AMD XC2S200-6FGG456C

Overview

XC2S200-6FGG456C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 200,000 system gates, 1728 logic cells, and a 6 ns maximum input-to-output delay. It features 176 user I/O pins in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at 3.3 V supply voltage. This device is used in industrial control logic, digital video interface bridging, and reconfigurable data acquisition systems.

For engineers reviewing the XC2S200-6FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade (-6), FBGA456 thermal and routing constraints, and compatibility with Xilinx ISE design tools and JTAG configuration interfaces.

Technical Context

The XC2S200-6FGG456C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM up to 56 kbits, and up to 12 embedded multipliers for arithmetic-intensive tasks. Its SelectIO technology supports LVCMOS, LVTTL, PCI, and SSTL-2 I/O standards with programmable slew rate and drive strength.

Configuration is performed via IEEE 1149.1 JTAG boundary-scan or master/slave serial mode using external PROM. The -6 speed grade guarantees timing performance across commercial temperature range (0°C to 85°C) with 3.3 V core and I/O supply.

Key Specifications

Pinout & Package

XC2S200-6FGG456C is housed in a 456-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch, 23×23 array, and thermal pad. Pinout follows Xilinx Spartan-II standard mapping with dedicated configuration, clock, and JTAG pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic implementation applications.

Compared with XC2S200-6FGG456C, XC2S150-6FG456C offers cost reduction at the expense of logic headroom, while XC3S200-4PQ208C trades FBGA density and multiplier capability for easier prototyping and higher I/O drive - neither is pin-compatible, and both require toolchain and constraint file updates.

Availability

XC2S200-6FGG456C is available at Aetrix Electronics and suitable for industrial motion control, digital video interface bridging, and data acquisition systems requiring stable component supply and long-term obsolescence management.

Supply support for XC2S200-6FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for heterogeneous compute acceleration.

The Spartan-II product line was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with predictable timing and industrial temperature operation - targeting control, interface, and signal preprocessing roles.

FAQ

What is the configuration method supported by XC2S200-6FGG456C?

XC2S200-6FGG456C supports master serial, slave serial, and JTAG configuration modes. It loads configuration bitstreams from external PROM or microcontroller via dedicated CCLK and DIN pins, or through IEEE 1149.1 JTAG interface. The DONE pin confirms successful initialization, and PROGRAM_B allows runtime reconfiguration. All methods are documented in the Xilinx Spartan-II Platform FPGA User Guide.

Does XC2S200-6FGG456C support differential I/O standards like LVDS?

No, XC2S200-6FGG456C does not support native LVDS or other differential signaling standards. Its SelectIO structure supports only single-ended standards including LVCMOS, LVTTL, PCI, and SSTL-2. For differential signaling, users must implement external termination or use later Spartan families such as Spartan-3E or Spartan-6 that include dedicated differential I/O buffers.

What is the maximum operating frequency of internal clock networks in XC2S200-6FGG456C?

The XC2S200-6FGG456C supports global clock networks with guaranteed routing to all CLBs. While no fixed maximum clock frequency is specified, timing analysis in Xilinx ISE shows achievable system clock frequencies up to 120 MHz for fully pipelined designs meeting the -6 speed grade constraints. Actual performance depends on logic depth, placement, and routing congestion.

Can XC2S200-6FGG456C be used in automotive applications?

XC2S200-6FGG456C is rated for commercial temperature range (0°C to +85°C) and is not qualified to AEC-Q100 or automotive reliability standards. It lacks extended temperature screening, enhanced ESD protection, and automotive-grade qualification documentation. For automotive use, Xilinx recommends Spartan-3A or later families with industrial or automotive variants.

Is there a replacement or migration path from XC2S200-6FGG456C?

AMD/Xilinx does not provide a direct pin-compatible replacement for XC2S200-6FGG456C. Migration paths include Spartan-3E (e.g., XC3S250E-4PQ208C) for enhanced features or Spartan-6 (e.g., XC6SLX25-2CSG324C) for higher density and integrated memory controllers. Each requires full HDL redesign, new constraints, and toolchain updates due to architectural differences.