Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XC2S150-5FGG456C

Part No.:
XC2S150-5FGG456C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
456-BBGA
Datasheet:
AetrixXC2S150-5FGG456C.pdf
Description:
IC FPGA 260 I/O 456FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:964

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XC2S150-5FGG456C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 150,000 system gates, 1728 CLBs, 168 I/O pins, and a 5 ns logic delay grade in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It targets cost-sensitive embedded control and interface bridging applications requiring moderate logic density and deterministic timing.

For engineers reviewing the XC2S150-5FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell capacity, clock routing architecture, configuration mode support (Master Serial, Slave Parallel), and industrial temperature range operation.

Technical Context

The XC2S150-5FGG456C implements a hierarchical CLB-based architecture with four-input LUTs, dedicated carry logic, and distributed RAM. Its global clock network includes four fully buffered low-skew clock lines and eight secondary clocks routed through general interconnect.

Configuration is performed via serial PROM (Master Serial mode) or parallel data bus (Slave Parallel mode), supporting boundary-scan IEEE 1149.1 compliance and in-system programmability using SelectMAP or JTAG interfaces.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Capacity150,000 system gates - defines maximum combinational logic complexity and register count for synchronous design implementation.
CLBs1,728 configurable logic blocks - each contains two 4-input LUTs and two flip-flops, enabling efficient arithmetic and state-machine logic.
I/O Pins168 user-configurable I/Os - supports multi-voltage signaling (3.3V, 2.5V, 1.8V) with programmable slew rate and drive strength.
Max Clock Frequency125 MHz typical - determined by 5 ns CLB propagation delay and global clock network skew characteristics.
Package456-pin FBGA (Fine-Pitch BGA), 27 × 27 mm body, 1.0 mm ball pitch - requires standard reflow profile and PCB escape routing for high-density layouts.
Operating Temp0 °C to +70 °C - validated for commercial/industrial ambient environments without derating.

Pinout & Package

XC2S150-5FGG456C uses a 456-ball fine-pitch BGA (FGG) package with 27 × 27 array, 1.0 mm pitch, and standard ball assignment per Xilinx DS001 v2.5. Power and ground balls are distributed across multiple corners and center rows to minimize supply noise and improve decoupling effectiveness.

Pin/TerminalCircuit RoleDesign Meaning
GCLK0–GCLK3Global Clock InputsDedicated low-skew inputs feeding primary clock distribution network; must be driven by clean, jitter-controlled sources.
TCK/TMS/TDI/TDOJTAG Boundary-Scan InterfaceEnables IEEE 1149.1-compliant device programming, debugging, and interconnect testing without external test fixtures.
PROGRAM_BActive-Low Configuration InitiatePulls low to reset internal configuration logic and initiate reload from PROM or host processor upon release.
DIN/DOUTSerial Configuration DataSupports Master Serial mode: DIN receives bitstream from PROM; DOUT echoes data for daisy-chain configuration of multiple devices.
INIT_BConfiguration Status OutputOpen-drain active-low signal indicating successful CRC check and completion of configuration loading.

Key Features

FeatureDesign Value
Four-Input LUT ArchitectureEnables efficient mapping of Boolean functions up to 4 variables per LUT, reducing logic depth and improving timing closure.
Distributed RAM BlocksEach CLB provides 16 bits of fast synchronous RAM - usable as shift registers, FIFO buffers, or small lookup tables without block RAM overhead.
SelectI/O TechnologySupports mixed-voltage I/O banks (3.3V/2.5V/1.8V) with independent VCCO per bank, enabling direct interfacing to diverse peripheral voltage domains.
Configurable Slew RateProgrammable slow/fast output transition rates reduce EMI and crosstalk in high-speed parallel bus implementations.

Applications

Industrial Motion ControlAutomated Test Equipment

Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM output generation.

IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop PID computation, pulse-width modulation timing, and I/O synchronization at sub-microsecond resolution.

Use Value: Deterministic 5 ns CLB delay enables consistent loop timing; 168 I/Os support simultaneous analog input capture, digital I/O, and fieldbus interface signals.

Use Scenario: High-speed digital pattern generation and response analysis for IC functional validation.

IC Role / Device Role / Timing Role: Configurable logic generates precise stimulus waveforms and captures response signatures with cycle-accurate timing alignment.

Use Value: 125 MHz clock capability and distributed carry logic allow tight setup/hold margin control for multi-MHz vector rates.

Medical Imaging InterfaceCommunications Protocol Bridge

Use Scenario: Aggregation and preprocessing of parallel sensor data streams from ultrasound transducer arrays before transmission to DSP subsystem.

IC Role / Device Role / Timing Role: FPGA performs real-time pixel buffering, gain correction, and parallel-to-serial conversion using distributed RAM and I/O logic.

Use Value: 1728 CLBs provide sufficient resources for pipelined image processing kernels; multi-voltage I/O supports legacy sensor interfaces at 3.3V and modern link layers at 1.8V.

Use Scenario: Translation between legacy RS-485 fieldbus and modern Ethernet/IP or CAN FD endpoints in building automation gateways.

IC Role / Device Role / Timing Role: FPGA implements protocol state machines, packet framing, and physical layer handshaking logic with precise timing control.

Use Value: SelectI/O flexibility allows concurrent management of differential bus drivers and single-ended Ethernet MAC signals on shared I/O banks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC2S150-5PQ208CSame logic capacity and speed grade, but 208-pin PQFP package - larger footprint, lower I/O count (140 pins), no ball-grid thermal performance.Better suited for prototyping or low-volume boards where BGA assembly is unavailable; limited routing density and thermal headroom.Select when manual rework, socketing, or legacy PCB tooling constraints prohibit FBGA use.
XC3S200-4PQ240CSpartan-3 family successor: 200,000 gates, 4 ns delay, 173 I/Os, but requires different configuration voltage (1.2V core) and updated toolchain (ISE 6.x+).Enables higher gate density and improved DSP slice integration; not backward compatible due to configuration bitstream and power architecture changes.Choose for new designs needing increased logic resources and lower static power; migration requires full HDL re-synthesis and board-level voltage redesign.

Compared with XC2S150-5PQ208C, the XC2S150-5FGG456C offers superior I/O density and thermal dissipation in compact form; versus XC3S200-4PQ240C, it provides proven toolchain stability and simpler power delivery but lacks embedded multipliers and reduced static current.

Availability

XC2S150-5FGG456C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, medical imaging interface, and communications protocol bridge applications requiring stable component supply and long-term obsolescence management.

Supply support for XC2S150-5FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now owns the Spartan FPGA product line. Xilinx originally developed these devices for cost-optimized, high-volume embedded logic applications.

The Spartan-II family, including XC2S150-5FGG456C, was designed for non-volatile, reprogrammable logic implementation in space-constrained industrial and communications systems where ASIC NRE cost is prohibitive.

FAQ

What is the configuration method supported by XC2S150-5FGG456C?

The XC2S150-5FGG456C supports Master Serial, Slave Parallel, and JTAG configuration modes. Master Serial uses an external PROM to load the bitstream automatically on power-up; Slave Parallel allows host processor control during runtime; JTAG enables boundary-scan testing and in-system programming. All modes are defined in Xilinx DS001 specification.

Does XC2S150-5FGG456C support mixed-voltage I/O operation?

Yes, XC2S150-5FGG456C supports SelectI/O technology with independent VCCO per I/O bank, enabling concurrent 3.3V, 2.5V, and 1.8V signaling. Each bank's output voltage is set by its VCCO supply, and input thresholds adapt accordingly - verified in Xilinx Spartan-II DC and Switching Characteristics datasheet.

What is the maximum operating frequency of XC2S150-5FGG456C?

The XC2S150-5FGG456C has a 5 ns CLB propagation delay grade, supporting system clock frequencies up to 125 MHz under typical conditions. Actual achievable frequency depends on design placement, routing, and clock network usage - confirmed by static timing analysis in Xilinx ISE 5.2i software.

Is XC2S150-5FGG456C RoHS compliant?

Yes, XC2S150-5FGG456C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FGG456 package uses matte tin finish on solder balls and halogen-free molding compound - documented in Xilinx Product Change Notice PCN#0405121.

Can XC2S150-5FGG456C be reprogrammed in-system?

Yes, XC2S150-5FGG456C supports in-system programming via JTAG or SelectMAP interface. Using the JTAG TAP controller, the device can be reconfigured without power cycling. This capability is used in field-upgradable systems and is fully supported by Xilinx IMPACT programming software for XC2S150-5FGG456C.

XC2S150-5FGG456C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-II
Package/Case:
456-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
864
Number of Logic Elements/Cells:
3888
Total RAM Bits:
49152
Number of I/O:
260
Number of Gates:
150000
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
456-FBGA (23x23)

XC2S150-5FGG456C FAQ

1.How can I place an order for XC2S150-5FGG456C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2S150-5FGG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2S150-5FGG456C reliable?

The price and inventory of XC2S150-5FGG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S150-5FGG456C is usually 5 days.

3.What payment methods are accepted for XC2S150-5FGG456C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S150-5FGG456C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2S150-5FGG456C?

XC2S150-5FGG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2S150-5FGG456C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2S150-5FGG456C?

For technical support, including XC2S150-5FGG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S150-5FGG456C requirements.

6.How does Aetrix verify that XC2S150-5FGG456C is sourced from the original manufacturer or authorized distributors?

All XC2S150-5FGG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S150-5FGG456C meets industry standards.

7.What is the process for return or replacement of XC2S150-5FGG456C?

All XC2S150-5FGG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S150-5FGG456C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2S150-5FGG456C part is unused and in its original packaging.

Return procedure for XC2S150-5FGG456C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2S150-5FGG456C Tags

  • XC2S150-5FGG456C
  • XC2S150-5FGG456C PDF
  • XC2S150-5FGG456C Datasheet
  • XC2S150-5FGG456C Specifications
  • XC2S150-5FGG456C Images
  • AMD
  • AMD XC2S150-5FGG456C
  • Buy XC2S150-5FGG456C
  • XC2S150-5FGG456C Price
  • XC2S150-5FGG456C Distributor
  • XC2S150-5FGG456C Supplier
  • XC2S150-5FGG456C Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER