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AMD XC2S200-5FG256I

Part No.:
XC2S200-5FG256I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BGA
Datasheet:
AetrixXC2S200-5FG256I.pdf
Description:
IC FPGA 176 I/O 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,376

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Product details

Overview

XC2S200-5FG256I from AMD (formerly Xilinx) is a Spartan-II family FPGA with 200,000 system gates, 1728 logic cells, and a 5 ns CLB delay. It features 256-pin Fine-Pitch Ball Grid Array (FBGA) packaging, 96 kbits of block RAM, and supports 3.3 V I/O with 2.5 V internal core voltage. It is used in industrial motion control systems for real-time encoder interface and PWM generation.

For engineers reviewing the XC2S200-5FG256I datasheet, pinout, applications, or equivalent options, key selection considerations include CLB propagation delay, available I/O count, block RAM depth, supported I/O standards (LVTTL/LVCMOS), and thermal performance under sustained logic utilization.

Technical Context

The XC2S200-5FG256I implements a hierarchical architecture with configurable logic blocks (CLBs), input/output blocks (IOBs), and dedicated carry logic. It supports distributed RAM and shift register functions within CLBs, and includes global clock routing with four dedicated low-skew clock networks.

Configuration is performed via serial mode using an external PROM or parallel slave mode with a microcontroller. The device supports IEEE 1149.1 JTAG boundary-scan testing and in-system programmability through SelectMAP or serial configuration interfaces.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Capacity200,000 system gates - determines maximum combinational/sequential logic complexity implementable
CLB Delay5 ns - defines worst-case signal propagation delay through a single CLB stage
Block RAM96 kbits - provides on-chip memory for FIFOs, lookup tables, or small buffers without external SRAM
I/O Count176 user I/O pins - supports high-pin-count peripheral interfacing including parallel buses and multi-channel ADCs
Core Voltage2.5 V ± 0.1 V - requires dedicated low-noise core regulator; impacts static power and noise margin
I/O StandardsLVTTL, LVCMOS 3.3 V - enables direct connection to common microcontrollers and digital logic without level shifters

Pinout & Package

XC2S200-5FG256I is housed in a 256-ball fine-pitch BGA (FG256) package with 1.27 mm ball pitch, 17 mm × 17 mm body size, and thermal pad exposed on underside for enhanced heat dissipation.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank 0 power supply - must be decoupled locally to maintain signal integrity for bank-specific I/O
P2CLK0Dedicated global clock input - routed through low-skew network to all CLBs and IOBs
T14PROGRAM_BActive-low configuration reset - initiates reconfiguration sequence when pulsed low
R15DONEOpen-drain status output - goes high when configuration completes successfully
A1VCCAUX2.5 V auxiliary supply for JTAG and configuration circuitry - separate from core VCCINT

Key Features

FeatureDesign Value
Configurable Logic Blocks (CLBs)1728 CLBs each with dual 4-input LUTs and flip-flops - enables efficient implementation of synchronous state machines
SelectRAM+ Memory96 kbits distributed and block RAM - supports dual-port memory access and synchronous read/write timing
Global Clock NetworksFour dedicated low-skew clock trees - allows independent clock domains for peripherals, processing, and I/O
JTAG Boundary ScanIEEE 1149.1 compliance - enables board-level testability and in-system programming without dedicated programming hardware

Applications

Industrial Motion ControlAutomated Test Equipment (ATE)

Use Scenario: Real-time interpolation and position loop closure in servo drives.

IC Role / Device Role / Timing Role: FPGA fabric executes custom PID algorithms and generates synchronized PWM outputs with sub-microsecond jitter.

Use Value: 5 ns CLB delay and deterministic routing enable <1 µs control loop latency critical for high-bandwidth motor control.

Use Scenario: High-speed digital pattern generation and response capture for IC functional validation.

IC Role / Device Role / Timing Role: Configurable I/O banks drive DUT signals while capturing responses with precise timing alignment.

Use Value: 176 user I/O pins and LVTTL compatibility allow direct connection to DUT without adapter logic or level translation.

Medical Imaging InterfaceCommunications Baseband Processing

Use Scenario: Pixel data aggregation and preprocessing from multi-channel CCD/CMOS sensors in ultrasound systems.

IC Role / Device Role / Timing Role: Block RAM buffers sensor streams; CLBs perform pixel averaging and edge detection prior to DSP offload.

Use Value: 96 kbits on-chip RAM eliminates need for external frame buffer, reducing board area and signal routing complexity.

Use Scenario: Channelization and symbol mapping in fixed-wireless base station modems.

IC Role / Device Role / Timing Role: Implements custom FIR filters and QAM mappers in programmable logic, synchronized to reference clocks.

Use Value: Four global clock networks support independent timing domains for RF front-end, MAC layer, and host interface subsystems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC2S150-5FG256I150,000 gates, 1368 CLBs, 72 kbits block RAM - lower density and reduced I/O count (156 pins)Suitable for less complex control tasks with fewer concurrent peripheralsSelect when design fits within smaller logic footprint and requires lower cost/power
XC3S200-4PQ208CSpartan-3 family, 200,000 gates, 208-pin PQFP, 128 kbits block RAM, 1.2 V core - newer architecture with higher logic efficiencyBetter suited for new designs requiring higher gate utilization or lower static powerPrefer for new designs where migration path, toolchain support, and power efficiency are priorities

Compared with XC2S200-5FG256I, XC2S150-5FG256I offers reduced capacity at lower cost but limits scalability, while XC3S200-4PQ208C provides architectural improvements and better toolchain longevity but requires PCB redesign due to different package and voltage requirements.

Availability

XC2S200-5FG256I is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging interface applications requiring stable component supply across extended production lifecycles.

Supply support for XC2S200-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for heterogeneous compute acceleration.

The Spartan-II product line was designed for cost-sensitive, high-volume embedded applications requiring predictable timing, moderate logic density, and robust I/O flexibility - especially in industrial automation and instrumentation.

FAQ

What is the core voltage requirement for XC2S200-5FG256I?

The XC2S200-5FG256I requires a 2.5 V ± 0.1 V core supply (VCCINT) delivered to dedicated power pins. This voltage powers the internal logic fabric and CLBs. Deviation beyond tolerance risks timing violations or configuration loss. The XC2S200-5FG256I does not support 1.8 V or 3.3 V core operation.

Does XC2S200-5FG256I support JTAG programming?

Yes, XC2S200-5FG256I fully supports IEEE 1149.1 JTAG boundary-scan for both programming and debugging. The TCK, TMS, TDI, and TDO pins enable in-system configuration via JTAG chain, and the XC2S200-5FG256I can be programmed without external PROM or microcontroller intervention.

How many global clock networks does XC2S200-5FG256I provide?

The XC2S200-5FG256I provides four dedicated global clock networks, each with low skew and fanout to all CLBs and IOBs. These networks support independent clock domains, and each can be driven by dedicated CLKx pins or internally generated clocks - a key capability used in the XC2S200-5FG256I for multi-rate peripheral interfacing.

What is the maximum operating temperature range for XC2S200-5FG256I?

The XC2S200-5FG256I is rated for industrial temperature operation from –40 °C to +100 °C junction temperature. The 'I' suffix explicitly denotes this extended range, making the XC2S200-5FG256I suitable for enclosed industrial enclosures or uncooled environments where ambient temperatures exceed commercial-grade limits.

Can XC2S200-5FG256I be configured via microcontroller?

Yes, XC2S200-5FG256I supports parallel slave mode configuration, allowing a microcontroller to load bitstream data through its 8-bit or 16-bit data bus. The microcontroller asserts PROGRAM_B, monitors INIT_B and DONE, then writes configuration data - a method commonly used in field-upgradable XC2S200-5FG256I deployments.

XC2S200-5FG256I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-II
Package/Case:
256-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
176
Number of Gates:
200000
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FBGA (17x17)

XC2S200-5FG256I FAQ

1.How can I place an order for XC2S200-5FG256I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2S200-5FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2S200-5FG256I reliable?

The price and inventory of XC2S200-5FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S200-5FG256I is usually 5 days.

3.What payment methods are accepted for XC2S200-5FG256I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S200-5FG256I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2S200-5FG256I?

XC2S200-5FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2S200-5FG256I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2S200-5FG256I?

For technical support, including XC2S200-5FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S200-5FG256I requirements.

6.How does Aetrix verify that XC2S200-5FG256I is sourced from the original manufacturer or authorized distributors?

All XC2S200-5FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S200-5FG256I meets industry standards.

7.What is the process for return or replacement of XC2S200-5FG256I?

All XC2S200-5FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2S200-5FG256I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2S200-5FG256I part is unused and in its original packaging.

Return procedure for XC2S200-5FG256I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2S200-5FG256I Tags

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