AMD XC2S150E-6FT256I

Overview

XC2S150E-6FT256I from Xilinx is a 150,000-system-gate Spartan®-IIE Field-Programmable Gate Array with 3,888 logic cells, 265 user I/Os, four Delay-Locked Loops (DLLs), and 48 Kbits of block RAM in a 256-ball Fine-Pitch BGA package. It operates at 1.8 V core voltage and supports 3.3 V/2.5 V/1.5 V I/O standards for PCI, LVTTL, LVCMOS, HSTL, and LVDS interfaces in industrial embedded control and reconfigurable digital signal processing systems.

For engineers reviewing the XC2S150E-6FT256I datasheet, pinout, applications, or equivalent options, key selection considerations include DLL-based clock deskew, hot-swap I/O capability, 265-user-I/O count in FT256 packaging, dual-voltage I/O bank architecture, and compatibility with Xilinx ISE® design tools for rapid FPGA prototyping and production deployment.

Technical Context

The XC2S150E-6FT256I implements a regular array of Configurable Logic Blocks (CLBs) - each containing four 4-input LUTs with distributed RAM, dedicated carry chains, and dual flip-flops per slice - surrounded by eight independent I/O banks. Its four corner-placed DLLs provide zero-delay clock distribution, phase shifting, and frequency multiplication for synchronous system timing.

It features SelectRAM™ hierarchical memory: 55,296 bits of distributed RAM (16-bit/LUT) and 48 Kbits of true dual-port 4K-bit block RAM. I/O supports 19 standards including LVDS, LVPECL, SSTL, HSTL, and PCI-compliant 66 MHz operation, with hot-swap capability enabled across all I/O pins per CompactPCI v2.2 compliance.

Key Specifications

Pinout & Package

XC2S150E-6FT256I is housed in a 256-ball Fine-Pitch Ball Grid Array (FT256) package with 1.0 mm ball pitch, 17 × 17 array, and 8 independent I/O banks (Bank 0–7). Each bank has dedicated VCCO and VREF pins; no shared VCCO across banks. Pin definitions follow DS077-4 (v3.0) pinout tables.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC2S100E-6PQ208I, the XC2S150E-6FT256I delivers 44% more logic cells, 31% more I/Os, and differential signaling - critical for noise-immune industrial links. Against XC2S200E-6FT256I, it offers identical packaging and thermal profile but reduces cost and power where 150K gates suffice.

Availability

XC2S150E-6FT256I is available at Aetrix Electronics and suitable for industrial motion control, PCI-based data acquisition, reconfigurable communications interface, and legacy system emulation requiring stable component supply and long-lifecycle support.

Supply support for XC2S150E-6FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA toolchains for adaptive computing.

The Spartan®-IIE family was engineered for cost-sensitive, high-volume applications demanding robust I/O flexibility, hot-swap readiness, and predictable timing - targeting industrial automation, test equipment, and legacy ASIC replacement.

FAQ

What is the maximum operating frequency of the XC2S150E-6FT256I?

The XC2S150E-6FT256I supports system clock rates beyond 200 MHz, with actual achievable frequency dependent on design complexity, routing, and timing constraints. The -6 speed grade guarantees performance up to 166 MHz for CLB-to-CLB paths under recommended operating conditions (VCCINT = 1.8 V, TJ = –40°C to +100°C), as specified in DS077-3 switching characteristics.

Does the XC2S150E-6FT256I support hot-swap functionality?

Yes, the XC2S150E-6FT256I includes built-in hot-swap I/O capability compliant with CompactPCI v2.2. All I/O pins remain high-impedance before and during power-up and configuration, with no current path to VCCINT or VCCO, eliminating risk of latch-up or system disruption when inserted into a live backplane.

How many differential I/O pairs does the XC2S150E-6FT256I support?

The XC2S150E-6FT256I supports up to 114 differential I/O pairs, usable as LVDS, Bus LVDS, or LVPECL inputs/outputs. These are distributed across its eight I/O banks, with bank-specific VCCO and VREF requirements - for example, LVDS requires 2.5 V VCCO and no VREF, while HSTL Class I requires 1.5 V VCCO and 0.75 V VREF.

What development tools are compatible with the XC2S150E-6FT256I?

The XC2S150E-6FT256I is fully supported by the Xilinx ISE® 14.7 design suite (last official version supporting Spartan-IIE), including schematic entry, VHDL/Verilog synthesis, automatic place-and-route, timing analysis, and JTAG programming. Legacy IP cores and simulation models remain accessible through Xilinx's archived documentation portal.

Is the XC2S150E-6FT256I still in production?

No - the XC2S150E-6FT256I was discontinued per Xilinx Change Notice XCN12026 (2012), with final shipment in 2013. Aetrix Electronics maintains legacy inventory and offers traceable, tested units for ongoing industrial maintenance and obsolescence mitigation programs.