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AMD XC2S150-6FGG256C
- Part No.:
- XC2S150-6FGG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2S150-6FGG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,674
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Product details
Overview
XC2S150-6FGG256C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 150,000 system gates, 176 configurable logic blocks (CLBs), 256-pin Fine-Pitch Ball Grid Array (FBGA) package, and -6 speed grade (6 ns CLB delay). It is used in industrial control logic, digital signal preprocessing, and low-cost reconfigurable I/O bridging.
For engineers reviewing the XC2S150-6FGG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (176 user I/Os), distributed RAM capacity (144 kbits), global clock network support, and IEEE 1149.1 JTAG boundary-scan compliance for in-system programming and test.
Technical Context
The XC2S150-6FGG256C implements synchronous logic using four-input LUTs and flip-flops per CLB slice, with dedicated carry logic for arithmetic functions. It supports SelectIO™ standards including LVTTL, LVCMOS, and PCI-compatible signaling across its 176 user I/O pins.
Configuration is performed via serial mode using an external PROM or parallel slave mode with a microcontroller. The device includes internal 2.5 V VCCINT and supports 3.3 V VCCO for I/O banks, enabling mixed-voltage interfacing without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 150,000 system gates - defines maximum combinational logic density for gate-equivalent design mapping |
| Configurable Logic Blocks | 176 CLBs - each contains two slices with 4-LUT + flip-flop, forming core logic fabric |
| User I/O Pins | 176 - supports high pin-count interface bridging and multi-bank voltage domain partitioning |
| Distributed RAM | 144 kbits - embedded memory within CLBs for small FIFOs, state machines, or lookup tables |
| Global Clock Lines | 4 - dedicated low-skew routing resources for synchronous timing-critical domains |
| Configuration Mode | Serial/Parallel Slave - enables flexible boot sources including PROM, microcontroller, or host processor |
| Speed Grade | -6 (6 ns CLB delay) - specifies worst-case propagation delay through a single CLB stage |
Pinout & Package
XC2S150-6FGG256C is housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and thermal pad exposed on underside for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCK0–GCK3 | Global Clock Input | Dedicated low-skew inputs routed to all CLBs; essential for synchronous system timing |
| PROGRAM_B | Configuration Initiate | Active-low signal that resets configuration logic and clears SRAM contents before reload |
| DIN | Serial Configuration Data In | Primary data path for master serial mode; connects to PROM or configuration controller |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test and debug access; enables in-system programming and verification |
| VCCINT | Core Power Supply | 2.5 V supply for internal logic; requires local decoupling near power balls |
| VCCO_0–VCCO_5 | I/O Bank Power | Independent 3.3 V supplies per bank; allows mixed-voltage I/O operation without external translators |
Key Features
| Feature | Design Value |
|---|---|
| Four-Input LUT Architecture | Enables efficient implementation of arbitrary 4-input Boolean functions per LUT, reducing logic depth |
| Dedicated Carry Chain | Accelerates arithmetic operations (e.g., counters, adders) with predictable 1-bit propagation delay per stage |
| SelectIO™ Technology | Supports LVTTL/LVCMOS/PCI I/O standards per bank; eliminates need for external level-shifting components |
| Embedded Distributed RAM | Provides up to 16 bits per CLB slice as synchronous RAM or ROM - usable for small buffers or control storage |
| IEEE 1149.1 JTAG Support | Enables boundary-scan testing, in-system configuration, and real-time debugging without dedicated test pads |
Applications
| Industrial Motion Control | Digital Video Preprocessing |
|---|---|
Use Scenario: Real-time interpolation and pulse-width modulation generation for stepper/servo motor drives. IC Role / Device Role / Timing Role: Configurable logic fabric executing deterministic timing loops with sub-microsecond jitter. Use Value: 176 user I/Os enable direct connection to encoder interfaces, PWM outputs, and safety monitoring signals. | Use Scenario: Pixel-rate filtering, color space conversion, and frame buffering prior to video encoding. IC Role / Device Role / Timing Role: Parallel datapath accelerator synchronized to pixel clock domains using global clock networks. Use Value: 144 kbits of distributed RAM supports dual-port line buffers for horizontal/vertical filtering pipelines. |
| Low-Cost Reconfigurable I/O Bridge | Legacy Bus Protocol Translation |
Use Scenario: Interfacing between microcontroller peripherals (SPI/I²C) and custom ASICs or sensors requiring parallel handshaking. IC Role / Device Role / Timing Role: Glue logic implementing protocol conversion, timing alignment, and signal conditioning. Use Value: SelectIO™ support for mixed-voltage I/O allows seamless integration across 1.8 V, 2.5 V, and 3.3 V subsystems. | Use Scenario: Translating ISA or PC/104 bus cycles into modern peripheral interfaces (e.g., UART, GPIO, SPI). IC Role / Device Role / Timing Role: Synchronous state machine managing address decode, strobe synchronization, and wait-state insertion. Use Value: -6 speed grade ensures reliable sampling of legacy bus signals operating up to 33 MHz with setup/hold margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-5FGG256C | Slower -5 speed grade (7.5 ns CLB delay); identical logic resources and I/O count | Suitable for lower-frequency designs where timing margin is relaxed | Select when target clock frequency ≤ 80 MHz and cost optimization is prioritized over maximum performance |
| XC2S200-6FGG256C | Higher-density variant (200K gates, 216 CLBs); same package and speed grade | Required when additional logic or I/O resources exceed XC2S150 capacity | Choose when design growth headroom or future scalability is needed without PCB redesign |
Compared with XC2S150-5FGG256C, the XC2S150-6FGG256C delivers tighter timing closure at higher frequencies; compared with XC2S200-6FGG256C, it offers identical speed and footprint but reduced gate count and lower static power consumption.
Availability
XC2S150-6FGG256C is available at Aetrix Electronics and suitable for industrial motion control, digital video preprocessing, and low-cost reconfigurable I/O bridging requiring stable component supply and long-term production support.
Supply support for XC2S150-6FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Spartan-II family, including XC2S150-6FGG256C, was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with predictable timing and industrial-grade reliability.
FAQ
What is the maximum operating frequency supported by XC2S150-6FGG256C?
The XC2S150-6FGG256C has a -6 speed grade specifying a 6 ns CLB propagation delay. Typical maximum system clock frequency ranges from 120 MHz to 160 MHz depending on design topology, routing, and resource utilization. Timing analysis must be performed using Xilinx ISE software with the specific constraints applied to XC2S150-6FGG256C.
Does XC2S150-6FGG256C support in-system programming?
Yes, XC2S150-6FGG256C supports in-system programming via its IEEE 1149.1 JTAG interface (TCK/TMS/TDI/TDO pins). This enables configuration bitstream loading, boundary-scan testing, and debug access without removing the device from the PCB. The XC2S150-6FGG256C does not require external configuration PROM for JTAG-based programming.
What power supply voltages are required for XC2S150-6FGG256C?
XC2S150-6FGG256C requires two separate supply voltages: 2.5 V for VCCINT (core logic) and 3.3 V for VCCO (I/O banks). Each I/O bank has its own VCCO pin, allowing mixed-voltage operation. Decoupling capacitors must be placed adjacent to respective power balls per Xilinx layout guidelines for XC2S150-6FGG256C.
Can XC2S150-6FGG256C be used in automotive applications?
No, XC2S150-6FGG256C is rated for commercial and industrial temperature ranges (0°C to +70°C for C-grade), not automotive AEC-Q100 qualification. Its packaging, test coverage, and lifetime reliability data do not meet automotive requirements. For automotive use, consider Xilinx Automotive (XA) variants or newer AMD Adaptive SoCs explicitly qualified for automotive environments.
Is there a pin-compatible replacement for XC2S150-6FGG256C with higher logic density?
Yes, XC2S200-6FGG256C is pin-compatible with XC2S150-6FGG256C and shares the same 256-ball FBGA package and -6 speed grade. It provides 200,000 system gates and 216 CLBs while maintaining identical I/O count and timing characteristics, making it a direct upgrade path without PCB changes.
XC2S150-6FGG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 864
- Number of Logic Elements/Cells:
- 3888
- Total RAM Bits:
- 49152
- Number of I/O:
- 176
- Number of Gates:
- 150000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2S150-6FGG256C FAQ
1.How can I place an order for XC2S150-6FGG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S150-6FGG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S150-6FGG256C reliable?
The price and inventory of XC2S150-6FGG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S150-6FGG256C is usually 5 days.
3.What payment methods are accepted for XC2S150-6FGG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S150-6FGG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S150-6FGG256C?
XC2S150-6FGG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S150-6FGG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S150-6FGG256C?
For technical support, including XC2S150-6FGG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S150-6FGG256C requirements.
6.How does Aetrix verify that XC2S150-6FGG256C is sourced from the original manufacturer or authorized distributors?
All XC2S150-6FGG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S150-6FGG256C meets industry standards.
7.What is the process for return or replacement of XC2S150-6FGG256C?
All XC2S150-6FGG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S150-6FGG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S150-6FGG256C part is unused and in its original packaging.
Return procedure for XC2S150-6FGG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2S150-6FGG256C Tags
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