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AMD XC2S200-5FG456C

Part No.:
XC2S200-5FG456C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
456-BBGA
Datasheet:
AetrixXC2S200-5FG456C.pdf
Description:
IC FPGA 284 I/O 456FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,667

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Product details

Overview

XC2S200-5FG456C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 200,000 system gates, 176 I/O pins, and a 5 ns CLB propagation delay. It features 1176 configurable logic blocks, embedded block RAM, and supports 3.3 V I/O with 2.5 V internal core voltage. It is used in industrial control logic replacement and low-cost digital signal preprocessing.

For engineers reviewing the XC2S200-5FG456C datasheet, pinout, applications, or equivalent options, key selection factors include CLB count, I/O voltage compatibility, configuration mode support (Master Serial, Slave Parallel), and package thermal profile for sustained operation in programmable logic designs.

Technical Context

The XC2S200-5FG456C implements a fine-grained, SRAM-based architecture with four-input LUTs and flip-flops per CLB. Configuration is performed via external PROM or processor-controlled parallel/serial interfaces using IEEE 1532-compliant bitstreams.

It supports SelectI/O standards including LVTTL, LVCMOS, and PCI, with programmable slew rate and drive strength per bank. Internal global clock networks distribute up to four dedicated clock signals with low skew.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Capacity200,000 system gates - determines maximum combinational/sequential logic density for gate-equivalent designs
CLB Count1176 CLBs - defines number of independent logic clusters each containing two 4-LUTs and two registers
I/O Pins176 user I/O - usable bidirectional pins distributed across eight I/O banks with independent voltage support
Propagation Delay5 ns CLB delay - specifies worst-case intra-CLB path timing for critical path analysis
Core Voltage2.5 V ± 0.1 V - required internal supply for SRAM configuration cells and CLB operation
I/O Voltage3.3 V tolerant - enables direct interfacing with legacy LVTTL and LVCMOS33 systems without level shifters

Pinout & Package

XC2S200-5FG456C is housed in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package with 25 × 25 mm body size and 1.0 mm ball pitch. Thermal pad on underside requires solder paste stencil design per Xilinx PCB guidelines.

Pin/TerminalCircuit RoleDesign Meaning
GCK0–GCK3Dedicated Global Clock InputLow-skew routing to all CLBs; must be driven by clean, low-jitter source
PROGRAM_BActive-Low Configuration InitiatePulls device into configuration reset state; synchronous deassertion starts bitstream loading
DONEConfiguration Completion IndicatorOpen-drain output asserted high when configuration memory is fully loaded and verified
TCK/TMS/TDI/TDOJTAG Boundary-Scan InterfaceIEEE 1149.1 compliant test and debug access; required for programming and verification
VCCO_0–VCCO_7I/O Bank Power SupplyIndependent 3.3 V supplies per I/O bank enable mixed-voltage interface support

Key Features

FeatureDesign Value
Embedded Block RAM48 Kbits total distributed across 24 x 2048-bit blocks - supports dual-port FIFO, ROM, and data buffering without external memory
SelectI/O TechnologyPer-bank programmable drive/slew - enables noise reduction and signal integrity tuning for mixed-signal PCB layouts
Configuration ModesMaster Serial, Slave Serial, Slave Parallel, JTAG - allows flexible boot sources including SPI PROM or microcontroller-hosted loading
Digital Clock Manager (DCM)Not present - XC2S200-5FG456C lacks DCM; clock synthesis requires external PLL or discrete logic

Applications

Industrial Motion ControlAutomated Test Equipment

Use Scenario: Real-time position loop closure and PWM generation for stepper/servo drives in CNC machines.

IC Role / Device Role / Timing Role: Configurable logic fabric implementing encoder interpolation, trajectory planning, and safety interlock logic.

Use Value: Enables deterministic sub-microsecond response latency and field-upgradable control algorithms without ASIC redesign.

Use Scenario: Pattern generation and response capture for semiconductor wafer probing and board-level functional testing.

IC Role / Device Role / Timing Role: Synchronized multi-channel digital stimulus engine with precise timing alignment across 128+ I/O lines.

Use Value: Supports 50 MHz vector rates with cycle-accurate pin state control, reducing test cycle time versus fixed-function ATE controllers.

Medical Imaging InterfaceCommunications Protocol Bridge

Use Scenario: Interfacing ultrasound transducer arrays to ADC/DSP subsystems in portable imaging devices.

IC Role / Device Role / Timing Role: Time-division multiplexing hub aggregating 64-channel analog front-end digitization streams into a single LVDS link.

Use Value: Eliminates need for discrete glue logic and reduces BOM count while maintaining <1 ns channel-to-channel skew.

Use Scenario: Bridging RS-485 fieldbus to USB 2.0 host in building automation gateways.

IC Role / Device Role / Timing Role: Protocol translation engine with hardware UARTs, FIFO buffers, and USB endpoint controller logic.

Use Value: Offloads protocol parsing from host MCU, enabling real-time response to Modbus RTU commands at 115.2 kbps.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC2S150-5FG456C150K-gate capacity, 912 CLBs, same package and I/O structureSuitable for smaller logic density requirements; lower static power drawSelect when design fits within reduced resource budget and cost sensitivity outweighs future scalability
XC3S200-4PQ208CSpartan-3 family, 200K gates, 45 nm process, 208-pin PQFP, no native 3.3 V I/O toleranceRequires level-shifting for 3.3 V interfaces; higher logic density per mm² but different pinout and configuration flowChoose for new designs prioritizing lower static power and enhanced DSP slice capability, accepting I/O redesign effort

Compared with XC2S200-5FG456C, XC2S150-5FG456C offers identical footprint and timing but reduced logic resources, while XC3S200-4PQ208C provides architectural improvements at the cost of package and voltage compatibility - making XC2S200-5FG456C optimal for legacy-compatible, 3.3 V–based upgrades.

Availability

XC2S200-5FG456C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging interface applications requiring stable component supply and long-term obsolescence management.

Supply support for XC2S200-5FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022, inheriting its FPGA product portfolio including the Spartan family. AMD focuses on adaptive computing solutions for data center, AI, and embedded markets.

The Spartan-II product line was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with predictable timing and mature toolchain support - targeting industrial automation and communications infrastructure.

FAQ

What configuration modes does the XC2S200-5FG456C support?

The XC2S200-5FG456C supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. These allow flexible initialization from SPI PROM, microcontroller-controlled parallel loading, or boundary-scan programming. The XC2S200-5FG456C requires an external configuration PROM or host processor to load its SRAM-based logic fabric at power-up.

Does the XC2S200-5FG456C include a built-in clock management unit?

No, the XC2S200-5FG456C does not include a Digital Clock Manager (DCM). Clock multiplication, division, or phase shifting must be implemented externally using discrete PLLs or within logic fabric using counter-based techniques. This distinguishes it from later Spartan families where DCMs became standard - the XC2S200-5FG456C relies on global clock buffers only.

What is the maximum operating temperature range for the XC2S200-5FG456C?

The XC2S200-5FG456C is rated for commercial temperature operation from 0 °C to +70 °C ambient. Its thermal performance depends on PCB copper area, airflow, and power dissipation - typical dynamic power at 50 MHz toggle rate is ~1.2 W. The XC2S200-5FG456C datasheet specifies derating curves above 60 °C case temperature.

Can the XC2S200-5FG456C interface directly with 5 V TTL logic?

No, the XC2S200-5FG456C I/O pins are not 5 V tolerant. They operate at 3.3 V LVTTL/LVCMOS levels and sustain permanent damage if exposed to 5 V inputs. External level translators or resistive dividers are required for interfacing with legacy 5 V systems. The XC2S200-5FG456C specification strictly limits input voltage to VCCO + 0.5 V max.

Is the XC2S200-5FG456C still in active production?

The XC2S200-5FG456C was discontinued by Xilinx (now AMD) in 2011. It remains available through authorized distributors and Aetrix Electronics' extended-life inventory program with full traceability and extended warranty. The XC2S200-5FG456C is supported under AMD's legacy FPGA lifecycle policy for obsolescence mitigation.

XC2S200-5FG456C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-II
Package/Case:
456-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
284
Number of Gates:
200000
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
456-FBGA (23x23)

XC2S200-5FG456C FAQ

1.How can I place an order for XC2S200-5FG456C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2S200-5FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2S200-5FG456C reliable?

The price and inventory of XC2S200-5FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S200-5FG456C is usually 5 days.

3.What payment methods are accepted for XC2S200-5FG456C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S200-5FG456C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2S200-5FG456C?

XC2S200-5FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2S200-5FG456C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2S200-5FG456C?

For technical support, including XC2S200-5FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S200-5FG456C requirements.

6.How does Aetrix verify that XC2S200-5FG456C is sourced from the original manufacturer or authorized distributors?

All XC2S200-5FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S200-5FG456C meets industry standards.

7.What is the process for return or replacement of XC2S200-5FG456C?

All XC2S200-5FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S200-5FG456C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2S200-5FG456C part is unused and in its original packaging.

Return procedure for XC2S200-5FG456C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2S200-5FG456C Tags

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