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AMD XC2S200-6FG256C
- Part No.:
- XC2S200-6FG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2S200-6FG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,234
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Product details
Overview
XC2S200-6FG256C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 200,000 system gates, 1728 logic cells, and 176 user I/Os in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -6 speed grade (6 ns CLB delay), supports 3.3 V I/O, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC2S200-6FG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, speed grade timing closure, 3.3 V LVTTL/LVCMOS compatibility, and legacy configuration interface support via JTAG or master serial mode.
Technical Context
The XC2S200-6FG256C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM, and dedicated carry logic for arithmetic. It integrates global clock buffers, DLL-based clock management, and programmable I/O standards including LVTTL, LVCMOS, and PCI.
Configuration is performed via IEEE 1149.1 JTAG boundary-scan or serial PROM using SelectMAP or slave serial modes. The device lacks on-chip flash and requires external configuration memory, supporting both synchronous and asynchronous loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 200,000 system gates - defines maximum combinational logic density for gate-equivalent synthesis |
| Logic Cells | 1,728 CLBs - each contains two function generators and two storage elements for synchronous logic |
| User I/O Pins | 176 - supports parallel bus interfaces, multi-channel sensor aggregation, or peripheral bridging |
| Speed Grade | -6 - guarantees 6 ns CLB propagation delay; sets maximum operating frequency for registered paths |
| I/O Standard | 3.3 V LVTTL/LVCMOS - compatible with common microcontrollers, ASICs, and legacy peripherals |
| Package | 256-pin FBGA (Fine-Pitch BGA) - 17 × 17 mm body, 1.0 mm ball pitch, requires controlled-impedance PCB routing |
Pinout & Package
XC2S200-6FG256C uses a 256-ball fine-pitch BGA (FG256) package with 16 × 16 array plus corner balls omitted. Pin functions are defined by configuration mode and I/O bank voltage settings.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TCK, TMS, TDI, TDO | JTAG Test Access Port | Enables boundary-scan testing, in-system programming, and debug access without dedicated programming hardware |
| PROGRAM_B | Active-Low Configuration Initiate | Pulls low to reset configuration logic and clear internal SRAM before reloading bitstream |
| DONE | Configuration Completion Indicator | Open-drain output signals successful bitstream load; must be pulled high externally to release I/Os |
| CCLK | Configuration Clock Input | Drives internal shift registers during master serial or SelectMAP configuration; sourced externally or internally |
| HSWAP_EN | Hot-Swap Enable Control | When tied high, enables weak pull-up on I/O pins during power-up to prevent floating states in hot-insertion systems |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Carry Chain | Enables high-speed arithmetic (e.g., counters, adders) without consuming general logic resources |
| Distributed RAM | Each CLB provides up to 16 bits of fast, dual-port synchronous RAM per slice |
| Global Clock Networks | Four low-skew global clock lines reduce timing uncertainty across large logic regions |
| PCI Compliance | Supports 33 MHz, 32-bit PCI signaling with proper termination and drive strength configuration |
| Multi-Voltage I/O Banks | Four independent banks allow mixed 3.3 V/2.5 V interfaces on same device for legacy-to-modern bridging |
Applications
| Industrial Motion Controller | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Real-time interpolation and PWM generation for stepper/servo drives in CNC machines. IC Role / Device Role / Timing Role: Configurable logic fabric executes deterministic motion profiles with sub-microsecond jitter control. Use Value: 176 I/Os route encoder feedback, limit switches, and motor enable signals; -6 speed grade ensures tight loop timing. | Use Scenario: Bridging ISA or VMEbus peripherals to modern microprocessor buses in test equipment. IC Role / Device Role / Timing Role: Protocol translator and address decoder implementing custom timing waveforms for asynchronous bus cycles. Use Value: Multi-voltage I/O banks interface 5 V ISA logic and 3.3 V host processors; distributed RAM stores protocol state tables. |
| Automotive Diagnostic Tool | Medical Imaging Data Formatter |
Use Scenario: OBD-II protocol parsing and CAN message filtering in handheld vehicle scanners. IC Role / Device Role / Timing Role: State-machine-based protocol engine synchronizing to 1–500 kbps UART/CAN bit rates with precise sample point alignment. Use Value: JTAG access enables field firmware updates; 3.3 V I/O matches automotive MCU voltage domains. | Use Scenario: Pixel reordering and compression pre-processing for ultrasound or MRI front-end modules. IC Role / Device Role / Timing Role: High-throughput data path orchestrator managing parallel ADC streams and DDR SDRAM buffering. Use Value: 200K gate capacity handles real-time pixel windowing and histogram calculation; FBGA package supports compact medical PCB layout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-6FG256C | 150K gates, 1368 CLBs, same package and speed grade | Lower logic density limits complex state machines or wide datapaths | Select when design fits within reduced resource budget and cost sensitivity outweighs headroom needs |
| XC3S200-4PQ208C | Spartan-3 family, 200K gates, 208-pin PQFP, -4 speed grade, enhanced DSP slices | Requires PCB redesign due to different package and pinout; supports higher clock frequencies in newer designs | Choose for new designs needing improved performance per watt or migration path beyond Spartan-II lifecycle |
Compared with XC2S200-6FG256C, XC2S150-6FG256C offers identical footprint and timing but less logic capacity, while XC3S200-4PQ208C delivers architectural upgrades at the cost of mechanical and electrical redesign.
Availability
XC2S200-6FG256C is available at Aetrix Electronics and suitable for industrial motion controllers, legacy bus interface bridges, and automotive diagnostic tools requiring stable component supply over extended production lifecycles.
Supply support for XC2S200-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now oversees the legacy Spartan product families. Xilinx originally developed these FPGAs for cost-optimized, high-volume embedded logic applications.
The Spartan-II family, including XC2S200-6FG256C, was designed for non-volatile configuration support, low-power operation, and seamless integration with microcontroller-based systems in industrial and communications equipment.
FAQ
What configuration methods does XC2S200-6FG256C support?
XC2S200-6FG256C supports IEEE 1149.1 JTAG boundary-scan, master serial PROM, slave serial, and SelectMAP parallel configuration. It requires external configuration memory and does not include on-chip flash. JTAG is used for debugging and programming, while serial PROM enables autonomous startup after power-on.
Does XC2S200-6FG256C support 5 V tolerant I/Os?
No, XC2S200-6FG256C does not support 5 V tolerant I/Os. Its I/O banks operate at 3.3 V LVTTL/LVCMOS levels only. Interfacing with 5 V logic requires external level-shifting circuitry or voltage translators to avoid damage or signal integrity issues.
What is the purpose of the HSWAP_EN pin on XC2S200-6FG256C?
The HSWAP_EN pin on XC2S200-6FG256C enables hot-swap I/O behavior. When asserted high, it activates weak pull-ups on all I/O pins during power-up, preventing floating states in backplane or modular systems where boards may be inserted under power.
Can XC2S200-6FG256C be used in new designs today?
XC2S200-6FG256C remains viable for sustaining legacy designs and applications with long-lifecycle requirements. While newer Spartan families offer enhanced features, XC2S200-6FG256C benefits from mature toolchains, stable silicon, and documented reliability in deployed industrial systems.
What thermal considerations apply to XC2S200-6FG256C in continuous operation?
XC2S200-6FG256C has a maximum junction temperature of 100°C and requires adequate PCB copper area and airflow for thermal dissipation. In typical industrial use with 30–50% logic utilization, case temperatures remain below 65°C with standard 2-layer board layout and no forced convection.
XC2S200-6FG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 57344
- Number of I/O:
- 176
- Number of Gates:
- 200000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2S200-6FG256C FAQ
1.How can I place an order for XC2S200-6FG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S200-6FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S200-6FG256C reliable?
The price and inventory of XC2S200-6FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S200-6FG256C is usually 5 days.
3.What payment methods are accepted for XC2S200-6FG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S200-6FG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S200-6FG256C?
XC2S200-6FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S200-6FG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S200-6FG256C?
For technical support, including XC2S200-6FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S200-6FG256C requirements.
6.How does Aetrix verify that XC2S200-6FG256C is sourced from the original manufacturer or authorized distributors?
All XC2S200-6FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S200-6FG256C meets industry standards.
7.What is the process for return or replacement of XC2S200-6FG256C?
All XC2S200-6FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S200-6FG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S200-6FG256C part is unused and in its original packaging.
Return procedure for XC2S200-6FG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2S200-6FG256C Tags
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