AMD XC2S200-5FGG456I

Overview

XC2S200-5FGG456I from AMD (formerly Xilinx) is a Spartan-II family FPGA with 200,000 system gates, 1728 logic cells, and 176 I/O pins in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 5 ns maximum input-to-output delay and supports 3.3 V I/O with 2.5 V core voltage, commonly used in industrial control logic and digital signal preprocessing.

For engineers reviewing the XC2S200-5FGG456I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, core voltage tolerance, timing performance under 5 ns propagation, and FBGA456 thermal and routing constraints.

Technical Context

The XC2S200-5FGG456I implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM up to 56 kbits, and dedicated carry logic for high-speed arithmetic. It supports SelectIO standards including LVTTL, LVCMOS, and PCI-compatible signaling.

Configuration is performed via serial PROM or boundary-scan (JTAG), and it includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty-cycle correction-enabling precise timing control without external PLLs.

Key Specifications

Pinout & Package

XC2S200-5FGG456I is housed in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package with 29 × 29 ball array, 1.0 mm pitch, and 27 mm × 27 mm body size. Thermal pad on underside requires solder paste stencil design per Xilinx S001-2 specification.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV300-4BG432C and XC2S150-5PQ208I, the XC2S200-5FGG456I uniquely balances 176 I/O, on-die DCMs, and FBGA456 routing density-making it optimal for industrial and medical systems requiring deterministic timing and compact layout without external clock ICs.

Availability

XC2S200-5FGG456I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term lifecycle support.

Supply support for XC2S200-5FGG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains full support for legacy Spartan-II devices. Xilinx pioneered programmable logic architecture and introduced the first widely adopted FPGA families for embedded control.

The Spartan-II product line was designed for cost-sensitive, high-volume applications requiring predictable timing, robust I/O, and integrated clock management-targeting industrial automation and medical instrumentation markets.

FAQ

What is the maximum operating frequency of the XC2S200-5FGG456I?

The XC2S200-5FGG456I supports internal logic operation up to 200 MHz under typical conditions, enabled by its 5 ns input-to-output propagation delay and two Digital Clock Managers (DCMs). Actual achievable frequency depends on design placement, routing, and clock domain structure. The XC2S200-5FGG456I datasheet specifies worst-case timing for CLB-to-CLB paths at 166 MHz for fully registered designs.

Does the XC2S200-5FGG456I support JTAG boundary-scan programming?

Yes, the XC2S200-5FGG456I fully complies with IEEE 1149.1 and supports JTAG boundary-scan for configuration, debugging, and in-system testing. Pins TCK, TMS, TDI, and TDO are assigned to dedicated balls (P1, P2, N1, N2) and require proper pull-up/pull-down biasing per Xilinx DS001 specification. The XC2S200-5FGG456I can be programmed in-circuit without removal from the PCB.

Can the XC2S200-5FGG456I operate with mixed I/O voltages on different banks?

Yes, the XC2S200-5FGG456I supports independent VCCO per I/O bank, allowing simultaneous 3.3 V LVTTL and 2.5 V LVCMOS signaling on separate banks. Each bank's VCCO must match the connected peripheral's I/O voltage; mixing voltages within a single bank will damage the XC2S200-5FGG456I or cause functional failure.

What configuration memory options are compatible with the XC2S200-5FGG456I?

The XC2S200-5FGG456I supports master serial, slave serial, and JTAG configuration modes. Compatible non-volatile memory includes Xilinx XC18V02 (2 Mbit) and XC18V04 (4 Mbit) PROMs, as well as third-party SPI Flash devices configured via bitstream compression. Configuration time is typically 120 ms for a full 1.2 Mbit bitstream loaded via master serial mode.

Is thermal management required for the XC2S200-5FGG456I in continuous operation?

Yes, the XC2S200-5FGG456I's 456-ball FBGA package requires thermal pad soldering to a copper pour for effective heat dissipation. Under full utilization at 85°C ambient, junction temperature exceeds 100°C without thermal vias. Xilinx recommends ≥6 thermal vias under the thermal pad and a minimum 25 mm² copper area connected to internal ground planes. This thermal design is mandatory for sustained operation of the XC2S200-5FGG456I.