AMD XC2S150-5FGG256C
- Part No.:
- XC2S150-5FGG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2S150-5FGG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC2S150-5FGG256C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 150,000 system gates, 1728 configurable logic blocks (CLBs), 256-pin Fine-Pitch Ball Grid Array (FBGA) package, and -5 speed grade (5 ns CLB delay). It is used in industrial control logic, digital signal preprocessing, and low-cost communication interface bridging.
For engineers reviewing the XC2S150-5FGG256C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count (176 user I/Os), distributed RAM capacity (72 Kb), global clock resources (4 dedicated clock pins), and compliance with IEEE 1149.1 JTAG boundary-scan test standard.
Technical Context
The XC2S150-5FGG256C implements synchronous logic using four-input LUTs and flip-flops per CLB, supports SelectIO™ technology for single-ended and differential signaling (LVCMOS, LVTTL, PCI, HSTL, SSTL), and includes dedicated carry logic for high-speed arithmetic. It integrates up to 72 Kb of distributed RAM and supports in-system configuration via JTAG or serial PROM.
Configuration is performed through the internal startup sequence after power-on, with support for master serial, slave serial, and boundary-scan modes. The device uses 2.5 V core voltage and 3.3 V I/O voltage, with internal voltage regulation for core supply stability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 150,000 system gates - defines maximum combinational logic density for gate-equivalent design mapping |
| Configurable Logic Blocks | 1,728 CLBs - each contains two 4-input LUTs and two flip-flops, forming basic logic and register units |
| User I/O Pins | 176 - supports multi-standard interfaces including LVCMOS, LVTTL, and PCI without level shifters |
| Distributed RAM | 72 Kb - implemented as shift registers or small memory blocks within CLBs, not block RAM |
| Global Clock Resources | 4 dedicated clock pins - provide low-skew routing to all CLBs and I/O banks for synchronous timing control |
| Core Voltage | 2.5 V ± 0.1 V - requires regulated core supply; I/O banks operate at 3.3 V independently |
| Speed Grade | -5 - specifies 5 ns CLB propagation delay, enabling operation up to ~160 MHz system clock in typical designs |
Pinout & Package
XC2S150-5FGG256C is housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and thermal pad exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1–G4, H1–H4 | Dedicated Global Clock Inputs | Low-skew clock distribution network inputs; must be driven by clean, low-jitter sources |
| A1–A16, B1–B16, etc. | User I/O Banks (Bank 0–3) | Each bank supports independent VCCO voltage (3.3 V) and selectable I/O standard per pin group |
| T14, U14, V14, W14 | JTAG Boundary-Scan Test Pins | TCK, TMS, TDI, TDO - enable IEEE 1149.1 compliant programming and debug without external hardware |
| R15, T15 | Configuration Mode Select | M0, M1 - set boot mode (master serial, slave serial, JTAG) at power-up |
| V17, W17, Y17, Y18 | Power Supply Pins | VCCINT (2.5 V core), VCCAUX (2.5 V auxiliary), VCCO (3.3 V I/O), GND - require local decoupling |
Key Features
| Feature | Design Value |
|---|---|
| Four-input LUT architecture | Enables efficient implementation of Boolean functions up to 4 variables per LUT without decomposition |
| SelectIO™ technology | Allows mixed-voltage I/O operation across four independent banks, supporting legacy and modern interface standards |
| In-system programmability | Permits field updates via JTAG or serial PROM without device removal or socketing |
| Dedicated carry chain | Provides fast ripple-carry arithmetic for counters and adders with predictable timing path |
| IEEE 1149.1 JTAG support | Enables boundary-scan testing, configuration, and debugging using standard tools and cables |
Applications
| Industrial Motion Control | Digital Video Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop coordination in CNC machines using encoder feedback and PWM output generation. IC Role / Device Role / Timing Role: Configurable logic fabric executes position interpolation, pulse-width modulation, and safety interlock logic with deterministic latency. Use Value: 176 user I/Os allow direct connection to multiple encoders, analog-to-digital converters, and motor drivers without glue logic. | Use Scenario: Converting parallel RGB video data from image sensors to serialized LVDS streams for display panels. IC Role / Device Role / Timing Role: Synchronizes pixel clock domains, applies gamma correction lookup tables, and formats data for serializer IP cores. Use Value: Distributed RAM (72 Kb) stores frame buffers and LUT-based gamma tables; SelectIO™ supports both 3.3 V sensor I/O and LVDS output standards. |
| PCI Bus Interface Adapter | Low-Cost Baseband Modem Controller |
Use Scenario: Adding custom peripheral capability to legacy PC/104 systems via PCI slot expansion. IC Role / Device Role / Timing Role: Implements PCI target interface logic, address decoding, and burst transaction handling in hardware. Use Value: -5 speed grade ensures setup/hold timing compliance with 33 MHz PCI clock; 176 I/Os accommodate address/data multiplexing and control signals. | Use Scenario: Managing QAM demodulation handshaking, symbol timing recovery, and FEC decoding control in cable modem front-ends. IC Role / Device Role / Timing Role: Coordinates ADC sampling clocks, manages DMA transfers to external memory, and sequences DSP firmware loading. Use Value: Four global clock inputs synchronize ADC sampling, symbol clock recovery, and host interface timing domains independently. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-5PQ208C | 208-pin PQFP package, lower I/O count (140), no thermal pad, higher thermal resistance | Suitable for prototyping or space-constrained PCBs where BGA rework is impractical | Select when manual assembly, thermal budget allows >15°C/W junction-to-ambient, or board layout lacks BGA routing capability |
| XC3S200-4PQ208C | Spartan-3 family, 200,000 logic cells, 4 ns CLB delay, 2.5 V core, but requires different configuration bitstream and toolchain | Better suited for higher gate-count designs requiring embedded multipliers or larger block RAM | Choose when migrating to newer architecture with improved DSP efficiency and larger memory resources |
Compared with XC2S150-5PQ208C, the XC2S150-5FGG256C offers higher I/O density and superior thermal performance; compared with XC3S200-4PQ208C, it requires legacy ISE 6.x tool support and lacks dedicated DSP slices, making it appropriate for cost-sensitive, mature-design maintenance rather than new high-performance logic development.
Availability
XC2S150-5FGG256C is available at Aetrix Electronics and suitable for industrial motion control, digital video interface bridging, and PCI bus interface adapter applications requiring stable component supply across extended product lifecycles.
Supply support for XC2S150-5FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-II product support, documentation, and long-term supply commitments for industrial and aerospace customers.
The Spartan-II family was designed for cost-sensitive, high-volume applications requiring moderate logic density, fast I/O, and in-system programmability - especially in industrial automation and communications infrastructure.
FAQ
What is the maximum operating frequency supported by XC2S150-5FGG256C?
The XC2S150-5FGG256C has a -5 speed grade specifying a 5 ns CLB propagation delay, enabling typical system clock frequencies up to 160 MHz in well-constrained designs. Actual achievable frequency depends on logic depth, routing congestion, and I/O timing closure. Static timing analysis in Xilinx ISE 6.3 must confirm timing for each specific implementation.
Does XC2S150-5FGG256C support JTAG boundary-scan testing?
Yes, XC2S150-5FGG256C fully complies with IEEE 1149.1 JTAG boundary-scan standard. Pins TCK, TMS, TDI, and TDO (balls W14, V14, U14, T14) provide access for programming, debugging, and interconnect testing without requiring additional test fixtures or probes.
What power supply voltages does XC2S150-5FGG256C require?
XC2S150-5FGG256C requires two separate supplies: 2.5 V ± 0.1 V for the core logic (VCCINT), and 3.3 V for I/O banks (VCCO). An auxiliary 2.5 V supply (VCCAUX) powers configuration and JTAG circuitry. Each supply must be locally decoupled with low-ESR capacitors near the FBGA corners.
Can XC2S150-5FGG256C be configured using a serial PROM?
Yes, XC2S150-5FGG256C supports master serial configuration mode using industry-standard Xilinx-compatible PROMs (e.g., XCF02S, XCF04S). Configuration occurs automatically on power-up when M0 and M1 pins are set to 01, loading the bitstream from the PROM into SRAM-based configuration memory.
Is XC2S150-5FGG256C still in active production?
XC2S150-5FGG256C is in long-term, controlled-lifecycle status under AMD's legacy product support program. While no longer in high-volume wafer fabrication, Aetrix Electronics maintains verified inventory and authorized channel supply with full traceability and extended availability assurance for industrial and defense customers.
XC2S150-5FGG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 864
- Number of Logic Elements/Cells:
- 3888
- Total RAM Bits:
- 49152
- Number of I/O:
- 176
- Number of Gates:
- 150000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2S150-5FGG256C FAQ
1.How can I place an order for XC2S150-5FGG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S150-5FGG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S150-5FGG256C reliable?
The price and inventory of XC2S150-5FGG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S150-5FGG256C is usually 5 days.
3.What payment methods are accepted for XC2S150-5FGG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S150-5FGG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S150-5FGG256C?
XC2S150-5FGG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S150-5FGG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S150-5FGG256C?
For technical support, including XC2S150-5FGG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S150-5FGG256C requirements.
6.How does Aetrix verify that XC2S150-5FGG256C is sourced from the original manufacturer or authorized distributors?
All XC2S150-5FGG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S150-5FGG256C meets industry standards.
7.What is the process for return or replacement of XC2S150-5FGG256C?
All XC2S150-5FGG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S150-5FGG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S150-5FGG256C part is unused and in its original packaging.
Return procedure for XC2S150-5FGG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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