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AMD XC2S200-5FGG256C
- Part No.:
- XC2S200-5FGG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2S200-5FGG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,026
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Product details
Overview
XC2S200-5FGG256C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 200,000 system gates, 1728 logic cells, and 224 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 5 ns maximum input-to-output delay and supports 3.3 V I/O with 2.5 V core voltage, commonly used in industrial control logic and digital signal preprocessing.
For engineers reviewing the XC2S200-5FGG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, logic cell density, speed grade (-5), FBGA256 thermal and routing constraints, and legacy configuration interface compatibility.
Technical Context
The XC2S200-5FGG256C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM up to 56 kbits, and dedicated carry logic for arithmetic. It supports SelectMAP and serial PROM configuration modes via JTAG boundary-scan test access.
Its architecture includes global clock buffers, DLL-based clock management (no PLL), and programmable I/O standards including LVTTL, LVCMOS, and PCI-compliant 3.3 V signaling - all constrained by the -5 speed grade timing specification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 200,000 system gates; determines maximum combinational/sequential logic complexity supported |
| Logic Cells | 1,728 CLBs; each contains two 4-LUTs + 2 registers, defining routing and pipelining capability |
| I/O Pins | 224 user-configurable I/Os; enables high-pin-count peripheral interfacing in compact PCB layout |
| Speed Grade | -5; guarantees 5 ns maximum Tio (input-to-output delay) under specified conditions |
| Core Voltage | 2.5 V ± 0.1 V; requires dedicated low-noise core regulator, not shared with I/O supply |
| I/O Voltage | 3.3 V tolerant; supports direct connection to LVTTL/LVCMOS33 buses without level shifters |
| Package | 256-pin FBGA (Fine-Pitch BGA); 17 × 17 mm body, 1.0 mm ball pitch, thermal pad optional |
Pinout & Package
XC2S200-5FGG256C uses a 256-ball fine-pitch BGA (FGG256) with 16 I/O banks, power/ground ball distribution optimized for signal integrity and thermal dissipation. Pin functions are bank- and voltage-referenced; configuration pins (e.g., PROGRAM_B, INIT_B, DONE) are dedicated and non-reconfigurable.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-low configuration initiator | Asserting low reloads bitstream from external PROM; asynchronous, no timing dependency on clock |
| INIT_B | Open-drain status indicator | Drives low during configuration; high indicates successful CRC check and readiness |
| DONE | Open-drain configuration completion | High-Z until configuration ends, then pulled high externally; used for system boot sequencing |
| CCLK | Configuration clock input | Driven externally during SelectMAP mode; max 50 MHz, defines bitstream load rate |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1 compliant; enables programming, debugging, and interconnect testing |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated carry chain | Enables high-speed arithmetic (e.g., counters, adders) without consuming general routing resources |
| Distributed RAM | Up to 16 bits per CLB; usable as fast synchronous SRAM or shift registers without block RAM overhead |
| SelectMAP interface | Parallel 8-/16-bit configuration mode supporting fast loading from microcontroller or flash memory |
| Global clock networks | Four low-skew global clocks with enable/disable control; critical for synchronous design timing closure |
| LVCMOS33/LVTTL I/O support | Eliminates need for external level translators when interfacing with common microcontrollers and peripherals |
Applications
| Industrial Motion Control | Digital Video Preprocessing |
|---|---|
Use Scenario: Real-time interpolation and PWM generation for multi-axis servo drives. IC Role / Device Role / Timing Role: Configurable logic engine implementing closed-loop position calculation and timing-critical pulse output. Use Value: 5 ns speed grade ensures sub-microsecond response latency between encoder input and motor phase update. | Use Scenario: Pixel reordering, color space conversion, and line buffering prior to video DAC. IC Role / Device Role / Timing Role: Glue logic and pipeline stage between image sensor interface and display controller. Use Value: 224 I/Os accommodate parallel 16-bit RGB data bus plus sync signals and local frame buffer address lines. |
| Legacy Bus Interface Bridge | Test Equipment Pattern Generation |
Use Scenario: Translating ISA or PC/104 control signals to modern microcontroller peripherals. IC Role / Device Role / Timing Role: Protocol-aware bridge mapping legacy strobes and address latches to synchronous APB/AHB handshakes. Use Value: Configurable I/O banks allow mixed 5 V-tolerant and 3.3 V signaling required for backward compatibility. | Use Scenario: Generating deterministic stimulus waveforms for IC functional validation. IC Role / Device Role / Timing Role: High-repetition-rate pattern sequencer with precise edge placement and variable depth FIFO. Use Value: Distributed RAM and carry logic enable 100+ MHz deterministic waveform synthesis without external memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-5FGG256C | 150K gate capacity, 1368 CLBs, otherwise identical package and speed grade | Lower logic density limits complex state machines or larger datapaths | Choose when design fits within reduced resource budget and cost sensitivity outweighs future scalability |
| XC3S200-4PQ240C | Spartan-3 family, 200K gates, -4 speed grade, 240-pin PQFP package, 1.2 V core | Higher I/O drive strength, enhanced DCM clock management, but larger footprint and different thermal profile | Prefer for new designs requiring better clock synthesis or migration path; not drop-in compatible due to package and voltage differences |
Compared with XC2S200-5FGG256C, XC2S150-5FGG256C offers cost reduction at logic density trade-off, while XC3S200-4PQ240C provides architectural upgrades at the expense of board redesign and power delivery changes.
Availability
XC2S200-5FGG256C is available at Aetrix Electronics and suitable for industrial motion control, digital video preprocessing, and legacy bus interface applications requiring stable component supply across extended production lifecycles.
Supply support for XC2S200-5FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools.
The Spartan-II product line was designed for cost-sensitive, high-volume embedded logic applications where predictable timing, mature toolchain support, and long-term availability were prioritized over advanced features.
FAQ
What configuration methods does XC2S200-5FGG256C support?
XC2S200-5FGG256C supports Master Serial (via PROM), Slave Serial, Slave Parallel (SelectMAP), and JTAG modes. The XC2S200-5FGG256C requires external configuration memory unless using JTAG for programming; SelectMAP allows microcontroller-initiated reconfiguration in-system.
Is XC2S200-5FGG256C RoHS compliant?
Yes, XC2S200-5FGG256C is RoHS-6 compliant (lead-free finish, exempted Cd/Hg/Pb/Cr⁶⁺/PBDE per EU Directive 2011/65/EU). The FG256 package uses matte tin over nickel underplate, verified per JEDEC J-STD-609A Class 2a.
Does XC2S200-5FGG256C include internal oscillators or PLLs?
No, XC2S200-5FGG256C does not contain PLLs or internal oscillators. It integrates Delay-Locked Loops (DLLs) only for input/output clock deskew - not for frequency synthesis or jitter reduction. External clock sources are required for all timing domains.
What is the maximum operating junction temperature for XC2S200-5FGG256C?
The maximum operating junction temperature for XC2S200-5FGG256C is 85 °C under continuous operation. Thermal design must ensure θJA ≤ 35 °C/W for the FG256 package in still-air conditions, per Xilinx DS001 v2.5 specification.
Can XC2S200-5FGG256C be programmed in-system via JTAG after soldering?
Yes, XC2S200-5FGG256C supports IEEE 1149.1 JTAG boundary-scan for in-system programming, debugging, and interconnect testing. The XC2S200-5FGG256C requires TCK, TMS, TDI, TDO, and TRTST pins accessible on the PCB; no additional power or reset sequencing is needed.
XC2S200-5FGG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 57344
- Number of I/O:
- 176
- Number of Gates:
- 200000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2S200-5FGG256C FAQ
1.How can I place an order for XC2S200-5FGG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S200-5FGG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S200-5FGG256C reliable?
The price and inventory of XC2S200-5FGG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S200-5FGG256C is usually 5 days.
3.What payment methods are accepted for XC2S200-5FGG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S200-5FGG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S200-5FGG256C?
XC2S200-5FGG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S200-5FGG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S200-5FGG256C?
For technical support, including XC2S200-5FGG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S200-5FGG256C requirements.
6.How does Aetrix verify that XC2S200-5FGG256C is sourced from the original manufacturer or authorized distributors?
All XC2S200-5FGG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S200-5FGG256C meets industry standards.
7.What is the process for return or replacement of XC2S200-5FGG256C?
All XC2S200-5FGG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S200-5FGG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S200-5FGG256C part is unused and in its original packaging.
Return procedure for XC2S200-5FGG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2S200-5FGG256C Tags
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