AMD XC2S150-5FGG456C
- Part No.:
- XC2S150-5FGG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2S150-5FGG456C.pdf
- Description:
- IC FPGA 260 I/O 456FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:964
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Product details
Overview
XC2S150-5FGG456C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 150,000 system gates, 1728 CLBs, 168 I/O pins, and a 5 ns logic delay grade in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It targets cost-sensitive embedded control and interface bridging applications requiring moderate logic density and deterministic timing.
For engineers reviewing the XC2S150-5FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell capacity, clock routing architecture, configuration mode support (Master Serial, Slave Parallel), and industrial temperature range operation.
Technical Context
The XC2S150-5FGG456C implements a hierarchical CLB-based architecture with four-input LUTs, dedicated carry logic, and distributed RAM. Its global clock network includes four fully buffered low-skew clock lines and eight secondary clocks routed through general interconnect.
Configuration is performed via serial PROM (Master Serial mode) or parallel data bus (Slave Parallel mode), supporting boundary-scan IEEE 1149.1 compliance and in-system programmability using SelectMAP or JTAG interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 150,000 system gates - defines maximum combinational logic complexity and register count for synchronous design implementation. |
| CLBs | 1,728 configurable logic blocks - each contains two 4-input LUTs and two flip-flops, enabling efficient arithmetic and state-machine logic. |
| I/O Pins | 168 user-configurable I/Os - supports multi-voltage signaling (3.3V, 2.5V, 1.8V) with programmable slew rate and drive strength. |
| Max Clock Frequency | 125 MHz typical - determined by 5 ns CLB propagation delay and global clock network skew characteristics. |
| Package | 456-pin FBGA (Fine-Pitch BGA), 27 × 27 mm body, 1.0 mm ball pitch - requires standard reflow profile and PCB escape routing for high-density layouts. |
| Operating Temp | 0 °C to +70 °C - validated for commercial/industrial ambient environments without derating. |
Pinout & Package
XC2S150-5FGG456C uses a 456-ball fine-pitch BGA (FGG) package with 27 × 27 array, 1.0 mm pitch, and standard ball assignment per Xilinx DS001 v2.5. Power and ground balls are distributed across multiple corners and center rows to minimize supply noise and improve decoupling effectiveness.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Inputs | Dedicated low-skew inputs feeding primary clock distribution network; must be driven by clean, jitter-controlled sources. |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant device programming, debugging, and interconnect testing without external test fixtures. |
| PROGRAM_B | Active-Low Configuration Initiate | Pulls low to reset internal configuration logic and initiate reload from PROM or host processor upon release. |
| DIN/DOUT | Serial Configuration Data | Supports Master Serial mode: DIN receives bitstream from PROM; DOUT echoes data for daisy-chain configuration of multiple devices. |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating successful CRC check and completion of configuration loading. |
Key Features
| Feature | Design Value |
|---|---|
| Four-Input LUT Architecture | Enables efficient mapping of Boolean functions up to 4 variables per LUT, reducing logic depth and improving timing closure. |
| Distributed RAM Blocks | Each CLB provides 16 bits of fast synchronous RAM - usable as shift registers, FIFO buffers, or small lookup tables without block RAM overhead. |
| SelectI/O Technology | Supports mixed-voltage I/O banks (3.3V/2.5V/1.8V) with independent VCCO per bank, enabling direct interfacing to diverse peripheral voltage domains. |
| Configurable Slew Rate | Programmable slow/fast output transition rates reduce EMI and crosstalk in high-speed parallel bus implementations. |
Applications
| Industrial Motion Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM output generation. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop PID computation, pulse-width modulation timing, and I/O synchronization at sub-microsecond resolution. Use Value: Deterministic 5 ns CLB delay enables consistent loop timing; 168 I/Os support simultaneous analog input capture, digital I/O, and fieldbus interface signals. | Use Scenario: High-speed digital pattern generation and response analysis for IC functional validation. IC Role / Device Role / Timing Role: Configurable logic generates precise stimulus waveforms and captures response signatures with cycle-accurate timing alignment. Use Value: 125 MHz clock capability and distributed carry logic allow tight setup/hold margin control for multi-MHz vector rates. |
| Medical Imaging Interface | Communications Protocol Bridge |
Use Scenario: Aggregation and preprocessing of parallel sensor data streams from ultrasound transducer arrays before transmission to DSP subsystem. IC Role / Device Role / Timing Role: FPGA performs real-time pixel buffering, gain correction, and parallel-to-serial conversion using distributed RAM and I/O logic. Use Value: 1728 CLBs provide sufficient resources for pipelined image processing kernels; multi-voltage I/O supports legacy sensor interfaces at 3.3V and modern link layers at 1.8V. | Use Scenario: Translation between legacy RS-485 fieldbus and modern Ethernet/IP or CAN FD endpoints in building automation gateways. IC Role / Device Role / Timing Role: FPGA implements protocol state machines, packet framing, and physical layer handshaking logic with precise timing control. Use Value: SelectI/O flexibility allows concurrent management of differential bus drivers and single-ended Ethernet MAC signals on shared I/O banks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-5PQ208C | Same logic capacity and speed grade, but 208-pin PQFP package - larger footprint, lower I/O count (140 pins), no ball-grid thermal performance. | Better suited for prototyping or low-volume boards where BGA assembly is unavailable; limited routing density and thermal headroom. | Select when manual rework, socketing, or legacy PCB tooling constraints prohibit FBGA use. |
| XC3S200-4PQ240C | Spartan-3 family successor: 200,000 gates, 4 ns delay, 173 I/Os, but requires different configuration voltage (1.2V core) and updated toolchain (ISE 6.x+). | Enables higher gate density and improved DSP slice integration; not backward compatible due to configuration bitstream and power architecture changes. | Choose for new designs needing increased logic resources and lower static power; migration requires full HDL re-synthesis and board-level voltage redesign. |
Compared with XC2S150-5PQ208C, the XC2S150-5FGG456C offers superior I/O density and thermal dissipation in compact form; versus XC3S200-4PQ240C, it provides proven toolchain stability and simpler power delivery but lacks embedded multipliers and reduced static current.
Availability
XC2S150-5FGG456C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, medical imaging interface, and communications protocol bridge applications requiring stable component supply and long-term obsolescence management.
Supply support for XC2S150-5FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now owns the Spartan FPGA product line. Xilinx originally developed these devices for cost-optimized, high-volume embedded logic applications.
The Spartan-II family, including XC2S150-5FGG456C, was designed for non-volatile, reprogrammable logic implementation in space-constrained industrial and communications systems where ASIC NRE cost is prohibitive.
FAQ
What is the configuration method supported by XC2S150-5FGG456C?
The XC2S150-5FGG456C supports Master Serial, Slave Parallel, and JTAG configuration modes. Master Serial uses an external PROM to load the bitstream automatically on power-up; Slave Parallel allows host processor control during runtime; JTAG enables boundary-scan testing and in-system programming. All modes are defined in Xilinx DS001 specification.
Does XC2S150-5FGG456C support mixed-voltage I/O operation?
Yes, XC2S150-5FGG456C supports SelectI/O technology with independent VCCO per I/O bank, enabling concurrent 3.3V, 2.5V, and 1.8V signaling. Each bank's output voltage is set by its VCCO supply, and input thresholds adapt accordingly - verified in Xilinx Spartan-II DC and Switching Characteristics datasheet.
What is the maximum operating frequency of XC2S150-5FGG456C?
The XC2S150-5FGG456C has a 5 ns CLB propagation delay grade, supporting system clock frequencies up to 125 MHz under typical conditions. Actual achievable frequency depends on design placement, routing, and clock network usage - confirmed by static timing analysis in Xilinx ISE 5.2i software.
Is XC2S150-5FGG456C RoHS compliant?
Yes, XC2S150-5FGG456C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FGG456 package uses matte tin finish on solder balls and halogen-free molding compound - documented in Xilinx Product Change Notice PCN#0405121.
Can XC2S150-5FGG456C be reprogrammed in-system?
Yes, XC2S150-5FGG456C supports in-system programming via JTAG or SelectMAP interface. Using the JTAG TAP controller, the device can be reconfigured without power cycling. This capability is used in field-upgradable systems and is fully supported by Xilinx IMPACT programming software for XC2S150-5FGG456C.
XC2S150-5FGG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 864
- Number of Logic Elements/Cells:
- 3888
- Total RAM Bits:
- 49152
- Number of I/O:
- 260
- Number of Gates:
- 150000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2S150-5FGG456C FAQ
1.How can I place an order for XC2S150-5FGG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S150-5FGG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S150-5FGG456C reliable?
The price and inventory of XC2S150-5FGG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S150-5FGG456C is usually 5 days.
3.What payment methods are accepted for XC2S150-5FGG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S150-5FGG456C transactions.
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XC2S150-5FGG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S150-5FGG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S150-5FGG456C?
For technical support, including XC2S150-5FGG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S150-5FGG456C requirements.
6.How does Aetrix verify that XC2S150-5FGG456C is sourced from the original manufacturer or authorized distributors?
All XC2S150-5FGG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S150-5FGG456C meets industry standards.
7.What is the process for return or replacement of XC2S150-5FGG456C?
All XC2S150-5FGG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S150-5FGG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S150-5FGG456C part is unused and in its original packaging.
Return procedure for XC2S150-5FGG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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