AMD XC2S150-5FGG456I
- Part No.:
- XC2S150-5FGG456I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2S150-5FGG456I.pdf
- Description:
- IC FPGA 260 I/O 456FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,479
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Product details
Overview
XC2S150-5FGG456I from AMD (formerly Xilinx) is a Spartan-II family FPGA with 150,000 system gates, 1728 CLBs, 160 I/O pins, and a 5 ns maximum input-to-output delay. It implements synchronous digital logic in embedded control, industrial interface, and communication protocol bridging applications.
For engineers reviewing the XC2S150-5FGG456I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, CLB density, speed grade (-5), and FGG456 package compatibility with PCB layout constraints and thermal requirements.
Technical Context
The XC2S150-5FGG456I uses a configurable logic block (CLB) architecture with four-input LUTs and flip-flops per slice, supporting synchronous design with global clock routing and dedicated carry chains. It supports IEEE 1149.1 JTAG boundary-scan testing and in-system configuration via serial PROM or microprocessor interface.
It operates at 3.3 V core and I/O supply, with LVCMOS/LVTTL-compatible I/O standards and programmable slew rate and drive strength per bank. Configuration is SRAM-based and requires external nonvolatile memory for power-up initialization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 150,000 system gates - defines maximum combinational logic complexity supported |
| Configurable Logic Blocks | 1728 CLBs - each contains two slices with LUTs and flip-flops for synchronous logic implementation |
| I/O Pins | 160 user I/Os - supports multi-bank voltage operation with independent VCCO per bank |
| Speed Grade | -5 - guarantees 5 ns maximum input-to-output delay for critical paths |
| Package | FGG456 - 456-pin Fine-Pitch Ball Grid Array, 27 × 27 mm, 1.0 mm ball pitch |
| Core Voltage | 3.3 V ± 0.3 V - requires regulated core supply; not compatible with 2.5 V or 1.8 V cores |
Pinout & Package
XC2S150-5FGG456I is housed in a 456-ball fine-pitch BGA (FGG456) package with 27 × 27 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-251AC footprint. Thermal pad on underside requires solder paste stencil design per Xilinx S001-2 guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1, G2, H1, H2 | VCCINT | 3.3 V core power supply inputs - must be decoupled locally with 0.1 µF + 4.7 µF capacitors |
| A1–A10, B1–B10, etc. | IO_Lxx_yy | User-configurable I/O banks - each supports independent VCCO (3.3/2.5 V) and selectable IOSTANDARD |
| T14, U14, V14, W14 | CLK0–CLK3 | Dedicated global clock inputs - low-skew routing to all CLBs and RAM blocks |
| R15, T15 | TMS, TCK | JTAG boundary-scan test control - required for programming and debug verification |
| P16, R16 | INIT_B, DONE | Configuration status signals - INIT_B indicates PROM readiness; DONE confirms bitstream load completion |
Key Features
| Feature | Design Value |
|---|---|
| System Gate Count | 150,000 gates - enables medium-complexity state machines and data path logic without external glue logic |
| Embedded Block RAM | 176 Kbits total - distributed across 128 RAM blocks (128 × 128 bits each) for FIFOs or lookup tables |
| Multi-Voltage I/O Banks | Four independent I/O banks - allows mixed-voltage interfacing (e.g., 3.3 V CPU with 2.5 V PHY) |
| Global Clock Network | Eight low-skew global clock lines - ensures timing closure for designs up to 125 MHz system clock |
| JTAG Boundary Scan | IEEE 1149.1 compliant - enables board-level testability and in-circuit programming without dedicated headers |
Applications
| Industrial Motion Control | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop coordination in CNC machine controllers using encoder feedback and PWM output generation. IC Role / Device Role / Timing Role: FPGA fabric implements position interpolator, PID controller, and synchronized 16-channel PWM generator with deterministic sub-microsecond latency. Use Value: 1728 CLBs and 160 I/Os support simultaneous axis control and fieldbus interfacing without external logic. | Use Scenario: Bridging ISA or PCI bus peripherals to modern microcontroller-based systems in factory automation upgrades. IC Role / Device Role / Timing Role: Protocol translator mapping legacy address/data strobes to SPI/I²C register maps with cycle-accurate timing alignment. Use Value: -5 speed grade ensures reliable 33 MHz PCI read/write handshaking with setup/hold margin. |
| Communications Protocol Converter | Test Equipment Signal Generator |
Use Scenario: Converting RS-485 Modbus RTU frames to Ethernet TCP packets in smart grid RTUs. IC Role / Device Role / Timing Role: Dual-port RAM buffer and UART-to-MAC state machine implemented in CLBs with precise baud rate timing control. Use Value: 176 Kbits of block RAM provides 2 kB dual-port buffer for concurrent receive/transmit packet handling. | Use Scenario: Generating calibrated analog waveforms (sine, square, triangle) in benchtop function generators. IC Role / Device Role / Timing Role: Digital waveform synthesizer using phase accumulator LUTs and 12-bit parallel DAC interface timing control. Use Value: 5 ns propagation delay enables stable 100 MS/s sample clock distribution to external DACs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-5PQ208I | Same logic capacity and speed grade, but 208-pin PQFP package - larger footprint, no thermal pad, lower I/O count (144) | Limited to space-constrained boards where BGA rework is impractical; unsuitable for high-I/O or thermally demanding layouts | Select only when PCB assembly lacks BGA capability or thermal management infrastructure |
| XC3S200-4PQ208C | Spartan-3 family; 200,000 logic cells, -4 speed grade, 208-pin PQFP - higher density but slower timing and different configuration architecture | Requires redesign of bitstream loading and clock management; not drop-in due to differing I/O electrical specs and configuration mode pins | Consider only for new designs targeting longer lifecycle and higher gate count, not for XC2S150-5FGG456I replacement |
Compared with XC2S150-5PQ208I, the XC2S150-5FGG456I offers 160 I/Os and superior thermal performance in BGA form; compared with XC3S200-4PQ208C, it provides guaranteed -5 timing and mature toolchain support for legacy Spartan-II designs.
Availability
XC2S150-5FGG456I is available at Aetrix Electronics and suitable for industrial motion control, legacy bus interface bridge, and communications protocol converter applications requiring stable component supply and long-term obsolescence management.
Supply support for XC2S150-5FGG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan product support, including documentation, configuration tools, and qualified sources for industrial and aerospace applications.
The Spartan-II family, including XC2S150-5FGG456I, was designed for cost-sensitive, high-volume embedded logic replacement - targeting industrial control, test equipment, and communications infrastructure where gate density and I/O flexibility outweigh advanced features like DSP slices or high-speed transceivers.
FAQ
What is the maximum operating frequency supported by the XC2S150-5FGG456I?
The XC2S150-5FGG456I has a -5 speed grade, guaranteeing a maximum input-to-output delay of 5 ns for critical paths. This supports system clock frequencies up to 125 MHz in well-constrained designs with proper placement and routing. Actual achievable frequency depends on logic depth, I/O timing, and clock network usage - verified per design through Xilinx ISE timing analysis.
Does the XC2S150-5FGG456I require external configuration memory?
Yes, the XC2S150-5FGG456I uses SRAM-based configuration and requires external nonvolatile memory (e.g., XCF02S or compatible serial PROM) to store the bitstream. On power-up, the FPGA loads configuration data automatically via master serial mode unless configured otherwise through mode pins.
Can the XC2S150-5FGG456I operate with mixed I/O voltages?
Yes, the XC2S150-5FGG456I supports four independent I/O banks, each configurable for 3.3 V or 2.5 V VCCO. This enables direct interfacing with devices operating at different logic levels - for example, connecting a 3.3 V microcontroller to a 2.5 V ADC - provided each bank's VCCO and IOSTANDARD are set consistently.
Is the XC2S150-5FGG456I pin-compatible with other Spartan-II devices in the FGG456 package?
No - while multiple Spartan-II devices use the FGG456 package (e.g., XC2S100, XC2S200), pinouts differ significantly due to varying CLB counts, RAM block locations, and dedicated resource assignments. The XC2S150-5FGG456I has a unique pin map defined in Xilinx DS001 v2.5 and is not interchangeable without PCB redesign.
What development tools support the XC2S150-5FGG456I?
The XC2S150-5FGG456I is fully supported by Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, and bitstream generation. Programming is performed via iMPACT or third-party JTAG adapters. AMD continues to host legacy documentation and software downloads for Spartan-II devices under the Xilinx archive portal.
XC2S150-5FGG456I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 864
- Number of Logic Elements/Cells:
- 3888
- Total RAM Bits:
- 49152
- Number of I/O:
- 260
- Number of Gates:
- 150000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2S150-5FGG456I FAQ
1.How can I place an order for XC2S150-5FGG456I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S150-5FGG456I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S150-5FGG456I reliable?
The price and inventory of XC2S150-5FGG456I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S150-5FGG456I is usually 5 days.
3.What payment methods are accepted for XC2S150-5FGG456I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S150-5FGG456I transactions.
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4.How is shipping managed for XC2S150-5FGG456I?
XC2S150-5FGG456I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S150-5FGG456I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S150-5FGG456I?
For technical support, including XC2S150-5FGG456I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S150-5FGG456I requirements.
6.How does Aetrix verify that XC2S150-5FGG456I is sourced from the original manufacturer or authorized distributors?
All XC2S150-5FGG456I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S150-5FGG456I meets industry standards.
7.What is the process for return or replacement of XC2S150-5FGG456I?
All XC2S150-5FGG456I units undergo pre-shipment inspection (PSI). If there is an issue with XC2S150-5FGG456I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S150-5FGG456I part is unused and in its original packaging.
Return procedure for XC2S150-5FGG456I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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