AMD XC2S200-5FG256C
- Part No.:
- XC2S200-5FG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2S200-5FG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,067
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Product details
Overview
XC2S200-5FG256C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 200,000 system gates, 4,992 logic cells, and 256-pin Fine-Pitch Ball Grid Array (FBGA) packaging. It operates at 5 ns input/output delay and supports 3.3 V I/O with 2.5 V core voltage, commonly used in industrial control logic and digital signal preprocessing.
For engineers reviewing the XC2S200-5FG256C datasheet, pinout, applications, or equivalent options, key selection factors include logic cell count, I/O voltage compatibility, core supply requirement, timing grade (-5 speed grade), and FBGA256 package footprint constraints.
Technical Context
The XC2S200-5FG256C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM up to 56 kbits, and 16 dedicated multipliers. It supports SelectI/O standards including LVTTL, LVCMOS, and PCI.
Configuration is performed via serial PROM or boundary-scan (JTAG), with support for master parallel and slave serial modes. The -5 speed grade guarantees maximum clock frequency of 160 MHz for internal logic paths under worst-case conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,992 CLBs - determines maximum combinational/sequential logic capacity for custom digital functions |
| System Gates | 200,000 - industry-standard metric for relative logic density vs. ASIC equivalents |
| Speed Grade | -5 - specifies 5 ns input/output pad delay and 160 MHz max internal clock frequency |
| I/O Voltage | 3.3 V - defines compatible peripheral interface levels and termination requirements |
| Core Voltage | 2.5 V - requires dedicated low-noise core regulator and decoupling strategy |
| Package | 256-pin FBGA (Fine-Pitch BGA) - 17×17 mm body, 1.0 mm ball pitch, surface-mount only |
| Total RAM Bits | 56,320 - usable as dual-port RAM, shift registers, or FIFO buffers without external memory |
Pinout & Package
XC2S200-5FG256C uses a 256-ball fine-pitch BGA (FBGA) package with 17×17 array, 1.0 mm ball pitch, and standard ball labeling (A1–P17). Power and ground balls are distributed across multiple corners and center rows per Xilinx Spartan-II PCB layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O bank power | Supplies 3.3 V to Bank 0 I/O pins; must be decoupled locally |
| VCCINT | Core power | Supplies 2.5 V to internal logic; requires tight regulation and low-ESR capacitors |
| GND | Ground reference | Multiple dedicated balls per bank and core; essential for signal integrity and EMI control |
| TCK/TMS/TDI/TDO | JTAG interface | Enables IEEE 1149.1 boundary-scan configuration and debugging |
| PROGRAM_B | Configuration reset | Active-low signal initiating reconfiguration from external PROM or host processor |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | Each CLB contains two 4-input LUTs + 2 flip-flops, enabling efficient implementation of state machines and arithmetic logic |
| Distributed RAM | Up to 16 bits per CLB - allows fast, low-latency register files without block RAM overhead |
| SelectI/O Technology | Supports LVTTL, LVCMOS, and PCI signaling - simplifies interfacing with legacy and mixed-voltage systems |
| Dedicated Multipliers | 16 × 16-bit hard multipliers - accelerates DSP functions like FIR filtering without consuming logic resources |
| Global Clock Networks | Four low-skew global clock lines - ensures synchronous timing across large logic partitions |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM output generation. IC Role / Device Role / Timing Role: FPGA fabric executes deterministic control algorithms with sub-microsecond latency and synchronized I/O timing. Use Value: XC2S200-5FG256C provides sufficient logic cells and I/O count to integrate motion profiling, safety monitoring, and fieldbus interface in one device. | Use Scenario: High-speed digital pattern generation and response capture for IC functional validation. IC Role / Device Role / Timing Role: XC2S200-5FG256C acts as a programmable vector engine with precise cycle-accurate stimulus timing. Use Value: The -5 speed grade and 256 I/O pins enable simultaneous test of multi-pin devices at up to 160 MHz vector rates. |
| Medical Imaging Interface | Communications Baseband Processing |
Use Scenario: Aggregation and preprocessing of parallel ADC streams from ultrasound transducer arrays. IC Role / Device Role / Timing Role: XC2S200-5FG256C performs real-time data alignment, gain correction, and beamforming coefficient application. Use Value: Distributed RAM and dedicated multipliers allow pixel-level computation without external memory bottlenecks. | Use Scenario: Channelization and symbol mapping in fixed-wireless access base stations. IC Role / Device Role / Timing Role: XC2S200-5FG256C implements custom MAC-layer logic and burst-mode demodulator control state machines. Use Value: SelectI/O compatibility with 3.3 V PHY interfaces and deterministic timing enables seamless integration with RF front-end ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-5FG256C | 150K-gate capacity, 3,888 logic cells - 22% fewer resources than XC2S200-5FG256C | Suitable for smaller control logic or lower-channel-count signal processing | Choose when design fits within reduced gate count and cost savings outweigh margin loss |
| XC3S200-4PQ208C | Spartan-3 family, 200K gates, 48-pin reduction, PQ208 package - different pinout and configuration protocol | Requires PCB redesign; offers improved DSP slice density and lower static power | Select only if migrating to newer architecture with full redesign cycle and toolchain update |
Compared with XC2S200-5FG256C, the XC2S150-5FG256C offers cost reduction at the expense of logic headroom, while the XC3S200-4PQ208C introduces architectural improvements but mandates board-level changes and new configuration infrastructure.
Availability
XC2S200-5FG256C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging interface designs requiring stable component supply and long-term obsolescence management.
Supply support for XC2S200-5FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now oversees the Spartan FPGA product line, maintaining legacy support and documentation for industrial and aerospace applications.
The Spartan-II family, including XC2S200-5FG256C, was designed for cost-sensitive, high-volume embedded logic replacement-targeting applications where ASIC development cost or lead time is prohibitive.
FAQ
What is the core voltage requirement for XC2S200-5FG256C?
The XC2S200-5FG256C requires a regulated 2.5 V ± 3% core supply (VCCINT) delivered to dedicated power balls. This voltage powers all internal logic resources, and deviation beyond tolerance risks timing violations or configuration loss. Decoupling must follow Xilinx Spartan-II layout guidelines with low-ESR ceramic capacitors placed near each VCCINT ball. The XC2S200-5FG256C does not support adaptive voltage scaling or dual-core voltage operation.
Does XC2S200-5FG256C support JTAG boundary-scan configuration?
Yes, XC2S200-5FG256C fully supports IEEE 1149.1 JTAG boundary-scan via TCK, TMS, TDI, and TDO pins. This enables in-system programming, configuration verification, and interconnect testing without requiring external PROM. The XC2S200-5FG256C also supports JTAG-based debug probes for partial reconfiguration analysis. JTAG mode is enabled by default on power-up unless overridden by mode pin settings.
What I/O standards are supported by XC2S200-5FG256C?
XC2S200-5FG256C supports LVTTL, LVCMOS (3.3 V and 2.5 V), and PCI-compliant I/O standards across its 256-ball FBGA package. Each of the eight I/O banks can be independently configured for voltage level and drive strength. The XC2S200-5FG256C does not support differential standards like LVDS or RSDS, nor does it support 1.8 V or 1.5 V I/O without level-shifting circuitry.
Is XC2S200-5FG256C still in active production?
No, XC2S200-5FG256C is obsolete per AMD/Xilinx Product Change Notification #PCN-0211. It is no longer manufactured, but Aetrix Electronics maintains legacy inventory with full traceability and extended lifecycle support. The XC2S200-5FG256C remains available for repair, replacement, and legacy system sustainment under controlled distribution terms.
What configuration methods does XC2S200-5FG256C support?
XC2S200-5FG256C supports master parallel, slave serial, and JTAG configuration modes. External configuration PROM (e.g., XCF02S) is typically used in master parallel mode, while microcontrollers implement slave serial over SPI-like timing. JTAG is used for development and field updates. All three methods load the same bitstream format, and the XC2S200-5FG256C validates CRC on completion regardless of method.
XC2S200-5FG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 57344
- Number of I/O:
- 176
- Number of Gates:
- 200000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2S200-5FG256C FAQ
1.How can I place an order for XC2S200-5FG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S200-5FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S200-5FG256C reliable?
The price and inventory of XC2S200-5FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S200-5FG256C is usually 5 days.
3.What payment methods are accepted for XC2S200-5FG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S200-5FG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S200-5FG256C?
XC2S200-5FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S200-5FG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S200-5FG256C?
For technical support, including XC2S200-5FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S200-5FG256C requirements.
6.How does Aetrix verify that XC2S200-5FG256C is sourced from the original manufacturer or authorized distributors?
All XC2S200-5FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S200-5FG256C meets industry standards.
7.What is the process for return or replacement of XC2S200-5FG256C?
All XC2S200-5FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S200-5FG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S200-5FG256C part is unused and in its original packaging.
Return procedure for XC2S200-5FG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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