AMD XC2S200-5FG456I

Overview

XC2S200-5FG456I from AMD (formerly Xilinx) is a Spartan-II family FPGA with 200,000 system gates, 1728 logic cells, and 112 I/O pins in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 5 ns maximum input-to-output delay and supports 3.3 V I/O with 2.5 V internal core voltage, used in industrial control logic and reconfigurable digital signal processing.

For engineers reviewing the XC2S200-5FG456I datasheet, pinout, applications, or equivalent options, key selection criteria include logic cell count, I/O voltage compatibility, timing grade (-5 speed grade), FBGA thermal and routing constraints, and legacy configuration interface support.

Technical Context

The XC2S200-5FG456I implements configurable logic blocks (CLBs) with dual 4-input LUTs and flip-flops per slice, distributed RAM up to 128 bits per CLB, and dedicated carry logic for high-speed arithmetic. It supports SelectMAP and serial PROM configuration modes via dedicated configuration pins.

It features eight global clock buffers, DLL-based clock deskew, and I/O standards including LVTTL, LVCMOS, and PCI-compliant 3.3 V signaling. No on-chip oscillator or analog functions are integrated.

Key Specifications

Pinout & Package

XC2S200-5FG456I uses a 456-ball fine-pitch BGA (FG456) package with 112 user I/Os, 8 global clocks, configuration pins (INIT_B, PROGRAM_B, DONE), and dedicated JTAG boundary-scan pins (TCK/TMS/TDI/TDO). Power and ground balls are distributed across multiple banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic density and industrial reconfiguration applications.

Compared with XC2S200-5FG456I, XCV300-4BG432C offers greater capacity and performance at higher cost and power, while XC2S150-5FG456I provides identical packaging and timing with reduced gate count-making it a direct resource-downgraded alternative within the same footprint.

Availability

XC2S200-5FG456I is available at Aetrix Electronics and suitable for industrial automation, avionics data acquisition, and reconfigurable test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2S200-5FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains legacy Spartan-II product support, documentation, and obsolescence management for industrial and aerospace customers.

The Spartan-II family was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with predictable timing and mature toolchain support (ISE 14.7).

FAQ

What is the maximum operating frequency supported by the XC2S200-5FG456I?

The XC2S200-5FG456I has a -5 speed grade specifying 5 ns maximum input-to-output delay (Tio) under defined conditions. While maximum system clock frequency depends on design topology, synthesis, and place-and-route, typical synchronous logic paths achieve 160–200 MHz in well-optimized implementations. The device includes eight global clock buffers and DLL-based deskew to support high-frequency timing closure.

Does the XC2S200-5FG456I support JTAG boundary-scan testing?

Yes, the XC2S200-5FG456I fully supports IEEE 1149.1 JTAG boundary-scan via dedicated TCK, TMS, TDI, and TDO pins. This enables in-circuit testing, programming, and debugging without requiring additional test fixtures. The JTAG chain can be cascaded with other compliant devices, and the XC2S200-5FG456I's BSDL file is available from AMD's legacy Xilinx documentation portal.

Can the XC2S200-5FG456I be configured using a serial PROM?

Yes, the XC2S200-5FG456I supports master serial configuration mode using industry-standard 4-Mbit or 8-Mbit serial PROMs (e.g., XCF04S/XCF08S). Configuration occurs automatically on power-up when MODE pins are set to 001, and the DONE pin signals completion. This method is widely used for standalone, unattended boot in industrial controllers.

Is the XC2S200-5FG456I RoHS compliant?

Yes, the XC2S200-5FG456I is RoHS-6 compliant (lead-free finish, exempted Pb in die attach and solder balls per EU Directive 2011/65/EU Annex III). The FG456 package uses matte tin over nickel underplate on solder balls, and full compliance documentation-including material declarations and test reports-is available through AMD's Product Change Notification (PCN) archives.

What development tools are required to program the XC2S200-5FG456I?

The XC2S200-5FG456I is supported exclusively by Xilinx ISE Design Suite 14.7-the final and only officially qualified version for Spartan-II devices. Synthesis, simulation, place-and-route, and bitstream generation require this legacy toolset. Programming is performed via iMPACT software using JTAG or SelectMAP interfaces; newer Vivado tools do not support this architecture.