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AMD XC2S150-6FGG456C
- Part No.:
- XC2S150-6FGG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2S150-6FGG456C.pdf
- Description:
- IC FPGA 260 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,987
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Product details
Overview
XC2S150-6FGG456C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 150,000 system gates, 17,280 bits of block RAM, and 456-pin Fine-Pitch Ball Grid Array (FBGA) packaging. It operates at -6 speed grade (6 ns CLB delay), supports 3.3 V I/O, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC2S150-6FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O voltage compatibility, CLB timing performance, and FBGA thermal/mechanical footprint suitability for industrial PCB layouts.
Technical Context
The XC2S150-6FGG456C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM, and dedicated carry logic. It supports SelectI/O standards including LVTTL, LVCMOS, and PCI, with programmable slew rate and drive strength per bank.
Configuration is performed via serial mode using an external PROM or master microprocessor. The device includes internal 2.5 V voltage regulator for core logic and supports JTAG boundary-scan testing per IEEE 1149.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 150,000 system gates - defines maximum combinational/sequential logic density for control path implementation |
| Block RAM | 17,280 bits - supports small FIFOs, register files, or state-machine data storage without external memory |
| Speed Grade | -6 (6 ns CLB propagation delay) - enables 125 MHz system clock operation in typical designs |
| I/O Voltage | 3.3 V - compatible with standard PCI and industrial microcontroller interfaces |
| Package | 456-pin FBGA (20×20 mm, 1.0 mm pitch) - provides high I/O count with compact board area and thermal dissipation capability |
| Configuration Mode | Serial PROM or microprocessor-controlled - allows flexible, field-upgradable bitstream loading |
Pinout & Package
XC2S150-6FGG456C uses a 456-ball fine-pitch BGA package (FCCSP-style footprint) with power/ground ball distribution optimized for signal integrity and thermal management. Pin functions are banked by voltage and I/O standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCK0–GCK3 | Global Clock Input | Dedicated low-skew routing to all CLBs; essential for synchronous timing-critical paths |
| PROGRAM_B | Configuration Initiate | Active-low signal that resets configuration logic and clears SRAM contents on assertion |
| DONE | Configuration Status | Open-drain output indicating successful bitstream load completion and device readiness |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan | IEEE 1149.1-compliant test access port for programming and interconnect verification |
| VCCO_0–VCCO_5 | I/O Bank Supply | Independent 3.3 V supplies per I/O bank enabling mixed-voltage interface support |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | Each CLB contains two 4-input LUTs + flip-flops, enabling efficient implementation of arithmetic and state-machine logic |
| SelectI/O Technology | Per-bank programmable drive strength (2–24 mA) and slew rate control for EMI reduction and signal integrity tuning |
| Embedded Block RAM | Four 18×256-bit dual-port RAM blocks - usable as true dual-port memory or shift registers |
| Internal Voltage Regulator | On-chip 2.5 V regulator powers core logic, eliminating need for external core supply and reducing BOM count |
Applications
| Industrial Motion Control | Legacy Interface Bridging |
|---|---|
Use Scenario: Real-time interpolation and PWM generation for multi-axis servo drives. IC Role / Device Role / Timing Role: FPGA fabric executes deterministic control loops with sub-microsecond latency using hardwired logic paths. Use Value: Replaces ASICs with field-programmable flexibility while meeting 100 kHz update rates and jitter under 5 ns. | Use Scenario: Protocol translation between RS-232/422 peripherals and modern microcontroller buses. IC Role / Device Role / Timing Role: Implements custom UART, SPI, and parallel bus glue logic with precise timing alignment. Use Value: Eliminates discrete level-shifters and timing ICs, reducing component count by 7+ parts per interface channel. |
| Test Equipment Signal Generation | Medical Imaging Data Preprocessing |
Use Scenario: High-speed digital pattern generation for ATE stimulus engines. IC Role / Device Role / Timing Role: Synchronizes multiple 100+ Mbps parallel data streams using global clock networks and phase-aligned outputs. Use Value: Achieves <100 ps inter-channel skew across 32-bit wide vectors, critical for timing margin validation. | Use Scenario: Real-time pixel reordering and histogram accumulation in ultrasound front-end modules. IC Role / Device Role / Timing Role: Processes 8-bit grayscale video at 60 fps using pipelined arithmetic units and on-chip RAM buffers. Use Value: Reduces external memory bandwidth demand by 40% through local frame buffering and in-line computation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV300E-6PQ240C | Virtex-E family, 300K gates, 240-pin PQFP, no on-chip voltage regulator | Higher gate count but larger footprint and higher static power; requires external 2.5 V core supply | Choose when legacy PQFP assembly infrastructure exists and >200K gates are needed |
| XC3S200-4PQ240C | Spartan-3 family, 200K gates, same PQFP package, 1.2 V core, enhanced DSP slices | Lower static power and improved multiplier performance, but incompatible configuration and I/O architecture | Choose for new designs requiring lower power or arithmetic acceleration, accepting redesign effort |
Compared with XC2S150-6FGG456C, XCV300E-6PQ240C offers more logic but demands additional power regulation and board space, while XC3S200-4PQ240C delivers architectural improvements at the cost of non-drop-in migration and revised timing closure requirements.
Availability
XC2S150-6FGG456C is available at Aetrix Electronics and suitable for industrial motion control, legacy interface bridging, and medical imaging preprocessing requiring stable component supply and long-term obsolescence mitigation.
Supply support for XC2S150-6FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-II product support, focusing on industrial and aerospace customers requiring long-lifecycle programmable logic solutions.
The Spartan-II family was designed for cost-optimized, high-volume embedded logic replacement-emphasizing fast time-to-market, predictable timing, and simplified power delivery over raw performance.
FAQ
What is the maximum operating frequency of the XC2S150-6FGG456C?
The XC2S150-6FGG456C has a -6 speed grade specifying 6 ns CLB propagation delay, supporting system clock frequencies up to 125 MHz in typical place-and-route implementations. Actual achievable frequency depends on design topology, routing congestion, and I/O timing constraints, but the device consistently meets this specification under industrial temperature conditions (0°C to 85°C).
Does the XC2S150-6FGG456C require an external configuration PROM?
Yes, the XC2S150-6FGG456C is SRAM-based and requires external nonvolatile storage-typically a serial PROM-to reload its configuration bitstream at power-up. It supports Master Serial, Slave Serial, and Microprocessor modes, with the PROM connected directly to dedicated configuration pins (DIN, CCLK, PROGRAM_B, DONE).
Can the XC2S150-6FGG456C operate with mixed I/O voltages?
Yes, the XC2S150-6FGG456C supports mixed I/O voltages through banked VCCO supplies: each of six I/O banks can be independently set to 3.3 V, enabling simultaneous LVTTL, LVCMOS, and PCI-compatible signaling. Core logic remains fixed at 2.5 V supplied internally.
Is the XC2S150-6FGG456C pin-compatible with other Spartan-II devices?
No, the XC2S150-6FGG456C is not pin-compatible with other Spartan-II variants due to differing ball counts and I/O bank allocations. Its 456-ball FBGA footprint is unique to the XC2S150 and XC2S200 in the Spartan-II family; smaller members use 208- or 256-pin packages with distinct pinouts.
What development tools support the XC2S150-6FGG456C?
The XC2S150-6FGG456C is fully supported by Xilinx ISE Design Suite 14.7-the final official toolchain for Spartan-II. This includes synthesis, MAP, PAR, bitstream generation, and iMPACT programming. Third-party tools like GHDL or openFPGA flow may provide limited netlist-level compatibility but lack official timing analysis or configuration support.
XC2S150-6FGG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 864
- Number of Logic Elements/Cells:
- 3888
- Total RAM Bits:
- 49152
- Number of I/O:
- 260
- Number of Gates:
- 150000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2S150-6FGG456C FAQ
1.How can I place an order for XC2S150-6FGG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S150-6FGG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S150-6FGG456C reliable?
The price and inventory of XC2S150-6FGG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S150-6FGG456C is usually 5 days.
3.What payment methods are accepted for XC2S150-6FGG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S150-6FGG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S150-6FGG456C?
XC2S150-6FGG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S150-6FGG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S150-6FGG456C?
For technical support, including XC2S150-6FGG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S150-6FGG456C requirements.
6.How does Aetrix verify that XC2S150-6FGG456C is sourced from the original manufacturer or authorized distributors?
All XC2S150-6FGG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S150-6FGG456C meets industry standards.
7.What is the process for return or replacement of XC2S150-6FGG456C?
All XC2S150-6FGG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S150-6FGG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S150-6FGG456C part is unused and in its original packaging.
Return procedure for XC2S150-6FGG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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