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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XC2S150-5FGG256I

Name: XC2S150-5FGG256I
Brand: AMD
SKU: XC2S150-5FGG256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XC2S150-5FGG256I

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 256-BGA

Datasheet:: XC2S150-5FGG256I.pdf

Description:: IC FPGA 176 I/O 256FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

XC2S150-5FGG256I from AMD (formerly Xilinx) is a Spartan-II family FPGA with 150,000 system gates, 117 I/O pins, and a 5 ns input/output delay specification. It features configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic, deployed in industrial control systems requiring deterministic timing and reconfigurable logic.

For engineers reviewing the XC2S150-5FGG256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade (-5), thermal performance of the FGG256 package, and compatibility with Xilinx ISE design tools and JTAG programming interfaces.

Technical Context

The XC2S150-5FGG256I implements a synchronous, SRAM-based architecture with four-input LUTs per CLB, dual-edge flip-flops, and global clock routing networks. It supports IEEE 1149.1 JTAG boundary-scan testing and in-system configuration via serial PROM or microprocessor interface.

Its -5 speed grade guarantees maximum T_PD = 5.0 ns for internal CLB-to-CLB paths and T_CO = 5.0 ns for registered outputs under specified V_CC and temperature conditions. The device operates at 2.5 V core voltage with 3.3 V tolerant I/Os.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Capacity	150,000 system gates - defines maximum combinational logic density for gate-equivalent synthesis
Speed Grade	-5 - guarantees 5.0 ns CLB propagation delay and output register clock-to-out time
I/O Pins	117 user-configurable I/Os - supports parallel bus interfacing and multi-protocol signal routing
Core Voltage	2.5 V ± 0.1 V - requires dedicated low-noise core regulator; not compatible with 3.3 V core supplies
I/O Voltage	3.3 V tolerant - enables direct connection to 3.3 V LVTTL/LVCMOS peripherals without level shifters
Package	FGG256 - 256-pin Fine-Pitch Ball Grid Array, 1.0 mm pitch, 17×17 mm body, Pb-free

Pinout & Package

XC2S150-5FGG256I is housed in a 256-ball fine-pitch BGA (FGG256) with 16 corner balls reserved for ground or power, and dedicated V_CCINT, V_CCO, V_REF, and V_SS balls distributed across the array.

Pin/Terminal	Circuit Role	Design Meaning
P1	TCK (JTAG)	JTAG test clock input - must be driven by external debugger or boundary-scan controller
R2	TMS (JTAG)	JTAG test mode select - controls state transitions in TAP controller during programming or debug
T1	TDO (JTAG)	JTAG test data output - provides serial readback of IDCODE, USERCODE, or configuration status
U1	TDI (JTAG)	JTAG test data input - accepts serial bitstream for configuration or instruction loading
Y2	PROGRAM_B	Active-low asynchronous reset - forces reinitialization and clears configuration memory on falling edge
V3	DONE	Open-drain status output - goes high-Z after successful configuration; pulled up externally to indicate completion

Key Features

Feature	Design Value
Configurable Logic Blocks (CLBs)	Each CLB contains two 4-input LUTs + two flip-flops - enables efficient implementation of arithmetic, state machines, and pipelined logic
Distributed RAM	16 bits per CLB - allows local storage without block RAM resources, reducing routing congestion
Global Clock Networks	Four dedicated low-skew clock lines - ensures synchronous timing across large logic regions with <100 ps skew
IEEE 1149.1 Boundary Scan	Fully compliant TAP controller - supports board-level interconnect testing and in-circuit programming
Multi-Voltage I/O Banks	Four independent I/O banks - permits mixed-voltage operation (e.g., 3.3 V, 2.5 V, 1.8 V) on same device

Applications

Industrial Motion Control	Automated Test Equipment (ATE)
Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop PID computation and generates synchronized PWM outputs with sub-microsecond jitter. Use Value: Deterministic 5 ns timing enables consistent 100 kHz control loop execution without software latency.	Use Scenario: High-speed digital pattern generation and response capture for IC functional validation. IC Role / Device Role / Timing Role: Configurable I/Os drive stimulus vectors while sampling responses with precise setup/hold alignment. Use Value: 117 3.3 V-tolerant I/Os support parallel 32-bit bus testing at >25 MHz sustained rates.
Communications Baseband Processing	Medical Imaging Interface
Use Scenario: Channel bonding, CRC calculation, and packet framing in point-to-point telecom links. IC Role / Device Role / Timing Role: Implements protocol engines and data path logic with deterministic latency for frame synchronization. Use Value: Dedicated carry chains accelerate arithmetic-intensive CRC-32 and scrambling functions in hardware.	Use Scenario: Interfacing ultrasound transducer arrays to ADCs and buffering real-time echo data streams. IC Role / Device Role / Timing Role: Manages LVDS or CMOS sensor data ingestion, applies real-time gain correction, and buffers into SDRAM. Use Value: Distributed RAM per CLB reduces external memory bandwidth demand by 30% for pixel-line buffering.

Industrial Motion Control

Automated Test Equipment (ATE)

Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM generation.

IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop PID computation and generates synchronized PWM outputs with sub-microsecond jitter.

Use Value: Deterministic 5 ns timing enables consistent 100 kHz control loop execution without software latency.

Use Scenario: High-speed digital pattern generation and response capture for IC functional validation.

IC Role / Device Role / Timing Role: Configurable I/Os drive stimulus vectors while sampling responses with precise setup/hold alignment.

Use Value: 117 3.3 V-tolerant I/Os support parallel 32-bit bus testing at >25 MHz sustained rates.

Communications Baseband Processing

Medical Imaging Interface

Use Scenario: Channel bonding, CRC calculation, and packet framing in point-to-point telecom links.

IC Role / Device Role / Timing Role: Implements protocol engines and data path logic with deterministic latency for frame synchronization.

Use Value: Dedicated carry chains accelerate arithmetic-intensive CRC-32 and scrambling functions in hardware.

Use Scenario: Interfacing ultrasound transducer arrays to ADCs and buffering real-time echo data streams.

IC Role / Device Role / Timing Role: Manages LVDS or CMOS sensor data ingestion, applies real-time gain correction, and buffers into SDRAM.

Use Value: Distributed RAM per CLB reduces external memory bandwidth demand by 30% for pixel-line buffering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XC2S150-6FGG256I	Slower -6 speed grade (T_PD = 6.0 ns); otherwise identical logic resources and pinout	Suitable where 5 ns timing margin is unnecessary; lower power at same frequency	Select only if design meets timing closure with -6 grade; no PCB change required
XC3S200-4PQ240C	Spartan-3 family; higher density (200K gates), different pinout (PQ240), 1.2 V core, no 2.5 V core support	Enables more complex logic but requires new PCB layout and updated power delivery	Choose when upgrading logic capacity is critical and redesign is acceptable

Compared with XC2S150-5FGG256I, the -6 variant offers relaxed timing at identical footprint and voltage, while the XC3S200-4PQ240C delivers greater gate count at the cost of incompatible packaging, core voltage, and toolchain migration.

Availability

XC2S150-5FGG256I is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging interface designs requiring stable component supply and long-term obsolescence management.

Supply support for XC2S150-5FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains legacy Spartan-II product support, documentation, and cross-reference tooling for industrial and aerospace customers.

The Spartan-II family was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with predictable timing, including control, interface bridging, and digital signal preprocessing.

FAQ

What is the core voltage requirement for XC2S150-5FGG256I?

The XC2S150-5FGG256I requires a regulated 2.5 V ± 0.1 V core supply (V_CCINT). This voltage powers the FPGA's internal logic and CLBs. Using 3.3 V or 1.8 V on V_CCINT will damage the XC2S150-5FGG256I. External decoupling capacitors must be placed per Xilinx UG002 guidelines to maintain stability under dynamic switching loads.

Does XC2S150-5FGG256I support in-system programming?

Yes, XC2S150-5FGG256I supports in-system programming via IEEE 1149.1 JTAG interface using TCK, TMS, TDI, and TDO pins. It also accepts serial configuration from external PROM or parallel programming through the CPU interface. Configuration data is volatile SRAM-based, so XC2S150-5FGG256I must be reloaded at power-up unless paired with a nonvolatile PROM.

What is the meaning of "-5" in XC2S150-5FGG256I?

The "-5" in XC2S150-5FGG256I denotes the speed grade, specifying guaranteed maximum propagation delay (T_PD) and clock-to-output delay (T_CO) of 5.0 ns under standard operating conditions. This grade ensures timing closure for designs targeting 200 MHz internal clock frequencies and defines the device's performance ceiling for synchronous logic paths in the XC2S150-5FGG256I.

Can XC2S150-5FGG256I operate with 3.3 V I/O standards?

Yes, XC2S150-5FGG256I supports 3.3 V LVTTL and LVCMOS I/O standards. Its I/O pins are 3.3 V tolerant when V_CCO is set to 3.3 V per bank. Each of the four I/O banks can be independently configured for 3.3 V, 2.5 V, or 1.8 V signaling, enabling mixed-voltage interfaces without external level shifters in the XC2S150-5FGG256I.

Is XC2S150-5FGG256I still in production or subject to obsolescence?

XC2S150-5FGG256I is listed as obsolete by AMD/Xilinx, with last-time-buy (LTB) status effective 2018. However, Aetrix Electronics maintains verified, traceable inventory sourced from authorized channels and offers extended lifecycle support, including counterfeit mitigation, lot traceability, and obsolescence forecasting specifically for the XC2S150-5FGG256I.

XC2S150-5FGG256I Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Spartan®-II

Package/Case:: 256-BGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 864

Number of Logic Elements/Cells:: 3888

Total RAM Bits:: 49152

Number of I/O:: 176

Number of Gates:: 150000

Voltage - Supply:: 2.375V ~ 2.625V

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 256-FBGA (17x17)

XC2S150-5FGG256I FAQ

1.How can I place an order for XC2S150-5FGG256I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2S150-5FGG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2S150-5FGG256I reliable?

The price and inventory of XC2S150-5FGG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S150-5FGG256I is usually 5 days.

3.What payment methods are accepted for XC2S150-5FGG256I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S150-5FGG256I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2S150-5FGG256I?

XC2S150-5FGG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2S150-5FGG256I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2S150-5FGG256I?

For technical support, including XC2S150-5FGG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S150-5FGG256I requirements.

6.How does Aetrix verify that XC2S150-5FGG256I is sourced from the original manufacturer or authorized distributors?

All XC2S150-5FGG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S150-5FGG256I meets industry standards.

7.What is the process for return or replacement of XC2S150-5FGG256I?

All XC2S150-5FGG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2S150-5FGG256I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2S150-5FGG256I part is unused and in its original packaging.

Return procedure for XC2S150-5FGG256I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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