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AMD XC2S150-6FG256C
- Part No.:
- XC2S150-6FG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2S150-6FG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,788
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Product details
Overview
XC2S150-6FG256C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 150,000 system gates, 176 configurable logic blocks (CLBs), 256-pin Fine-Pitch Ball Grid Array (FBGA) package, and -6 speed grade (6 ns CLB delay). It is used in industrial control logic, digital signal preprocessing, and low-cost reconfigurable I/O interfaces.
For engineers reviewing the XC2S150-6FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include system gate count, CLB availability, I/O pin count (176 user I/Os), internal RAM capacity (48 Kbits), and support for 3.3V LVTTL/LVCMOS I/O standards.
Technical Context
The XC2S150-6FG256C implements synchronous logic using four-input look-up tables (LUTs) and flip-flops per CLB. It supports distributed RAM (16-bit depth per LUT) and block RAM (4 Kbits per block, total 48 Kbits), with configuration via serial PROM or boundary-scan JTAG.
It operates at 3.3V core and I/O supply, supports SelectIO™ standards including LVTTL, LVCMOS, and PCI, and features dedicated carry logic for high-speed arithmetic and global clock routing with eight low-skew clock networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 150,000 - defines maximum combinational logic density for logic synthesis mapping |
| Configurable Logic Blocks (CLBs) | 176 - each contains two function generators and two storage elements for sequential logic |
| User I/O Pins | 176 - supports multi-standard I/O banks with programmable drive strength and slew rate |
| Block RAM | 48 Kbits - organized as twelve 4-Kbit blocks for FIFO, buffer, or lookup table implementation |
| Speed Grade | -6 - guarantees 6 ns CLB propagation delay under specified voltage/temperature conditions |
| Configuration Mode | Master Serial, Slave Serial, Boundary-Scan (JTAG) - enables in-system programming and debug |
Pinout & Package
XC2S150-6FG256C uses a 256-ball fine-pitch BGA (FG256) package with 1.27 mm ball pitch, 17 mm × 17 mm body size, and thermal pad exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply (3.3V) |
| P2 | CLK0 | Dedicated global clock input with low-skew routing to all CLBs |
| T14 | TDO | JTAG test data output for boundary-scan configuration and verification |
| R15 | TMS | JTAG test mode select controlling TAP controller state transitions |
| V16 | VCCINT | Core logic supply (2.5V) powering CLBs and interconnect |
| U15 | GND | Ground reference for I/O bank 2 and adjacent signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Enables mixed-voltage I/O operation across four independent banks with programmable termination |
| Dedicated Carry Chain | Supports fast ripple-carry arithmetic up to 32-bit adders without CLB resource consumption |
| Global Clock Networks | Eight low-skew clock trees reduce clock skew and simplify timing closure for synchronous designs |
| Boundary-Scan Support | IEEE 1149.1-compliant JTAG interface enables in-circuit configuration and board-level test |
| Distributed RAM | Each LUT can implement 16-bit synchronous shift register or dual-port RAM without block RAM usage |
Applications
| Industrial Motion Control | Digital Video Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop coordination in CNC machines using encoder feedback and PWM output generation. IC Role / Device Role / Timing Role: Configurable logic fabric implements position interpolation, pulse-width modulation, and safety monitoring logic. Use Value: 176 user I/Os enable direct connection to multiple encoders, limit switches, and motor drivers without glue logic. | Use Scenario: Converting parallel RGB video signals to serialized LVDS output for flat-panel display modules. IC Role / Device Role / Timing Role: Synchronizes pixel clocks, manages data alignment, and handles format conversion between disparate timing domains. Use Value: Dedicated carry chain and global clock networks ensure sub-cycle timing accuracy for pixel-rate data paths. |
| Low-Cost Test Equipment | Communications Protocol Translator |
Use Scenario: Generating and analyzing digital stimulus patterns in automated PCB test fixtures. IC Role / Device Role / Timing Role: Acts as pattern generator and response analyzer with real-time pass/fail decision logic. Use Value: 48 Kbits of block RAM stores multi-cycle test vectors and expected response signatures. | Use Scenario: Bridging RS-232 host commands to SPI-based sensor clusters in building automation systems. IC Role / Device Role / Timing Role: Implements UART-to-SPI protocol conversion with baud rate independence and packet buffering. Use Value: Distributed RAM per LUT allows compact FIFO implementation for command queuing without consuming block RAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-5FG256C | Slower -5 speed grade (7 ns CLB delay); identical gate count, CLB count, and I/O count | Suitable for lower-frequency designs where timing margin is relaxed | Select when target clock frequency ≤ 125 MHz and cost sensitivity outweighs performance headroom |
| XC2S200-6FG256C | Higher 200,000-gate density and 216 CLBs; same package, speed grade, and I/O count | Required when design exceeds XC2S150-6FG256C's 150K gate capacity or needs additional block RAM | Choose when logic utilization exceeds 90% or additional 16 Kbits of block RAM is needed |
Compared with XC2S150-6FG256C, the -5 variant trades 16% slower timing for lower cost, while the XC2S200-6FG256C adds gate capacity and CLBs without changing footprint or I/O count-enabling scalable design reuse.
Availability
XC2S150-6FG256C is available at Aetrix Electronics and suitable for industrial motion control, digital video interface bridging, and low-cost test equipment requiring stable component supply and long-term obsolescence management.
Supply support for XC2S150-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now oversees the legacy Spartan-II FPGA product line, maintaining long-term support for industrial and aerospace customers.
The Spartan-II family was designed for cost-sensitive, high-volume applications requiring moderate logic density, fast I/O, and non-volatile configuration flexibility-targeting industrial automation and communications infrastructure.
FAQ
What is the core voltage requirement for XC2S150-6FG256C?
The XC2S150-6FG256C requires a 2.5V ± 3% core supply (VCCINT) for internal logic operation. This voltage powers the CLBs, interconnect, and block RAM. Deviation beyond tolerance risks timing violations or configuration loss. The XC2S150-6FG256C does not support 1.8V or 3.3V core operation.
How many block RAM resources does XC2S150-6FG256C provide?
The XC2S150-6FG256C provides 48 Kbits of total block RAM, implemented as twelve independent 4-Kbit RAM blocks. Each block supports synchronous read/write, dual-port access, and can be configured as 4K×1, 2K×2, 1K×4, 512×8, or 256×16. These resources are distinct from distributed RAM in LUTs.
Does XC2S150-6FG256C support JTAG boundary-scan configuration?
Yes, XC2S150-6FG256C fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and board-level testing. Pins TCK, TMS, TDI, and TDO are dedicated for this purpose, enabling in-system programming without external PROMs and facilitating production test coverage.
What I/O standards are supported by XC2S150-6FG256C?
XC2S150-6FG256C supports LVTTL, LVCMOS (3.3V and 2.5V), and PCI-compliant I/O standards across its four independent I/O banks. Each bank is independently powered (VCCO), allowing mixed-voltage operation. It does not support differential standards like LVDS or RSDS.
Is XC2S150-6FG256C pin-compatible with other Spartan-II devices in FG256 package?
XC2S150-6FG256C shares the same 256-ball FG256 footprint with XC2S100-6FG256C and XC2S200-6FG256C, but pin functions differ due to varying CLB counts and internal routing. While mechanical mounting is identical, signal assignments and power pin locations are not guaranteed compatible-PCB redesign is required for substitution.
XC2S150-6FG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 864
- Number of Logic Elements/Cells:
- 3888
- Total RAM Bits:
- 49152
- Number of I/O:
- 176
- Number of Gates:
- 150000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2S150-6FG256C FAQ
1.How can I place an order for XC2S150-6FG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S150-6FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S150-6FG256C reliable?
The price and inventory of XC2S150-6FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S150-6FG256C is usually 5 days.
3.What payment methods are accepted for XC2S150-6FG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S150-6FG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S150-6FG256C?
XC2S150-6FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S150-6FG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S150-6FG256C?
For technical support, including XC2S150-6FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S150-6FG256C requirements.
6.How does Aetrix verify that XC2S150-6FG256C is sourced from the original manufacturer or authorized distributors?
All XC2S150-6FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S150-6FG256C meets industry standards.
7.What is the process for return or replacement of XC2S150-6FG256C?
All XC2S150-6FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S150-6FG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S150-6FG256C part is unused and in its original packaging.
Return procedure for XC2S150-6FG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2S150-6FG256C Tags
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