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AMD XC2S150-6FG456C
- Part No.:
- XC2S150-6FG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2S150-6FG456C.pdf
- Description:
- IC FPGA 260 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,483
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Product details
Overview
XC2S150-6FG456C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 150,000 system gates, 1728 logic cells, and a 6 ns CLB delay. It features 224 I/O pins in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at 3.3 V supply voltage. It is used in industrial control logic, digital signal preprocessing, and reconfigurable peripheral interface design.
For engineers reviewing the XC2S150-6FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, CLB propagation delay, system gate density, supply voltage compatibility, and FBGA thermal-mechanical performance in space-constrained embedded systems.
Technical Context
The XC2S150-6FG456C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM resources (up to 56 kbits), and dedicated carry logic for arithmetic functions. Its SelectIO™ technology supports LVCMOS, LVTTL, PCI, and HSTL I/O standards with programmable slew rate and drive strength.
Configuration is performed via serial mode using an external PROM or parallel slave mode with a microprocessor. The device includes internal global clock networks with low-skew routing and supports up to four user-defined global clocks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 150,000 - defines maximum combinational logic capacity for logic synthesis mapping |
| Logic Cells | 1,728 - each contains a 4-LUT and a flip-flop, enabling synchronous sequential logic implementation |
| CLB Delay | 6 ns - worst-case propagation delay through one CLB, critical for maximum operating frequency estimation |
| I/O Pins | 224 - bidirectional user-configurable pins supporting multiple voltage-referenced I/O standards |
| Package | 456-pin FBGA (Fine-Pitch BGA) - 23×23 mm body, 1.0 mm ball pitch, suitable for high-density PCB layouts |
| Supply Voltage | 3.3 V ±10% - core and I/O supply; requires decoupling per Xilinx Spartan-II DC/AC specs |
| Operating Temperature | 0 °C to +70 °C - commercial grade rating, validated for non-extended ambient environments |
Pinout & Package
XC2S150-6FG456C is housed in a 456-ball fine-pitch BGA (FBGA) package with 224 user I/Os, 8 dedicated configuration pins (e.g., INIT_B, PROGRAM_B, DONE), 4 global clock inputs, and power/ground balls distributed across the array for EMI and thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO_L0P_0 | Configurable I/O bank 0, positive differential pair | Supports LVDS input when paired with IO_L0N_0; requires external termination for differential signaling |
| CLK0 | Dedicated global clock input | Connects directly to internal low-skew clock network; must be driven by clean, low-jitter source |
| PROGRAM_B | Active-low configuration initiation | Pulling low resets configuration logic and initiates reload from PROM or master processor |
| DONE | Configuration status indicator | Open-drain output asserted high when configuration completes successfully and device enters user mode |
| VCCO_1 | I/O bank 1 supply | Provides 3.3 V to bank 1 I/Os; must be independently decoupled from core VCCINT |
| VCCINT | Core logic supply | 3.3 V supply for CLBs and interconnect; requires tight regulation and local ceramic decoupling |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | Each CLB contains two 4-input LUTs and two flip-flops, enabling efficient implementation of state machines and pipelined logic |
| SelectIO™ Technology | Programmable drive strength (2–24 mA) and slew rate per I/O bank, reducing signal integrity issues in mixed-voltage systems |
| Distributed RAM | Up to 56 kbits of fast, asynchronous block RAM implemented within CLBs for register-file or FIFO use |
| Global Clock Networks | Four independent low-skew clock trees support simultaneous multi-domain clocking without external fanout buffers |
| Boundary-Scan (JTAG) | IEEE 1149.1-compliant test access port enables in-system programming and board-level interconnect testing |
Applications
| Industrial Motion Control | Digital Video Preprocessing |
|---|---|
Use Scenario: Real-time interpolation and pulse-width modulation generation for servo motor drives. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop position control algorithms with deterministic sub-microsecond latency. Use Value: 6 ns CLB delay and 224 I/Os enable tight timing closure for 20 kHz PWM update rates and encoder feedback sampling. | Use Scenario: Pixel format conversion and chroma subsampling in HD-SDI camera interfaces. IC Role / Device Role / Timing Role: Reconfigurable logic processes parallel RGB/YUV data streams synchronized to pixel clocks up to 74.25 MHz. Use Value: SelectIO™ supports 3.3 V LVTTL and HSTL I/O standards required for video serializer/deserializer interfacing. |
| Reconfigurable Communication Interface | Test Equipment Pattern Generation |
Use Scenario: Protocol bridging between RS-485 fieldbus and USB host in programmable logic controllers. IC Role / Device Role / Timing Role: Implements UART, CRC, and framing logic in hardware; interfaces to microcontroller via parallel slave mode. Use Value: 1728 logic cells provide sufficient resource margin for dual full-duplex UARTs plus error-handling state machines. | Use Scenario: High-speed digital pattern generation for ATE systems requiring precise stimulus timing. IC Role / Device Role / Timing Role: Generates synchronized multi-channel digital waveforms with nanosecond-level edge alignment. Use Value: Internal global clock networks and deterministic CLB timing ensure <1 ns skew across 16-bit parallel output buses. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-5FG456C | 5 ns CLB delay vs. 6 ns; identical gate count, logic cells, and I/O count | Suitable where higher fMAX is required; may consume more dynamic power at same clock rate | Select when timing closure demands tighter combinatorial path budgets, accepting marginal power increase |
| XC2S200-6FG456C | 200,000 system gates and 2,176 logic cells; otherwise identical package, voltage, and I/O structure | Better suited for designs requiring additional logic depth or larger state machines without changing PCB layout | Choose when future scalability or added functionality (e.g., integrated FIFOs, wider counters) is anticipated |
Compared with XC2S150-6FG456C, the XC2S150-5FG456C offers faster timing but no logic expansion, while the XC2S200-6FG456C retains identical timing and packaging but adds 288 extra logic cells-enabling feature growth without board redesign.
Availability
XC2S150-6FG456C is available at Aetrix Electronics and suitable for industrial motion control, digital video preprocessing, and reconfigurable communication interface applications requiring stable component supply and long-term production support.
Supply support for XC2S150-6FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now oversees the legacy Spartan product families. Xilinx originally developed the Spartan-II series as cost-optimized FPGAs targeting high-volume embedded applications.
The XC2S150-6FG456C belongs to the Spartan-II family, designed specifically for logic replacement, glue logic consolidation, and moderate-complexity digital control in cost-sensitive industrial and communications equipment.
FAQ
What is the configuration method supported by XC2S150-6FG456C?
The XC2S150-6FG456C supports master serial, slave serial, and slave parallel configuration modes. It uses an external PROM (e.g., XCF02S) in master serial mode or connects to a microprocessor in slave parallel mode. Configuration data is loaded into SRAM cells on power-up, making the device volatile without external memory.
Does XC2S150-6FG456C support JTAG boundary-scan testing?
Yes, XC2S150-6FG456C includes IEEE 1149.1-compliant JTAG circuitry for boundary-scan testing, in-system programming, and debug access. The TCK, TMS, TDI, TDO, and TROUT pins are dedicated for this function and operate independently of user I/O banks.
What I/O standards are compatible with XC2S150-6FG456C?
XC2S150-6FG456C supports LVCMOS, LVTTL, PCI, and HSTL I/O standards across its 224 user pins. Each I/O bank has independent VCCO supply, allowing mixed-voltage operation. Differential signaling (e.g., LVDS) is supported only in specific pin pairs with matching P/N assignments.
Is XC2S150-6FG456C still in active production?
No, XC2S150-6FG456C is obsolete per AMD/Xilinx Product Change Notifications. However, Aetrix Electronics maintains verified legacy inventory with full traceability and provides extended lifecycle support including obsolescence monitoring and cross-reference guidance for migration paths.
What thermal considerations apply to XC2S150-6FG456C in the 456-pin FBGA package?
XC2S150-6FG456C in the 456-pin FBGA requires a minimum of six thermal vias under the package body connected to inner-layer ground planes. The recommended PCB footprint follows Xilinx DS002 guidelines, and junction temperature must remain below 85 °C under worst-case static and dynamic power conditions.
XC2S150-6FG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 864
- Number of Logic Elements/Cells:
- 3888
- Total RAM Bits:
- 49152
- Number of I/O:
- 260
- Number of Gates:
- 150000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2S150-6FG456C FAQ
1.How can I place an order for XC2S150-6FG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S150-6FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S150-6FG456C reliable?
The price and inventory of XC2S150-6FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S150-6FG456C is usually 5 days.
3.What payment methods are accepted for XC2S150-6FG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S150-6FG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S150-6FG456C?
XC2S150-6FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S150-6FG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S150-6FG456C?
For technical support, including XC2S150-6FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S150-6FG456C requirements.
6.How does Aetrix verify that XC2S150-6FG456C is sourced from the original manufacturer or authorized distributors?
All XC2S150-6FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S150-6FG456C meets industry standards.
7.What is the process for return or replacement of XC2S150-6FG456C?
All XC2S150-6FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S150-6FG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S150-6FG456C part is unused and in its original packaging.
Return procedure for XC2S150-6FG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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