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AMD XC2S200-5FGG456C
- Part No.:
- XC2S200-5FGG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2S200-5FGG456C.pdf
- Description:
- IC FPGA 284 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,180
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Product details
Overview
XC2S200-5FGG456C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 200,000 system gates, 1728 logic cells, and 128 I/O pins in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 5 ns CLB delay and supports 3.3 V I/O with 2.5 V core voltage, commonly used in industrial control logic and digital signal preprocessing.
For engineers reviewing the XC2S200-5FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include CLB count, I/O voltage compatibility, configuration interface type (JTAG/Slave Serial), and supported device programming modes.
Technical Context
The XC2S200-5FGG456C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM up to 56 kbits, and dedicated carry logic for arithmetic functions. It supports SelectI/O standards including LVTTL, LVCMOS, and PCI-compliant signaling.
Configuration is performed via JTAG boundary-scan or Slave Serial mode using external PROM; internal startup circuitry manages power-on reset and configuration clock generation. The device lacks integrated PLLs or block RAM beyond distributed RAM resources.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 200,000 system gates - defines maximum combinational logic density for gate-equivalent design mapping |
| CLB Count | 1,728 CLBs - determines parallel logic execution capability and routing resource availability |
| I/O Pins | 128 user I/Os - supports medium-complexity peripheral interfacing with banked voltage assignment |
| Core Voltage | 2.5 V ± 0.1 V - requires dedicated core regulator; impacts static power consumption and thermal profile |
| I/O Voltage | 3.3 V LVTTL/LVCMOS - enables direct connection to legacy microcontrollers and bus interfaces without level shifters |
| Max I/O Speed | 160 MHz output, 125 MHz input - constrains high-speed data capture and transmission timing margins |
| Configuration Mode | JTAG & Slave Serial - allows in-system programming and field reconfiguration via standard test access port |
Pinout & Package
XC2S200-5FGG456C uses a 456-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 array, 1.0 mm ball pitch, and thermal pad on underside. Pinout includes dedicated configuration pins (INIT_B, PROGRAM_B, DONE), JTAG TDI/TDO/TCK/TMS, dual-purpose I/O banks, and global clock inputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-low configuration initiator | Resets configuration logic and clears SRAM contents when asserted |
| INIT_B | Active-low initialization status | Indicates device readiness to accept configuration data after power-up |
| DONE | Configuration completion flag | Drives high when bitstream loading completes successfully |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables IEEE 1149.1-compliant testing, debugging, and ISP |
| CLK0–CLK3 | Global clock inputs | Drive low-skew clock networks to all CLBs and I/Os |
| I/O[0]–I/O[127] | Configurable bidirectional I/O | Supports input, output, or tristate operation per bank with selectable drive strength |
Key Features
| Feature | Design Value |
|---|---|
| System-gate scalability | 200K gates enable cost-optimized implementation of medium-complexity state machines and glue logic |
| Distributed RAM | 56 kbits of fast, flexible RAM built into CLBs - eliminates need for external SRAM in small buffer applications |
| SelectI/O technology | Per-bank voltage support (3.3 V only) ensures interoperability with mixed-voltage systems |
| Configuration flexibility | Multiple modes (JTAG, Slave Serial, Master Serial) simplify integration into diverse programming workflows |
| Low-power core | 2.5 V core reduces dynamic power vs. 3.3 V predecessors - critical for thermally constrained enclosures |
Applications
| Industrial Motion Control | Digital Video Interface Bridge |
|---|---|
Use Scenario: Real-time PWM generation and encoder feedback processing in servo drives. IC Role / Device Role / Timing Role: Configurable logic fabric implementing closed-loop timing-critical control paths with sub-microsecond latency. Use Value: 128 I/Os and deterministic CLB timing allow simultaneous management of 4-axis motor control with position capture and fault monitoring. | Use Scenario: Converting parallel RGB video data to serialized LVDS streams for panel driving. IC Role / Device Role / Timing Role: Synchronous data formatter and clock domain crossing bridge between pixel clock and source clock domains. Use Value: Distributed RAM buffers incoming pixel data while CLBs implement timing alignment and serialization logic without external FIFOs. |
| Automated Test Equipment (ATE) | Communications Protocol Converter |
Use Scenario: Generating precise stimulus waveforms and capturing response signatures across multiple DUT channels. IC Role / Device Role / Timing Role: Reconfigurable pattern generator and comparator engine synchronized to system reference clock. Use Value: 160 MHz I/O speed and 5 ns CLB delay ensure nanosecond-level waveform edge placement accuracy required for high-speed digital test. | Use Scenario: Translating UART-based sensor data into SPI packets for MCU aggregation. IC Role / Device Role / Timing Role: Asynchronous protocol parser and packet assembler with baud-rate independent framing logic. Use Value: Per-bank I/O voltage support allows direct connection to both 3.3 V sensors and 3.3 V host MCUs without level-shifting components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-5FGG456C | 150K gates, 1368 CLBs, same package and I/O count | Suitable for smaller logic designs with lower gate utilization margin | Select when design fits within 150K gate budget to reduce cost and power |
| XC3S200-4PQ208C | Spartan-3 family, 200K gates, 144 I/Os, PQFP-208 package, 1.2 V core | Requires PCB redesign due to different package and voltage; adds enhanced block RAM and DLL | Choose for new designs needing higher integration density and improved clock management |
Compared with XC2S200-5FGG456C, XC2S150-5FGG456C offers identical footprint and I/O but reduced logic capacity, while XC3S200-4PQ208C provides advanced features at the cost of board-level incompatibility and higher complexity.
Availability
XC2S200-5FGG456C is available at Aetrix Electronics and suitable for industrial motion control, digital video interface bridging, and automated test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC2S200-5FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-II product support for industrial and aerospace customers requiring long-term availability.
The Spartan-II family was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with predictable timing and mature toolchain support.
FAQ
What is the core voltage requirement for XC2S200-5FGG456C?
The XC2S200-5FGG456C requires a regulated 2.5 V ± 0.1 V core supply. This voltage powers the internal logic fabric and CLBs; deviation beyond tolerance risks timing violations or configuration loss. External DC-DC converters with tight regulation and low ripple are recommended. The XC2S200-5FGG456C does not support core voltage scaling or adaptive voltage control.
Does XC2S200-5FGG456C support JTAG boundary-scan testing?
Yes, XC2S200-5FGG456C fully supports IEEE 1149.1 JTAG boundary-scan for testing and in-system programming. Its TDI, TDO, TCK, and TMS pins are dedicated and electrically compliant. The XC2S200-5FGG456C implements mandatory boundary-scan instructions including SAMPLE/PRELOAD, EXTEST, and BYPASS, enabling PCB interconnect verification prior to configuration.
Can XC2S200-5FGG456C be configured using an external serial PROM?
Yes, XC2S200-5FGG456C supports Slave Serial configuration mode, allowing boot from industry-standard 4-pin serial PROMs (e.g., Xilinx XC18V02). The XC2S200-5FGG456C asserts INIT_B and monitors DONE to coordinate loading; no FPGA-side firmware is required. Configuration bitstream must match the exact device ID and package variant.
What I/O standards are supported by XC2S200-5FGG456C?
XC2S200-5FGG456C supports LVTTL, LVCMOS33, and PCI-compliant I/O standards on all 128 user pins. Each I/O bank is independently powered at 3.3 V, and drive strength is configurable per pin (2 mA to 24 mA). The XC2S200-5FGG456C does not support differential standards like LVDS or RSDS, nor 1.8 V or 2.5 V I/O voltages.
Is XC2S200-5FGG456C still in active production?
No, XC2S200-5FGG456C is discontinued by AMD/Xilinx and classified as legacy. Aetrix Electronics maintains inventory of original-tray, traceable units with full lot documentation. The XC2S200-5FGG456C remains available for repair, replacement, and long-lifecycle industrial programs under controlled distribution terms.
XC2S200-5FGG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 57344
- Number of I/O:
- 284
- Number of Gates:
- 200000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2S200-5FGG456C FAQ
1.How can I place an order for XC2S200-5FGG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S200-5FGG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S200-5FGG456C reliable?
The price and inventory of XC2S200-5FGG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S200-5FGG456C is usually 5 days.
3.What payment methods are accepted for XC2S200-5FGG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S200-5FGG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S200-5FGG456C?
XC2S200-5FGG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S200-5FGG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S200-5FGG456C?
For technical support, including XC2S200-5FGG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S200-5FGG456C requirements.
6.How does Aetrix verify that XC2S200-5FGG456C is sourced from the original manufacturer or authorized distributors?
All XC2S200-5FGG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S200-5FGG456C meets industry standards.
7.What is the process for return or replacement of XC2S200-5FGG456C?
All XC2S200-5FGG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S200-5FGG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S200-5FGG456C part is unused and in its original packaging.
Return procedure for XC2S200-5FGG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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