is unused and in its original packaging.
Return procedure for XC2S150-5FG456I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2S150-5FG456I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
