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AMD XC2S200-6FGG256C

Part No.:
XC2S200-6FGG256C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BGA
Datasheet:
AetrixXC2S200-6FGG256C.pdf
Description:
IC FPGA 176 I/O 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,616

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Product details

Overview

XC2S200-6FGG256C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 200,000 system gates, 1728 logic cells, 112 I/O pins, and a 6 ns CLB delay. It integrates configurable logic blocks, distributed RAM, and global clock networks for digital logic implementation in industrial control and communication interface designs.

For engineers reviewing the XC2S200-6FGG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, CLB propagation delay, system gate density, internal RAM capacity, and support for LVCMOS/LVTTL signaling standards.

Technical Context

The XC2S200-6FGG256C implements synchronous, register-rich logic using four-input LUTs and flip-flops per CLB. Its architecture supports distributed RAM (16-bit wide × 32 deep per CLB) and shift register functionality without external memory.

It features eight global clock buffers, DLL-based clock deskew, and programmable I/O standards including LVCMOS 3.3 V, LVTTL, and PCI-compliant 3.3 V operation. Configuration is performed via serial PROM or JTAG boundary-scan interface.

Key Specifications

ParameterValue and Actual Design Meaning
System Gates200,000 - indicates total combinational logic capacity equivalent to standard-cell ASIC gates
Logic Cells1,728 - each contains a 4-LUT and a flip-flop, defining maximum synchronous logic depth
I/O Pins112 - user-programmable bidirectional pins supporting multiple voltage standards
CLB Delay6 ns - maximum propagation delay through one Configurable Logic Block, critical for timing closure
Distributed RAM16 × 32 bits per CLB - enables small FIFOs, state machines, and lookup tables without block RAM
Global Clock Buffers8 - low-skew routing resources for synchronous design across large logic regions

Pinout & Package

XC2S200-6FGG256C is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 17 mm × 17 mm body size. The package supports reflow soldering and provides thermal and electrical performance suitable for industrial ambient conditions.

Pin/TerminalCircuit RoleDesign Meaning
GCK0–GCK7Global Clock InputConnect to dedicated low-skew clock distribution network for synchronous logic domains
IO_LxxProgrammable I/O BankEach bank supports independent VCCO voltage (3.3 V/2.5 V) and selectable I/O standard
M0–M2Configuration Mode SelectSet boot mode: Master Serial, Slave Serial, or JTAG boundary-scan configuration
TCK/TMS/TDI/TDOJTAG Boundary-Scan InterfaceEnable IEEE 1149.1-compliant programming, debugging, and interconnect testing
VCCINTCore Supply2.5 V ± 5 % required for internal logic and CLB operation
VCCOI/O Supply3.3 V for LVCMOS/LVTTL banks; must match selected I/O standard voltage

Key Features

FeatureDesign Value
Four-input LUT + flip-flop per CLBEnables efficient implementation of complex Boolean functions with registered outputs
Distributed RAM per CLBProvides up to 16 × 32-bit RAM without consuming dedicated block RAM resources
Eight global clock buffersReduces clock skew across large logic areas, improving setup/hold timing margins
LVCMOS/LVTTL I/O supportAllows direct interfacing with microcontrollers, ADCs, and legacy digital peripherals
JTAG boundary-scan complianceSupports in-system programming and board-level testability without external programmers

Applications

Industrial PLC I/O ModuleLegacy Bus Interface Adapter

Use Scenario: Real-time digital signal conditioning and protocol translation between field sensors and controller backplane.

IC Role / Device Role / Timing Role: FPGA fabric implements custom logic for pulse-width modulation, debounce filtering, and parallel-to-serial conversion.

Use Value: 112 I/O pins and 6 ns CLB delay enable deterministic response within 10 µs cycle time requirements.

Use Scenario: Bridging ISA or PCI bus signals to modern microcontroller peripherals in retro-computing or test equipment upgrades.

IC Role / Device Role / Timing Role: Reconfigurable glue logic handles address decoding, strobe synchronization, and data width conversion.

Use Value: LVCMOS 3.3 V I/O compatibility and 8 global clocks ensure reliable timing alignment with asynchronous bus cycles.

Communications Protocol ConverterMotor Control Logic Unit

Use Scenario: Translating RS-485 Modbus frames into SPI packets for embedded gateway SoCs.

IC Role / Device Role / Timing Role: State machine-driven UART receiver/transmitter with CRC calculation and packet framing logic.

Use Value: Distributed RAM per CLB stores protocol state variables and frame buffers without external SRAM.

Use Scenario: Generating three-phase PWM waveforms with dead-time insertion and fault monitoring for BLDC drivers.

IC Role / Device Role / Timing Role: Timing-critical combinatorial and sequential logic synchronizes gate drivers and monitors current sense inputs.

Use Value: 6 ns CLB delay and register-rich architecture meet sub-microsecond timing constraints for 20 kHz PWM switching.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC2S150-6FGG256C150,000 system gates, 1,368 logic cells, same package and I/O countSuitable for lower-gate-count designs with identical footprint and pinoutSelect when logic resource usage is below 75 % of XC2S200-6FGG256C capacity to reduce cost
XC3S200-4PQ208CSpartan-3 family, 200,000 gates, 48 I/O pins, PQ208 packageHigher logic utilization efficiency but fewer I/Os and different pinoutChoose only if migrating to newer architecture with DSP slices and larger block RAM; not pin-compatible

Compared with XC2S150-6FGG256C and XC3S200-4PQ208C, the XC2S200-6FGG256C offers optimal balance of I/O count, logic density, and timing performance for industrial interface and control applications requiring 112 pins and deterministic 6 ns path delays.

Availability

XC2S200-6FGG256C is available at Aetrix Electronics and suitable for industrial automation, communications infrastructure, and motor control applications requiring stable component supply and long-term obsolescence management.

Supply support for XC2S200-6FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of legacy FPGA families including Spartan-II. The company specializes in adaptive computing platforms for data center, AI, and embedded systems.

The Spartan-II product line was designed for cost-sensitive, high-volume digital logic replacement in industrial and communications equipment, emphasizing I/O flexibility, predictable timing, and ease of configuration.

FAQ

What is the core supply voltage requirement for XC2S200-6FGG256C?

The XC2S200-6FGG256C requires a 2.5 V ± 5 % core supply (VCCINT) for proper operation of its internal logic and CLBs. Deviation beyond this tolerance may cause timing violations or functional failure. This voltage must be well-regulated and decoupled close to the device's power pins. The XC2S200-6FGG256C does not support 3.3 V core operation.

Does XC2S200-6FGG256C support JTAG programming?

Yes, the XC2S200-6FGG256C fully supports IEEE 1149.1 JTAG boundary-scan for in-system programming and debugging. Its TCK, TMS, TDI, and TDO pins enable configuration without external PROMs. The XC2S200-6FGG256C also allows JTAG-based verification of interconnect integrity on assembled PCBs.

What I/O standards are supported by XC2S200-6FGG256C?

The XC2S200-6FGG256C supports LVCMOS 3.3 V, LVTTL, and PCI-compliant 3.3 V I/O standards. Each I/O bank is independently configurable for voltage and drive strength. The XC2S200-6FGG256C does not support 1.8 V or 2.5 V I/O standards on its I/O pins.

How many global clock lines does XC2S200-6FGG256C provide?

The XC2S200-6FGG256C provides eight dedicated global clock buffer resources (GCK0–GCK7), each driving a low-skew clock network across the entire die. These are essential for meeting tight setup/hold timing constraints in synchronous designs. The XC2S200-6FGG256C does not offer additional regional or local clock routing alternatives to these eight global lines.

Is XC2S200-6FGG256C still in active production?

The XC2S200-6FGG256C is no longer in active production by AMD/Xilinx but remains available through authorized distributors and Aetrix Electronics' extended lifecycle program. Aetrix maintains traceable inventory and offers obsolescence mitigation support for the XC2S200-6FGG256C in industrial and legacy systems.

XC2S200-6FGG256C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-II
Package/Case:
256-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
176
Number of Gates:
200000
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FBGA (17x17)

XC2S200-6FGG256C FAQ

1.How can I place an order for XC2S200-6FGG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2S200-6FGG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2S200-6FGG256C reliable?

The price and inventory of XC2S200-6FGG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S200-6FGG256C is usually 5 days.

3.What payment methods are accepted for XC2S200-6FGG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S200-6FGG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2S200-6FGG256C?

XC2S200-6FGG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2S200-6FGG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2S200-6FGG256C?

For technical support, including XC2S200-6FGG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S200-6FGG256C requirements.

6.How does Aetrix verify that XC2S200-6FGG256C is sourced from the original manufacturer or authorized distributors?

All XC2S200-6FGG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S200-6FGG256C meets industry standards.

7.What is the process for return or replacement of XC2S200-6FGG256C?

All XC2S200-6FGG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S200-6FGG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2S200-6FGG256C part is unused and in its original packaging.

Return procedure for XC2S200-6FGG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2S200-6FGG256C Tags

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