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AMD XC2S200-6FG456C
- Part No.:
- XC2S200-6FG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2S200-6FG456C.pdf
- Description:
- IC FPGA 284 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,457
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Product details
Overview
XC2S200-6FG456C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 200,000 system gates, 1728 logic cells, and a 6 ns CLB delay. It features 224 I/O pins in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at 3.3 V supply voltage. It is used in industrial control logic, digital video interface bridging, and reconfigurable peripheral controllers.
For engineers reviewing the XC2S200-6FG456C datasheet, pinout, applications, or equivalent options, key selection considerations include CLB count, I/O pin count, FBGA456 package compatibility, 3.3 V core voltage, and 6 ns speed grade for deterministic timing closure in cost-sensitive embedded logic designs.
Technical Context
The XC2S200-6FG456C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM, and dedicated carry logic. It supports SelectI/O standards including LVTTL, LVCMOS, PCI, and HSTL, with programmable slew rate and drive strength per bank.
Configuration is performed via slave serial, master serial, or boundary-scan (JTAG) modes using external PROM or processor-controlled loading. The device includes global clock buffers, DLL-based clock management, and internal oscillator for configuration state monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 200,000 system gates - defines maximum combinational logic density for gate-equivalent synthesis |
| CLB Count | 1728 CLBs - determines parallel logic resource availability for pipelined or parallel data paths |
| Speed Grade | -6 - guarantees 6 ns CLB propagation delay under worst-case commercial conditions (0–70°C, 3.3 V ±5%) |
| I/O Pins | 224 user I/O - supports high-pin-count interfaces such as parallel video, memory buses, or multi-channel sensor aggregation |
| Package | 456-pin FBGA (Fine-Pitch BGA) - requires 0.8 mm ball pitch PCB layout with controlled impedance routing |
| VCCINT | 3.3 V nominal core supply - mandates dedicated 3.3 V regulation and decoupling near power balls |
| Configuration Mode | Slave Serial / Master Serial / JTAG - enables flexible programming via microcontroller, PROM, or debug tool without boot ROM |
Pinout & Package
XC2S200-6FG456C is housed in a 456-ball fine-pitch BGA (FBGA) package with 224 user I/O pins distributed across 16 banks. Power and ground balls are arranged in dedicated rows/columns to support low-noise core and I/O supply separation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally and set to same voltage as driven interface (e.g., 3.3 V LVTTL) |
| A2 | CLK0 | Dedicated global clock input - routed through low-skew network to all CLBs and I/O registers |
| P1 | TCK | JTAG test clock - required for boundary-scan configuration and in-system debugging |
| R2 | PROGRAM_B | Active-low asynchronous reset - initiates configuration reload and clears internal state on falling edge |
| H1 | VCCINT | Core logic supply - supplies 3.3 V to CLBs, RAM, and interconnect; requires tight tolerance and low PSRR regulation |
| M3 | DONE | Open-drain configuration status output - pulled high externally to indicate successful bitstream load completion |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | Each CLB contains two 4-input LUTs + two flip-flops - enables efficient implementation of arithmetic, state machines, and pipeline stages |
| Distributed RAM | 16 bits per CLB - provides fast, low-latency register files without consuming dedicated block RAM resources |
| SelectI/O Technology | Per-bank voltage support (1.5–3.3 V) - allows mixed-voltage interfacing with legacy and modern peripherals on same device |
| Digital Clock Manager (DCM) | On-chip DLL-based clock synthesis - achieves 0 ps phase shift and jitter reduction for synchronous I/O timing alignment |
| Boundary-Scan Support | IEEE 1149.1 compliant - enables board-level testability, in-system programming, and debug visibility without physical probes |
Applications
| Industrial Motion Control | Digital Video Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM outputs. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID computation, pulse-width modulation generation, and safety interlock logic with sub-microsecond latency. Use Value: 6 ns speed grade ensures deterministic timing for 20 kHz PWM update cycles and synchronized axis motion without external timing ICs. | Use Scenario: Converting between HDMI source and LVDS display interface in kiosk or medical imaging displays. IC Role / Device Role / Timing Role: Reconfigurable serializer/deserializer handles pixel clock domain crossing, color space conversion, and embedded sync stripping/reinsertion. Use Value: 224 I/O pins support parallel 24-bit RGB + HS/VS/DE signals plus auxiliary I²C and SPI control channels in single-package solution. |
| Reconfigurable Peripheral Controller | Legacy Bus Protocol Adapter |
Use Scenario: Emulating custom ASIC behavior for field-upgradable sensor fusion modules in environmental monitoring systems. IC Role / Device Role / Timing Role: FPGA replaces fixed-function ASIC by implementing time-critical sensor sampling, filtering, and packetization logic in real time. Use Value: 1728 CLBs provide sufficient logic depth for cascaded FIR filters and CRC-16 generation while maintaining <10 µs end-to-end latency. | Use Scenario: Translating ISA bus transactions into SPI or UART commands for legacy industrial instrumentation integration. IC Role / Device Role / Timing Role: State-machine-based protocol bridge manages address decoding, strobe synchronization, and data buffering between asynchronous domains. Use Value: Per-bank SelectI/O support enables direct connection to 5 V ISA bus while driving 3.3 V microcontroller peripherals without level-shifter components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic replacement applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S150-6FG456C | 150,000 gates, 1368 CLBs - lower logic capacity and reduced I/O count (192 pins) | Suitable for smaller state machines or fewer parallel interfaces; insufficient for full video pixel pipelines | Select when design fits within 1368 CLBs and requires lower cost or power; verify I/O bank allocation matches interface voltage needs |
| XC3S200-4PQ208C | Spartan-3 family, 200,000 gates, 208-pin PQFP - no DLL, slower speed grade (-4), lower I/O count (141 pins) | Limited clock management and fewer I/Os restrict use in high-speed or multi-interface applications | Choose only if existing PQFP footprint and simpler clocking suffice; not suitable for jitter-sensitive video or servo timing |
Compared with XC2S200-6FG456C, XC2S150-6FG456C trades logic density for cost and power, while XC3S200-4PQ208C offers newer architecture but sacrifices clock precision and I/O scalability - both require redesign of PCB layout and timing constraints.
Availability
XC2S200-6FG456C is available at Aetrix Electronics and suitable for industrial motion control, digital video interface bridging, and reconfigurable peripheral controller applications requiring stable component supply and long-term obsolescence management.
Supply support for XC2S200-6FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-II product support for industrial and aerospace customers requiring long-lifecycle assurance.
The Spartan-II family was designed for cost-optimized, high-volume embedded logic replacement - targeting applications where ASIC development cost or lead time is prohibitive and reprogrammability adds field upgrade capability.
FAQ
What is the maximum operating frequency supported by XC2S200-6FG456C?
The XC2S200-6FG456C has a -6 speed grade specifying a 6 ns CLB propagation delay under worst-case commercial conditions. This enables reliable operation up to 160 MHz for registered logic paths with proper timing closure. Actual maximum frequency depends on design topology, placement, and routing; the device's Digital Clock Manager supports input frequencies up to 200 MHz with phase alignment.
Does XC2S200-6FG456C support JTAG boundary-scan testing?
Yes, XC2S200-6FG456C fully complies with IEEE 1149.1 boundary-scan standards. It supports TCK, TMS, TDI, TDO, and TRST pins for in-system programming, configuration verification, and PCB interconnect testing. The DONE pin confirms successful configuration load, and JTAG access remains available post-configuration for debug visibility.
Can XC2S200-6FG456C operate with mixed I/O voltages on different banks?
Yes, XC2S200-6FG456C supports SelectI/O technology with per-bank VCCO settings ranging from 1.5 V to 3.3 V. Each I/O bank can be independently powered to match connected peripherals - for example, Bank 0 at 3.3 V for LVTTL and Bank 2 at 2.5 V for SSTL. VREF pins per bank enable precise input threshold control for differential standards.
What configuration methods are supported by XC2S200-6FG456C?
XC2S200-6FG456C supports three primary configuration modes: Slave Serial (SPI-like bitstream load from microcontroller), Master Serial (autonomous load from external PROM), and JTAG (boundary-scan programming via Xilinx iMPACT or compatible tools). All modes use the same 1.5 Mbit bitstream format and retain configuration upon power cycle only when using nonvolatile PROM.
Is XC2S200-6FG456C still in active production or subject to obsolescence?
XC2S200-6FG456C is a mature Spartan-II device discontinued from new production by Xilinx (now AMD), but Aetrix Electronics maintains verified inventory with full traceability and extended lifecycle support. It remains available for legacy system repair, spares fulfillment, and long-term industrial deployments under controlled obsolescence management protocols.
XC2S200-6FG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 57344
- Number of I/O:
- 284
- Number of Gates:
- 200000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2S200-6FG456C FAQ
1.How can I place an order for XC2S200-6FG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S200-6FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S200-6FG456C reliable?
The price and inventory of XC2S200-6FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S200-6FG456C is usually 5 days.
3.What payment methods are accepted for XC2S200-6FG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S200-6FG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S200-6FG456C?
XC2S200-6FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S200-6FG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S200-6FG456C?
For technical support, including XC2S200-6FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S200-6FG456C requirements.
6.How does Aetrix verify that XC2S200-6FG456C is sourced from the original manufacturer or authorized distributors?
All XC2S200-6FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S200-6FG456C meets industry standards.
7.What is the process for return or replacement of XC2S200-6FG456C?
All XC2S200-6FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S200-6FG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S200-6FG456C part is unused and in its original packaging.
Return procedure for XC2S200-6FG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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