AMD XC2S200-5FGG256I

Overview

XC2S200-5FGG256I from AMD (formerly Xilinx) is a Spartan-II family FPGA with 200,000 system gates, 1728 logic cells, and 112 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -5 speed grade (5 ns CLB delay), supports 3.3 V I/O, and targets cost-sensitive industrial control and communication interface logic.

For engineers reviewing the XC2S200-5FGG256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, CLB delay, supply voltage compatibility, configuration mode support (Master Serial, Slave Parallel), and thermal performance in compact PCB layouts.

Technical Context

The XC2S200-5FGG256I implements configurable logic blocks (CLBs) with dual 4-input LUTs and flip-flops per slice, distributed RAM up to 72 Kb, and dedicated carry logic for arithmetic functions. It supports SelectMAP, JTAG, and serial PROM configuration modes.

It features 112 user I/Os with programmable slew rate, drive strength (2/4/8/16 mA), and input thresholds (LVTTL/LVCMOS33). Internal global clock networks distribute up to four primary clocks with low skew across the device.

Key Specifications

Pinout & Package

XC2S200-5FGG256I uses a 256-ball Fine-Pitch BGA (FGG) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and thermal pad on underside for enhanced heat dissipation in industrial environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic applications.

Compared with XC2S200-5FGG256I, XC2S150-5FGG256I offers identical form factor and timing but reduced capacity, while XC3S200-4FGG320C delivers architectural upgrades at the cost of board redesign and power delivery changes.

Availability

XC2S200-5FGG256I is available at Aetrix Electronics and suitable for industrial automation, communications infrastructure, and embedded control applications requiring stable component supply and long-term obsolescence management.

Supply support for XC2S200-5FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing solutions including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.

The Spartan-II product line was designed for cost-optimized, high-volume logic replacement in industrial and communications systems where predictable timing and mature toolchain support are critical.

FAQ

What is the maximum operating frequency supported by XC2S200-5FGG256I?

The XC2S200-5FGG256I has a -5 speed grade specifying 5 ns CLB propagation delay, enabling a maximum system clock frequency of approximately 160 MHz in typical place-and-route conditions. Actual achievable frequency depends on design complexity, routing congestion, and I/O timing constraints. The XC2S200-5FGG256I datasheet provides detailed timing analysis methods using Xilinx ISE tools.

Does XC2S200-5FGG256I support JTAG boundary-scan testing?

Yes, XC2S200-5FGG256I fully supports IEEE 1149.1 JTAG boundary-scan for device programming, debugging, and interconnect testing. The TDI, TDO, TMS, and TCK pins are dedicated and compliant with standard JTAG protocols. This capability is integral to the XC2S200-5FGG256I configuration architecture and enables in-system verification without requiring external programming hardware.

What configuration memory options are compatible with XC2S200-5FGG256I?

XC2S200-5FGG256I supports Master Serial configuration using Xilinx XC18V00-series PROMs (e.g., XC18V02), Slave Parallel mode with microcontrollers, and JTAG-based programming. It does not integrate on-chip configuration memory; external non-volatile memory is required. The XC2S200-5FGG256I configuration interface is electrically and logically compatible only with Xilinx-certified PROMs and controllers meeting the Spartan-II specification.

Is XC2S200-5FGG256I RoHS compliant?

Yes, XC2S200-5FGG256I is manufactured in accordance with RoHS Directive 2011/65/EU and carries the "i" suffix indicating lead-free, halogen-free packaging. The FGG256 package uses matte tin finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in the official XC2S200-5FGG256I product change notices.

Can XC2S200-5FGG256I operate with 2.5 V core and 3.3 V I/O simultaneously?

Yes, XC2S200-5FGG256I requires separate 2.5 V core supply (VCCINT) and 3.3 V I/O supply (VCCO) rails. This dual-voltage architecture allows internal logic to run at lower power while maintaining compatibility with standard 3.3 V peripheral interfaces. Proper sequencing-VCCINT before VCCO-is required during power-up to ensure reliable configuration of the XC2S200-5FGG256I.